ST launches three-in-one motion sensor for industrial IoT applications

ST has revealed the ISM6HG256X, a tiny three-in-one motion sensor for data-hungry industrial IoT applications, serving as an additional catalyst for edge AI advancement. This smart IMU sensor uniquely combines simultaneous detection of low-g (±16g) and high-g (±256g) accelerations with a high performance and stable gyroscope within a single compact package, ensuring no critical event—from subtle motion or vibrations to severe shocks—is ever missed.

The ISM6HG256X addresses the growing demand for reliable, high-performance sensors in industrial IoT applications such as asset tracking, worker safety wearables, condition monitoring, robotics, factory automation, and black box event recording. By integrating accelerometer with dual full-scale ranges, it eliminates the need for multiple sensors, simplifying system design and reducing overall complexity. Its embedded edge processing and self-configurability support real-time event detection and context-adaptive sensing, which are essential for long lasting asset tracking sensor nodes, wearable safety devices, continuous industrial equipment monitoring, and automated factory systems.

Edge AI is a crucial driver for ST’s MEMS activity as it boosts performance and efficiency by enabling real-time data processing on the device, reducing latency and energy use. It enhances privacy and security through local data handling, limits reliance on external processing, and provides scalability and flexibility for various applications. Additionally, edge AI supports innovative uses like advanced sensing and IoT integration, aligning with growing demand for smart, connected devices.

The ISM6HG256X contains the unique machine-learning core (MLC) and finite state machine (FSM), together with adaptive self-configuration (ASC) and sensor fusion low power (SFLP). These features bring edge AI directly into the sensor to autonomously classify detected events, ensuring real-time, low-latency performance and ultra-low system power consumption. This embedded technology can reconstruct signal dynamics to provide high-fidelity motion tracking. Thanks to the embedded SFLP algorithm, also 3D orientation tracking is possible with just few µA of current consumption.

ST’s new X-NUCLEO-IKS5A1 industrial expansion board with MEMS Studio design environment and software libraries, X-CUBE-MEMS1, are available to assist developers, helping implement functions including high-g and low-g fusion, sensor fusion, context awareness, asset tracking, and calibration.

www.st.com

> Read More

u-blox introduces the NORA-B27 Bluetooth LE module

u-blox has introduced the NORA-B27, the latest addition to their NORA-B2 family of Bluetooth Low Energy modules. Designed with u-connectXpress for scalability and ease of integration, the NORA-B27 provides a cost-optimised solution ideal for battery-powered, high-volume IoT applications such as sensor hubs, beacons, cable-replacement links, and mobile device companions.

Built on Nordic Semiconductor’s nRF54L05 chipset and pre-flashed with u-blox u-connectXpress software, the NORA-B27 streamlines wireless integration through a familiar AT-command interface—minimising the need for deep Bluetooth expertise. This enables faster prototyping and time-to-market while maintaining performance, security, and low power consumption.

Qualified against Bluetooth Core 6.0 and for industrial temperature ranges from −40 °C to +85 °C, the NORA-B27 delivers stable and secure connectivity in demanding environments across diverse markets, including industrial automation, smart buildings, healthcare, and asset tracking.

u-blox.com

> Read More

POLYN Technology announces first silicon-implemented NASP chip

POLYN Technology has announced the successful manufacturing and testing of the world’s first silicon-proven implementation of its unique NASP (Neuromorphic Analog Signal Processing) technology.

The NASP platform employs trained neural networks in the analog domain to perform AI inference with much lower power consumption than conventional digital neural processors.

NASP chips with AI cores process sensor signals in their native analog form in microseconds, using microwatt-level power and eliminating all overhead associated with digital operations. This is ideal for always-on edge devices. Application-specific NASP chips can be designed for a diverse range of edge AI applications, including audio, vibration, wearable, robotics, industrial, and automotive sensing.

NASP technology and POLYN’ design tools automatically convert trained digital neural network models into ultra-low-power analog neuromorphic cores ready for manufacturing in standard CMOS processes. The testing confirmed the chip’s parameters strictly match its model.

This first chip contains a VAD core for real-time voice activity detection. It marks the first step toward a new level of voice processing offered by POLYN. It will be followed by other cores POLYN is developing for speaker recognition and voice extraction, enhancing home appliances, critical communications headsets, and other voice-controlled devices.

Customers developing products with ultra-low power voice control can apply online for the NASP VAD chip evaluation kit.

POLYN’s NASP technology and design tools give semiconductor and AI developers a new way to quickly implement neural networks directly in analog silicon. It offers process-agnostic design across 40–90 nm CMOS nodes and automatic conversion from digital ML models.

POLYN is preparing evaluation kits for early adopters and extending the implementation of its NASP product families for automotive, critical communication, and wearable applications.

polyn.ai

> Read More

Connect smart meters, trackers, and sensors with NB IoT Click from Mikroe

NB IoT 6 Click is a compact add-on development board that provides reliable narrowband IoT connectivity for embedded applications. This new Click board from Mikroe, is created around the BC65, a high-performance multi-band NB-IoT module from Quectel with ultra-low power consumption and which is compliant with 3GPP Release 13 and Release 14 standards.
Comments Nebojsa Matic, CEO of Mikroe: “This new Click board enables enable designers to prove that they can connect smart meters, asset trackers, and sensors over long distances, then begin full product development immediately without having to learn new tools or pay for expensive development kits.”

Other applications include smart parking, wearables, smart city solutions, agriculture, environmental monitoring and home appliances that requires wide-area coverage and stable communication.

A new member of Mikroe’s 1900-strong mikroBUS -enabled Click board family, NB IoT 6 Click operates across a wide frequency range from approximately 700MHz to 2.2GHz, supporting LTE bands B1, B3, B5, B8, B20, and B28 with a transmission power of 23dBm ±2dB and a receiving sensitivity of –114dBm. Alongside the main UART interface with hardware flow control, it integrates auxiliary and debug UARTs, a general-purpose 10-bit ADC channel, a SIM card holder, a network status LED, and an SMA LTE antenna connector.

NB IoT 6 Click is fully compatible with the mikroBUS socket and can be used on any host system supporting the mikroBUS standard. It comes with the mikroSDK open-source libraries, offering flexibility for evaluation and customisation.  Click boards enable design engineers to change peripherals easily, cutting months off development time. To enable hundreds of Click board to be connected to the microcontroller or microprocessor, the mikroBUS uniform connection interface allows designers to connect any Click board to a main board instantly.

www.mikroe.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration