Chipsets provide connectivity for automotives

Introducing the SkyOne Ultra 3.0, Skyworks is expanding its SkyOne cellular platform, with devices that are scalable to meet 5G radio standards. The chipsets target automotive applications.

The portfolio delivers robust, low latency, high bandwidth LTE connectivity with extended operating temperature ranges and production lifetimes, claims Skyworks. The portfolio exceeds LTE CAT 16 requirements, is scalable to 5G radio standards and supports all global cellular bands. Compatibility with all leading chipset providers and a simplified compliance process means that these integrated architectures are can reduce design complexity as well as time to market.

“With the introduction of SkyOne® Ultra 3.0 for automotive, Skyworks is enabling the full benefit of high-speed data and real-time communication in the connected car,” said Joel King, senior vice president and general manager of mobile solutions for Skyworks. “At a higher level, in-vehicle technologies and rapidly changing standards are being adopted at a pace previously unheard of in the automotive industry – particularly with the advent of 5G and the move toward autonomous driving.”

SkyOne Ultra 3.0 incorporates the key analogue and RF functionality in both transmit and receive paths of LTE communications. Transmit devices contain power amplifier modules with SkyBlue technology for improved efficiency, as well as integrated duplexers (PAMiDs), low noise amplifiers (LNAs) and antenna switches.

Diversity receive (DRx) modules combine the necessary components within the LTE receive path including LNAs, filters and antenna switches.

Package size is less than 40 x 40mm; this is a critical element in meeting automotive-qualified network attached device (NAD) reliability requirements, points out Skyworks. Connectivity engines can be regionally optimised for North America, Europe and China.

The SkyOne Ultra 3.0 series is made up of the SKYA230xx front-end modules with SkyBlue enabling technology, LNAs and integrated duplexers, the SKYA220xx suite of power amplifiers, the SKYA250xx DRx and MIMO modules and the SKYA21xxx, discrete switches and LNA products.

Embedded navigation systems, diagnostic capabilities, personalisation services and other smart features are fuelling consumer demand for connected cars. IHS Markit forecasts that worldwide sales will increase from 24 million units in 2015 to more than 72 million by 2023. In eight years, nearly 70 per cent of the passenger vehicles sold will be transmitting data with external sources, to offer new services, revenue streams and business models to automotive markets.

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Digital input ICs halve footprint and lower power

To meet the size, power and performance requirements of Industry 4.0, Maxim Integrated has added to its family of digital input devices.

One, the MAX22192, is integrated into the company’s new Go-IO programmable logic controller (PLC) reference design.

Increased automation means a need for real-time decision-making and feedback-loop mechanisms. These intelligent Industry 4.0 systems require digital input ICs inside the PLCs to receive on/off status signals. They must also be robust, high performing and robust for integration throughout manufacturing environments.

Maxim’s expanded portfolio of IEC61131-2-compliant digital input devices is claimed to offer the industry’s smallest solution size (by as much as 50 per cent), the lowest power dissipation (by as much as 60 per cent), and is up to six times faster and has the most robust performance (integrating 1kV of surge protection and integrated diagnostics).

The family also includes a parasitically powered digital input that reduces power dissipation by up to 60 per cent and does not require a discrete isolated power supply.

The digital input devices available from Maxim are the MAX22190 eight-channel octal digital input with serial peripheral interface (SPI), accurate input current limiters, built-in surge protection of more than 1kV and wire break detection in a 5.0 x 5.0mm package.

The MAX22191 single-channel, parasitically powered digital input with accurate input current limiters and 250ns (max) propagation delay is in a 2.8 x 2.9mm package; the

MAX22192 eight-channel octal digital input with isolated SPI, wire break detection and accurate input current limiters in a 6.0 x 10mm package.

The MAX22195 high-speed octal digital input ICs have parallel output and accurate input current limiters, 300ns (max) propagation delay, parallel interface, low power, low heat dissipation, fault tolerance with built-in diagnostics, configurability and a robust design in a 5.0 x 5.0mm 32-TQFN package.

These ICs join the MAX14912 and MAX14913 octal high-speed, switch/push-pull driver with integrated surge protection, diagnostics and fast/safe demagnetisation, the MAX14914 universal digital IO with surge protection, high-side switch/push-pull driver/digital input and an SPI and the MAX14483 six-channel, high-density, high-speed, low-power digital isolator optimised for daisy chained SPI applications.

