Infineon at TRUSTECH 2025: Future-proof payment and ID solutions for a digital, connected world

At TRUSTECH Infineon will showcase its latest solutions that are shaping the future of secured digital interactions. From December 2 to December 4, at booth F025 in Pavilion 5.2, Infineon will present a range of future-ready products designed to power a connected, digital world. Highlights include:

Post-Quantum Cryptography (PQC) is essential today to safeguard data against tomorrow’s quantum threats. Infineon has reached a key milestone with its TEGRION SLC27 security controller: its Common Criteria EAL6+ certification now includes a fully approved cryptographic library featuring the PQC algorithms ML-KEM and ML-DSA. This milestone has been recognised with the nomination of TEGRION SLC27 for the TRUSTECH Innovation Award, which will be presented on December 2. At the trade show, Infineon will demonstrate the TEGRION SLC27’s advanced capabilities, including PQC implementation. Additional highlights include Thales’ newly certified MultiApp 5.2 Premium PQC smartcard and Eviden’s proven GreenShield end-to-end encryption software.

Infineon ID Key S USB enables easy and secured access and identity management, fully aligned with industry standards such as FIDO (Fast Identity Online). Paired with Infineon’s SECORA ID Key platform, it combines hardware and software to deliver a comprehensive, flexible security solution. Its integrated USB interface, in addition to NFC support, adds an extra layer of convenience and versatility. The platform’s open architecture empowers customers to develop customised solutions, accelerating time-to-market.

SECORA ID demonstrates how traditional electronic ID (eID) documents can complement mobile ID solutions. Acting as a secured root of trust, the platform enables reliable and scalable deployment of digital identities in real-world environments. Visitors can explore how mobile and physical ID credentials work together to enhance user convenience and security. In collaboration with PAV Card GmbH, a live demo of the Multi-Trust Smartcard based on SECORA ID will showcase how secured access to healthcare systems can be maintained even during network outages, allowing patient safety and operational continuity in critical environments.

SECORA Pay M is the latest addition to Infineon’s SECORA Pay solution family, enabling fast, efficient payments and secured authentication. The pioneering platform offers a one-stop solution that supports multiple use cases, including EMV (MasterCard and VISA) payment, Tap-to-X use cases and FIDO authentication – allowing users to access a wide range of services from a single device. By integrating FIDO, SECORA Pay M enhances the security and user experience of e-commerce and online banking, staying ahead in payment and authentication technologies.

SECORA Pay Green is paving the way for a more sustainable future in the payment industry. The innovative eCoM module integrates a contactless antenna directly into the module to reduce CO₂ emissions by over 60% related to the sourcing and logistics of the raw materials (security chip and module) for card production, as reported by Climate Partner. SECORA Pay Green has been recognised with the TRUSTECH innovation award 2024 and was added to Mastercard’s Card Eco Certification program recently. The solution enables fully recyclable card bodies, setting a new benchmark for environmentally responsible payment technologies.

SECORA Pay Bio enhances convenience and trust in biometric contactless payments. This all-in-one solution extends Infineon’s proven SECORA Pay turnkey family to meet the user demand for fast and secured payment experiences. It enables scalable, high-volume production of robust and reliable biometric payment cards, delivering a seamless user experience. SECORA Pay Bio supports a variety of enrolment methods, including sleeves, smartphone apps, and in-field enrollment.

The pop-up nail salon returns to TRUSTECH in collaboration with Smart Chip and Digiseq. A nail care professional will apply a smart chip with integrated payment functionality directly to the fingernail, enabling seamless contactless payments. The Smart Chip is a multifunctional inlay that is permanently attached to the fingernail powered by Infineon’s SECORA Pay solution family.

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ST reveals new NB-IoT modules for cellular connectivity

STMicroelectronics has introduced two new ST87M01 NB-IoT wireless modules and revealed an enhanced development ecosystem designed to facilitate the creation of smart IoT solutions with narrowband cellular connectivity. Typical applications include smart logistics, environmental monitoring, smart lighting, smart parking, industrial condition monitoring, livestock and pet tracking, alarms, and remote healthcare.

Existing modules in the ST87M01 family are already installed in smart meters deployed throughout Europe, helping utilities capture real-time granular data to meet environmental and operational goals. “We are now taking the next step to make our module technology and fully owned, resilient supply chain accessible across a wider variety of markets and environments. This all-in-one solution combines industry-leading compactness and ultra-low power consumption with reliability and security, enabling scalable and secure IoT deployments,” said Domenico Arrigo, General Manager, Application Specific Analog Product Division, STMicroelectronics.

The two new modules include the ST87M01-1001, supporting NB-IoT narrowband cellular data connectivity, and the ST87M01-1301 which adds GNSS and Wi-Fi positioning capabilities for outdoor and indoor geolocation. The EVKITST87M01-2 evaluation kit is a comprehensive development platform with a ready-to use Conexa IoT SIM card and two SMA antennas, for prototyping and testing NB-IoT connectivity in real-world applications. ST’s expanded ecosystem also includes the “Easy-Connect” software library and design examples.

