The smart evolution of Bluetooth module from Panasonic

Panasonic has announced the release of PAN1783, a Bluetooth 5.4 Low Energy (LE) module that follows the PAN1780. Building upon the success of its predecessor, the PAN1780, the PAN1783 sets new standards in performance, versatility, and efficiency.

According to Tomislav Tipura, Product Manager at Panasonic Industry Europe’s IoT Department, “the PAN1783 represents a significant leap forward in Bluetooth technology, offering unparalleled features and capabilities to meet the evolving needs of our customers.”

Being as compact as 15.6 x 8.7 mm, the PAN1783 is one of the smallest nRF5340 module currently available in the market. It is powered by the Nordic nRF5340 single-chip controller, boasting isochronous channels for LE audio support. This module is available with both an on-board chip antenna and an RF-bottom pad, providing flexibility to suit various design requirements – CE RED, FCC, UKCA und ISED certificates included!

Featuring Bluetooth 5.4 enhancements, including isochronous channels, LE audio, and support for high-throughput of 2 Mbps, advertising extensions, and long range, the PAN1783 delivers exceptional performance, according to Panasonic. Its all-in-one System-on-Chip (SoC) design combines the best features of the nRF52 Series with increased performance and memory, all while minimising power consumption. The improved sensitivity of the nRF5340, coupled with the LE coded PHY, makes the PAN1783 an attractive choice for a wide range of applications, including advanced computer peripherals, I/O devices, wearables, and wireless audio devices. Moreover, its ultra-low current consumption makes it ideal for battery-powered devices, extending operational lifespans.

Equipped with two Cortex-M33 processors – one as an application processor and the other as a network processor – the PAN1783 offers seamless integration and standalone operation. This eliminates the need for an external processor, simplifying design, reducing space requirements, and ultimately helps lowering costs for manufacturers.

In addition to its Bluetooth capabilities, the PAN1783 supports angle of arrival (AoA) and angle of departure (AoD) direction finding, enhancing location-based services and applications. Furthermore, it also supports Type 2 Near Field Communication (NFC-A), facilitating simplified pairing and payment solutions when used with an external antenna.

https://industry.panasonic.eu

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New Silicon Labs Wi-Fi 6 plus Bluetooth modules for embedded IoT applications

Mouser is now shipping the new SiWx917Y wireless modules from Silicon Labs. The SiWx917Y wireless modules provide ultra-low-power Wi-Fi 6, Bluetooth® Low Energy (LE) 5.4, and Matter connectivity for a host of embedded, battery-powered IoT devices in smart homes, consumer, industrial, and healthcare applications.

The Silicon Labs SiWx917Y series are fully integrated, shielded modules with a dedicated wireless processing subsystem, an application processing subsystem (MCU), and an advanced security engine. They have a rich set of peripherals framed by an intelligent power management subsystem that includes an antenna (or RF-pin) and worldwide RF regulatory certifications, simplifying development and certification processes.

The SiWx917Y modules’ processing subsystem consists of a network wireless processor (160MHz), baseband digital signal processing, an analog front end, a 2.4 GHz RF transceiver, and a power amplifier. The application processing subsystem features an ARM Cortex-M4 with FPU at 180 MHz, a large, embedded SRAM, Flash, PSRAM, and an option for external Flash/PSRAM. The modules come with modular radio-type approvals for various countries, including the US (FCC), Canada (IC/ISED) and Japan (MIC), and follow the relevant EN standards (including EN 300 328 v2.2.2) for conformity with directives and regulations in EU and UK.

https://eu.mouser.com

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Mouser sponsors 2025 global Create the Future Design contest to reward engineering innovation

Mouser has announced it is once again a Platinum sponsor of the Create the Future Design Contest. Create the Future is a global challenge to engineers and innovators around the world to design the next great thing for a chance to win the grand prize. Mouser, which has sponsored the contest for over a decade, is joined again by valued manufacturers Intel and Analog Devices as co-sponsors.

The contest opens for entries on March 3 and closes on July 1, 2025. The grand prize winner receives worldwide recognition and a cash prize of $25,000 for an innovative product that benefits society and the economy. Previous contests have produced more than 15,000 design ideas from engineers, entrepreneurs and students in more than 100 countries.

“Fostering technical innovation has always been a major part of our mission at Mouser,” said Kevin Hess, Mouser Electronics Senior Vice President of Marketing. “We are very excited to again participate in this important event for engineers and students around the world.”

“Mouser Electronics is well-known throughout the industry for its support of innovation among engineers as well as for providing unmatched service to its customers and manufacturers,” said Joseph Pramberger, President of SAE Media Group. “We are pleased to partner with such quality companies as Mouser and its manufacturers, Intel and ADI.”

The Create the Future Design Contest brings attention to product designs that enhance humanity, improve healthcare quality or help provide sustainable solutions. Previous grand prize-winning entries include self-destroying plastics, a self-contained organ and limb transport device, and an economical, rapid screening device to prevent food-borne illness.

The grand prize winner will be chosen from the winners in seven entry categories: Aerospace and Defence, Automotive/Transportation, Electronics, Manufacturing and Materials, Medical, Robotics and Automation, and Energy, Power & Propulsion.

For more information, visit https://www.mouser.com/createthefuture

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Synaptics launches ultra-low-power Wi-Fi/Bluetooth SoC family for embedded Edge AI IoT

Synaptics has extended its Veros Triple Combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0 and Bluetooth Low Energy (BLE), and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for the embedded Edge AI Internet of Things (IoT), the SYN461x is optimised for power, system integration, size, and rapid time to market while delivering rate-over-range performance and seamless interoperability. The versatile Matter-compliant SoCs offer advanced Bluetooth features, such as Channel Sounding and LE Audio—including Auracast. The SYN461x specifically targets consumer and industrial applications and is tailored for devices such as wearables, smart watches, audio speakers and headsets, home appliances, security cameras, asset trackers, and factory automation.

Launched in 2024, Veros encompasses Synaptics’ entire wireless portfolio of solutions characterised by performance, interoperability, coexistence, power efficiency, and bill of materials integration. Veros features built-in support for Synaptics Astra, the AI-Native compute platform for the IoT.

“The SYN461x family is a breakthrough addition to our Veros portfolio,” said Vineet Ganju, VP of Wireless Product Marketing at Synaptics. “The SoCs are our first in a series designed from the ground up for ULP embedded Edge AI IoT applications. We believe their low-power architecture, software support, and low-density packaging extend our broad-market reach and position us to share in a ~$3.2 billion market opportunity.

“The degree of versatility required to meet the unique connectivity needs of the diaspora of diverse low-power IoT applications demands a high degree of domain expertise,” said Phil Solis, Research Director at IDC. “Ultra-low-power and highly flexible solutions such as the SYN461x make a solid case for discrete, targeted, wireless SoCs in markets where more options are needed.”

The SYN461x family extends Synaptics’ Triple Combo series into ULP, highly optimised IoT applications where it delivers reliable connectivity of up to 50 Mbps while extending battery life and maximising range. Features include:

● Up to tri-band 1×1 Wi-Fi support across 2.4, 5, and 6 GHz with power-optimised architecture
● Low-power Bluetooth/BLE—with Channel Sounding for precise distance measurement
● IEEE 802.15.4 (Thread/Zigbee) with Matter support for seamless interoperability across popular low-power networks
● Integrated Tx/Rx switch, LNAs, and PAs that reduce area BOM and system cost while simplifying design by only requiring a direct antenna connection
● Low-pin-count WLBGA package option for low-cost, plated-through-hole (PTH) PCBs (25% reduction in typical board cost)
● An integrated processor that offloads the host application processor to help minimise system power consumption
● Secure Boot to help ensure system integrity

https://www.synaptics.com

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