Wearable

Mouser has announced a new eBook, in collaboration with Analog Devices, Inc. (ADI) and Molex, that explores the forefront of miniaturisation trends shaping our future.

Across nearly all industries, engineers are being asked to deliver more compact designs for a wide range of purposes. Whether they are wearables for consumers and healthcare, instrumentation advances, or industrial automation solutions, today’s systems are expected to occupy less space and consume less power without sacrificing performance or reliability. In 11 Experts on Miniaturised Electronics Design and Applications, engineers from ADI, Molex, and other companies discuss the many challenges designers face while working towards system miniaturisation. The eBook also highlights several products, available at Mouser, that both ADI and Molex offer to support this transition through advances in integration, packaging, and interconnect design.

The EVAL-ADAQ4224-FMCZ evaluation board provides a demonstration and development platform for ADI’s ADAQ4224 μModule Data-Acquisition (DAQ) System-in-Package (SiP) solution. The ADAQ4224 DAQ integrates the critical passive components required in a data acquisition solution into a single component, using ADI’s iPassives technology, minimising temperature-dependent error sources and offering optimised performance.

The EVAL-AD3530RARDZ evaluation board enables prototyping with ADI’s AD3530 and AD3530R Digital-to-analog converters (DACs). The AD3530 and AD3530R DACs include integrated multiplexers that facilitate monitoring of output voltages, currents, and internal die temperature. The devices incorporate power-on reset (POR) circuits that ensure the DACs output power up to and present at 32kΩ to ground until a valid write is executed. The AD3530R also offers a 2.5V, 5ppm/°C internal reference that is disabled by default.

The Quad-Row board-to-board connectors from Molex feature a staggered circuit layout and a 0.175 mm pitch low-profile design for 30% space savings over conventional connectors. These patent-pending connectors offer product developers and device manufacturers greater freedom and flexibility to support compact form factors, making them ideal for augmented reality/virtual reality automotive, communications, IoT, and other space-constrained applications.

The Molex Easy-On FFC/FPC Connectors are ideal for tight packaging applications and offer an overall compact size for maximum space savings, along with contact assurance and easy operation. These connectors are provided in pitch sizes from 0.20 to 2.00 mm, circuit sizes from 2 to 96, and with actuator types that include front flip, back flip, slider, one-touch and low-insertion force, in a right-angle or vertical orientation.

To read the new eBook, visit https://resources.mouser.com

Farnell is now distributing connectivity solutions from Digi International, a leading global provider of Internet of Things (IoT) connectivity products, services and solutions.

The new relationship is an expansion of Avnet’s existing relationship with Digi and will enhance Farnell’s wireless communications portfolio. It will also enable Digi to utilise the “power of one,” which is the combined strength of Farnell and its parent company Avnet across the product lifecycle. With Avnet and Farnell, customers will be able to find the best solution for their needs around the globe.

Digi International supplies secure embedded technology and connectivity such as system-on-modules, wireless communication systems, and cloud management software to developers in a diverse range of industries, including education, energy, industrial, medical, retail, smart cities and transportation. In every case, it is committed to ensuring that each customer is provided with precisely the right technology for their wireless connectivity requirements.

Steve Ericson, Senior Vice President and General Manager of Digi OEM Solutions said, “We are very excited about leveraging the combined power of both Farnell and Avnet and look forward to expanding our customer base by leveraging Farnell’s expertise and global reach. We have always looked to partner with like-minded companies to ensure our customers have an ecosystem of options that seamlessly integrate, extend value, and bring the future of IoT communications to drive their business.”

Digi’s featured technologies include a range of solutions to support Bluetooth, cellular IoT, edge computing, Fixed Wireless Access, LoRaWAN, 5G, Zigbee Wireless Mesh, and more.

Rebeca Obregon, President, Farnell, said, “We are delighted to grow our distribution relationship with Digi and expand our M2M and IoT product offerings. The alliance will enhance our customer experience, and we look forward to further infusing Digi’s excellent range of solutions with our global distribution presence and marketplace knowledge.

https://uk.farnell.com