ST’s “Easy-Connect” library helps developers to quickly communicate with the module, configure and exercise the NB-IoT, GNSS, and Wi-Fi functionalities, and exchange data with the cellular network, over a C-like, totally hardware agnostic, and OS independent platform. The IoT SIM card provides 50MB of data, valid for 6 months after user activation, through the Conexa network. Operated by ST Authorised Partner Wireless Logic, Conexa supports NB-IoT connectivity across many international markets, with this SIM specifically configured for use in Europe, Middle East, and Africa (EMEA).

“Wireless Logic’s cellular connectivity, included free of charge with ST’s latest NB-loT module evaluation kits, provides the easiest and fastest way to connect and develop prototypes,” commented John Dillon, Product and Marketing Managing Director, Wireless Logic. “Our Conexa IoT network and management platforms provide extensive geographical coverage and ensure resilient and future-proof NB-loT connectivity.”

The Virtual Antenna technology from Ignion, alongside its seven different antenna components and Oxion AI-powered integration platform of RF projects, helps customers select and design-in the right Virtual Antenna chip to meet size, performance, and bill-of-materials constraints. Using Oxion’s antenna integration platform, ST87M01 developers can trial shortlisted antennas, apply best practices, and quickly iterate their designs to fine-tune performance.

Jaap Groot, CEO of Ignion, said, “Our Virtual Antenna® and Oxion™ AI-powered platform solutions make RF design simpler, faster, and more predictable, giving engineers confidence and control throughout development. Working closely with ST, we’ve brought this capability to the new ST87M01 modules, reflecting our shared commitment to deliver integrated, ready-to-scale wireless solutions that help customers save time and focus on what matters most: innovation.”

DAOS can optionally support ST customers throughout system development, from hardware and software design to production, accelerating time-to-market and unlocking the potential of the ST87M01 module in IoT projects.

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ST launches three-in-one motion sensor for industrial IoT applications

ST has revealed the ISM6HG256X, a tiny three-in-one motion sensor for data-hungry industrial IoT applications, serving as an additional catalyst for edge AI advancement. This smart IMU sensor uniquely combines simultaneous detection of low-g (±16g) and high-g (±256g) accelerations with a high performance and stable gyroscope within a single compact package, ensuring no critical event—from subtle motion or vibrations to severe shocks—is ever missed.

The ISM6HG256X addresses the growing demand for reliable, high-performance sensors in industrial IoT applications such as asset tracking, worker safety wearables, condition monitoring, robotics, factory automation, and black box event recording. By integrating accelerometer with dual full-scale ranges, it eliminates the need for multiple sensors, simplifying system design and reducing overall complexity. Its embedded edge processing and self-configurability support real-time event detection and context-adaptive sensing, which are essential for long lasting asset tracking sensor nodes, wearable safety devices, continuous industrial equipment monitoring, and automated factory systems.

Edge AI is a crucial driver for ST’s MEMS activity as it boosts performance and efficiency by enabling real-time data processing on the device, reducing latency and energy use. It enhances privacy and security through local data handling, limits reliance on external processing, and provides scalability and flexibility for various applications. Additionally, edge AI supports innovative uses like advanced sensing and IoT integration, aligning with growing demand for smart, connected devices.

The ISM6HG256X contains the unique machine-learning core (MLC) and finite state machine (FSM), together with adaptive self-configuration (ASC) and sensor fusion low power (SFLP). These features bring edge AI directly into the sensor to autonomously classify detected events, ensuring real-time, low-latency performance and ultra-low system power consumption. This embedded technology can reconstruct signal dynamics to provide high-fidelity motion tracking. Thanks to the embedded SFLP algorithm, also 3D orientation tracking is possible with just few µA of current consumption.

ST’s new X-NUCLEO-IKS5A1 industrial expansion board with MEMS Studio design environment and software libraries, X-CUBE-MEMS1, are available to assist developers, helping implement functions including high-g and low-g fusion, sensor fusion, context awareness, asset tracking, and calibration.

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u-blox introduces the NORA-B27 Bluetooth LE module

u-blox has introduced the NORA-B27, the latest addition to their NORA-B2 family of Bluetooth Low Energy modules. Designed with u-connectXpress for scalability and ease of integration, the NORA-B27 provides a cost-optimised solution ideal for battery-powered, high-volume IoT applications such as sensor hubs, beacons, cable-replacement links, and mobile device companions.

Built on Nordic Semiconductor’s nRF54L05 chipset and pre-flashed with u-blox u-connectXpress software, the NORA-B27 streamlines wireless integration through a familiar AT-command interface—minimising the need for deep Bluetooth expertise. This enables faster prototyping and time-to-market while maintaining performance, security, and low power consumption.

Qualified against Bluetooth Core 6.0 and for industrial temperature ranges from −40 °C to +85 °C, the NORA-B27 delivers stable and secure connectivity in demanding environments across diverse markets, including industrial automation, smart buildings, healthcare, and asset tracking.

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