Wearable

Nordic Semi launches Wi-Fi 6 board to speed nRF54L IoT development

Mon, Dec 29, 2025

Nordic Semiconductor has announced the availability of the nRF7002 Expansion Board II (nRF7002 EBII). The nRF7002 EBII plug-in board adds Wi-Fi 6 capabilities to Nordic’s nRF54L Series Development Kits (DKs), enabling developers to create high performance, energy-efficient, Wi-Fi 6-enabled IoT solutions.

Based on Nordic’s nRF7002 Wi-Fi Companion IC, the nRF7002 EBII allows product developers using Nordic’s nRF54L Series multiprotocol SoCs to bring the benefits of Wi-Fi 6—including power efficiency gains for battery-powered Wi-Fi operation, and management of large IoT networks—to a wide range of IoT applications. Typical use cases include smart home and Matter-enabled devices, industrial sensors and smart city infrastructure, as well as wearables and medical devices.

The nRF7002 EBII accelerates Wi-Fi 6 development by providing seamless hardware and software integration with the nRF54L15, and nRF54LM20 DKs, enabling developers to build advanced connected multiprotocol applications while leveraging Nordic’s expertise in low power wireless technology.

The nRF7002 EBII supports dual-band Wi-Fi (2.4 GHz and 5 GHz) and advanced Wi-Fi 6 features such as Target Wake Time (TWT), OFDMA and BSS Coloring, enabling efficient, interference-free, battery-powered operation. It features a dual-band chip antenna ensuring robust connectivity across Wi-Fi bands. The onboard nRF7002 companion IC offers Wi-Fi 6 compliance, as well as backward compatibility with 802.11a/b/g/n/ac Wi-Fi standards. It supports both STA and SoftAP operation modes for flexible network configuration.

The nRF7002 EBII is designed for easy integration with nRF54L Series Development Kits via a dedicated expansion header. Developers can also leverage SPI or QSPI interfaces for flexible host communication and use integrated headers for power profiling, making the board ideal for energy-constrained designs.

The nRF7002 EBII is fully supported in the nRF Connect SDK, Nordic’s unified and flexible software development kit. The nRF Connect SDK provides developers with a streamlined workflow and example code for rapid prototyping and accelerated product development.

nordicsemi.com

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New ultra-compact wireless SoC from Nordic Semi for miniaturised applications

Fri, Dec 12, 2025

With the recently launched nRF54LV10A, Rutronik is expanding Nordic Semiconductor’s ultra-low-power wireless portfolio with a new, particularly energy-efficient system-on-chip (SoC) for miniaturised applications in the medical and wearable segment. The SoC combines an extremely compact chip-scale package with high computing power, advanced security features and a radio architecture that supports Bluetooth LE, proprietary 2.4 GHz protocols and Bluetooth channel sounding in low-voltage operation for the first time. Samples and development kits of the nRF54LV10A are available through an early access program.

The nRF54LV10A sets a new benchmark in the field of low-voltage wireless SoCs. Developed for battery-powered medical devices such as continuous glucose monitors (CGMs) and wearable biosensors, its supply voltage of only 1.2 to 1.7 volts allows it to be powered directly by silver oxide button cells – without additional voltage regulators.

At its core is a 128 MHz Arm Cortex-M33 processor combined with a 128 MHz RISC-V coprocessor, which provides accelerated calculations and energy-efficient processing. In addition, the SoC has 1 MB NVM and 192 KB RAM, enabling demanding real-time applications and wireless protocols to run simultaneously.

The integrated 2.4 GHz transceiver supports Bluetooth LE, Bluetooth Channel Sounding for accurate distance measurements, and proprietary protocols with data rates up to 4 Mbps – ideal for latency-critical sensor applications.

For safety-critical healthcare products, the nRF54LV10A offers comprehensive protection mechanisms, including secure boot, secure firmware update, trusted execution environment via Arm TrustZone, cryptographic accelerators and integrated tamper detection.

Nordic’s architecture – including low-leakage RAM, multi-protocol radio and global RTC in system-OFF state – facilitates the development of long-lasting wearables with minimal system complexity. Low-voltage GPIOs allow sensors and MCUs to be connected without level shifters, further reducing space requirements.

Application examples:
Continuous glucose monitors (CGMs)
Wearable biosensors & medical monitoring devices
Connected-health solutions
Fitness & wellness trackers
Low-voltage sensor nodes and compact IoT devices

www.rutronik24.de

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Infineon at TRUSTECH 2025: Future-proof payment and ID solutions for a digital, connected world

Thu, Nov 27, 2025

At TRUSTECH Infineon will showcase its latest solutions that are shaping the future of secured digital interactions. From December 2 to December 4, at booth F025 in Pavilion 5.2, Infineon will present a range of future-ready products designed to power a connected, digital world. Highlights include:

Post-Quantum Cryptography (PQC) is essential today to safeguard data against tomorrow’s quantum threats. Infineon has reached a key milestone with its TEGRION SLC27 security controller: its Common Criteria EAL6+ certification now includes a fully approved cryptographic library featuring the PQC algorithms ML-KEM and ML-DSA. This milestone has been recognised with the nomination of TEGRION SLC27 for the TRUSTECH Innovation Award, which will be presented on December 2. At the trade show, Infineon will demonstrate the TEGRION SLC27’s advanced capabilities, including PQC implementation. Additional highlights include Thales’ newly certified MultiApp 5.2 Premium PQC smartcard and Eviden’s proven GreenShield end-to-end encryption software.

Infineon ID Key S USB enables easy and secured access and identity management, fully aligned with industry standards such as FIDO (Fast Identity Online). Paired with Infineon’s SECORA ID Key platform, it combines hardware and software to deliver a comprehensive, flexible security solution. Its integrated USB interface, in addition to NFC support, adds an extra layer of convenience and versatility. The platform’s open architecture empowers customers to develop customised solutions, accelerating time-to-market.

