MCUs are validated for security, says NXP

Tue, 24 November

Harwin introduces multi-contact, high current power connector

Tue, 24 November

Trio to develop secure automotive platform

Mon, 23 November

PIC18 Q84 family transmits-receives data through CAN FD

Thu, 19 November

Integrated modules simplify IEEE 1588 integration

Tue, 17 November

Automotive -grade proximity sensors prevent false triggers

Tue, 17 November

Wi-Fi 4 chip delivers next-generation WPA3 security

Mon, 16 November

Intelligent IOLINK actuator reduces power by more than 50 per cent

Mon, 16 November

TrustAnchor provides simple path to automotive network security

Thu, 12 November

Scalable AI SMARC SoM combo targets HMI and embedded vision

Thu, 12 November

Reference design for ToF lidar supports range finding for precision robotics

Tue, 10 November

MEMS humidity sensor is designed for long term stability

Mon, 09 November

Panel PC PCap HMIs have multi-touch operation    

Tue, 03 November

Accelerator card by Untether AI delivers up to two Peta OPS for AI inference

Fri, 30 October

Pre-certified modules accelerate time to market, says Silicon Labs

Thu, 29 October

Xilinx introduces Zynq RFSoC DFE for mass 5G radio deployments

Wed, 28 October

Integrated ToF module is multi-zone

Wed, 28 October

MegiQ’s RF and microwave development tools are exclusive to Farnell

Wed, 28 October

NEC and Analog Devices team up to design 5G radio unit for Rakuten Mobile

Mon, 26 October

Temperature compensated RTC has I2C interface

Thu, 22 October