Evaluation kits (MAX22190, MAX221919, MAX22192 and MAX22195) are also available.

Visit Maxim at electronica 2018 in Hall C4, Stand 440.

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TI introduces multiprotocol Sitara processors for industry 4.0

Industrial-grade Sitara AM6x processors from Texas Instruments (TI) offer advanced industrial communications, enhanced security, high reliability and functional safety features.

Claimed to be the industry’s first multiprotocol Gbit time-sensitive networking (TSN)-enabled processor family, the Sitara AM6x processor family provides industrial-grade reliability, with quad and dual Arm Cortex-A53 core variants. They have been created to meet the rapidly evolving needs of industry 4.0 in factory automation, motor drives and grid infrastructure, says TI.

Supporting Gbit throughput rates for TSN standards and other industrial protocols in a specific subsystem, the Sitara AM6x processors anticipate the convergence of both Ethernet and real-time data traffic on a single network. This capability is critical for real-time communication in industry 4.0 applications and enables software-reconfigurable cyber physical systems in factories, notes TI. The Gbit industrial communications subsystem (PRU-ICSS-Gb) supports multiple industrial Ethernet protocols including TSN, EtherCAT, Ethernet/IP and ProfiNet and provides the flexibility to support the evolving needs of industrial communications.

The inclusion of an on-chip isolated dual-core microcontroller subsystem enables designers to use the AM6x processors to create more dependable and functional safety-certifiable products, while reducing overall system-level complexity for applications including PLCs and multi-axis motor drives. Comprehensive support for error correcting code (ECC) memory protection for both on-chip memory and external DDR memory and for  100,000 power on hours (PoH) at a 105 degrees C junction temperature (TJ) operation enable AM6x processors to perform in high-reliability applications. The Sitara AM6x processor family can be scaled to fit system needs, with pin-compatible processors operating in a unified software platform. The processors are supported by the processor software development kit (SDK), which allows customers to seamlessly reuse and migrate Android, Linux and TI-RTOS software across TI processor families.

The integrated processors offer enhanced on-chip security, with secure boot, secure storage and smart crypto engines. The integrated 3D graphics enable human machine interface (HMI) and industrial PC applications.

Pre-production samples of AM6548 processors are available to order The AM65x industrial development kit (IDK) (TMDX654IDKEVM) and AM65x evaluation module (EVM) (TMDX654GPEVM) are also available.

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600V GaN FET supports applications up to 10kW

Claimed to double power density in industrial and telecomms applications, the LMG341x family of high-voltage GaN FETs has been announced by Texas Instruments.

The 600V GaN FETs of 50 and 70-mOhm power stages support applications from sub 100W to 10kW. The FETs enable designers to create smaller, more efficient and higher-performing designs compared to silicon FETs in AC/DC power supplies, robotics, renewable energy, grid infrastructure, telecomms and personal electronics applications.

The LMG341x family devices provide an alternative to traditional cascade and standalone GaN FETs by integrating functional and protection features to simplify design, says TI. This enable greater system reliability and optimisation of the performance of high-voltage power supplies. With integrated current limiting of up to 100 nanoseconds and over-temperature detection, the devices protect against unintended shoot-through events and prevent thermal runaway. System interface signals enable a self-monitoring capability.

TI’s integrated GaN power stage doubles power density and reduces losses by 80 per cent compared to silicon MOSFETs, explains TI. Each device is capable of fast, 1MHz switching frequencies and slew rates of up to 100V/nanoseconds.

The family of GaN FETs is backed by 20 million hours of device reliability testing, including accelerated and in-application hard switch testing.

The LMG3410R050, LMG3410R070 and LMG3411R070are available now in 8.0 x 8.0mm split-pad, quad flat no-lead (QFN) packaging.

Visitors to the Texas Instruments stand C4-131 at electronica (13 – 16 November at Messe Munchen, Germany) will see a 10kW cloud-enabled grid link demonstration, jointly developed by TI and Siemens. The demonstration uses TI’s LMG3410R050 600V GaN FET with integrated driver and protection, enabling engineers to achieve 99 per cent efficiency and up to 30 per cent reduction in power component size compared to a traditional silicon design.

Texas Instruments is a semiconductor design and manufacturing company that develops analogue integrated circuits (ICs) and embedded processors.

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