SECORA ID demonstrates how traditional electronic ID (eID) documents can complement mobile ID solutions. Acting as a secured root of trust, the platform enables reliable and scalable deployment of digital identities in real-world environments. Visitors can explore how mobile and physical ID credentials work together to enhance user convenience and security. In collaboration with PAV Card GmbH, a live demo of the Multi-Trust Smartcard based on SECORA ID will showcase how secured access to healthcare systems can be maintained even during network outages, allowing patient safety and operational continuity in critical environments.

SECORA Pay M is the latest addition to Infineon’s SECORA Pay solution family, enabling fast, efficient payments and secured authentication. The pioneering platform offers a one-stop solution that supports multiple use cases, including EMV (MasterCard and VISA) payment, Tap-to-X use cases and FIDO authentication – allowing users to access a wide range of services from a single device. By integrating FIDO, SECORA Pay M enhances the security and user experience of e-commerce and online banking, staying ahead in payment and authentication technologies.

SECORA Pay Green is paving the way for a more sustainable future in the payment industry. The innovative eCoM module integrates a contactless antenna directly into the module to reduce CO₂ emissions by over 60% related to the sourcing and logistics of the raw materials (security chip and module) for card production, as reported by Climate Partner. SECORA Pay Green has been recognised with the TRUSTECH innovation award 2024 and was added to Mastercard’s Card Eco Certification program recently. The solution enables fully recyclable card bodies, setting a new benchmark for environmentally responsible payment technologies.

SECORA Pay Bio enhances convenience and trust in biometric contactless payments. This all-in-one solution extends Infineon’s proven SECORA Pay turnkey family to meet the user demand for fast and secured payment experiences. It enables scalable, high-volume production of robust and reliable biometric payment cards, delivering a seamless user experience. SECORA Pay Bio supports a variety of enrolment methods, including sleeves, smartphone apps, and in-field enrollment.

The pop-up nail salon returns to TRUSTECH in collaboration with Smart Chip and Digiseq. A nail care professional will apply a smart chip with integrated payment functionality directly to the fingernail, enabling seamless contactless payments. The Smart Chip is a multifunctional inlay that is permanently attached to the fingernail powered by Infineon’s SECORA Pay solution family.

infineon.com

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ST reveals new NB-IoT modules for cellular connectivity

Tue, Nov 18, 2025

STMicroelectronics has introduced two new ST87M01 NB-IoT wireless modules and revealed an enhanced development ecosystem designed to facilitate the creation of smart IoT solutions with narrowband cellular connectivity. Typical applications include smart logistics, environmental monitoring, smart lighting, smart parking, industrial condition monitoring, livestock and pet tracking, alarms, and remote healthcare.

Existing modules in the ST87M01 family are already installed in smart meters deployed throughout Europe, helping utilities capture real-time granular data to meet environmental and operational goals. “We are now taking the next step to make our module technology and fully owned, resilient supply chain accessible across a wider variety of markets and environments. This all-in-one solution combines industry-leading compactness and ultra-low power consumption with reliability and security, enabling scalable and secure IoT deployments,” said Domenico Arrigo, General Manager, Application Specific Analog Product Division, STMicroelectronics.

The two new modules include the ST87M01-1001, supporting NB-IoT narrowband cellular data connectivity, and the ST87M01-1301 which adds GNSS and Wi-Fi positioning capabilities for outdoor and indoor geolocation. The EVKITST87M01-2 evaluation kit is a comprehensive development platform with a ready-to use Conexa IoT SIM card and two SMA antennas, for prototyping and testing NB-IoT connectivity in real-world applications. ST’s expanded ecosystem also includes the “Easy-Connect” software library and design examples.

ST’s “Easy-Connect” library helps developers to quickly communicate with the module, configure and exercise the NB-IoT, GNSS, and Wi-Fi functionalities, and exchange data with the cellular network, over a C-like, totally hardware agnostic, and OS independent platform. The IoT SIM card provides 50MB of data, valid for 6 months after user activation, through the Conexa network. Operated by ST Authorised Partner Wireless Logic, Conexa supports NB-IoT connectivity across many international markets, with this SIM specifically configured for use in Europe, Middle East, and Africa (EMEA).

“Wireless Logic’s cellular connectivity, included free of charge with ST’s latest NB-loT module evaluation kits, provides the easiest and fastest way to connect and develop prototypes,” commented John Dillon, Product and Marketing Managing Director, Wireless Logic. “Our Conexa IoT network and management platforms provide extensive geographical coverage and ensure resilient and future-proof NB-loT connectivity.”

The Virtual Antenna technology from Ignion, alongside its seven different antenna components and Oxion AI-powered integration platform of RF projects, helps customers select and design-in the right Virtual Antenna chip to meet size, performance, and bill-of-materials constraints. Using Oxion’s antenna integration platform, ST87M01 developers can trial shortlisted antennas, apply best practices, and quickly iterate their designs to fine-tune performance.

Jaap Groot, CEO of Ignion, said, “Our Virtual Antenna® and Oxion™ AI-powered platform solutions make RF design simpler, faster, and more predictable, giving engineers confidence and control throughout development. Working closely with ST, we’ve brought this capability to the new ST87M01 modules, reflecting our shared commitment to deliver integrated, ready-to-scale wireless solutions that help customers save time and focus on what matters most: innovation.”

DAOS can optionally support ST customers throughout system development, from hardware and software design to production, accelerating time-to-market and unlocking the potential of the ST87M01 module in IoT projects.

www.st.com

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