Digid announces its nanoscale temperature and force sensors are ready for mass deployment

Digid has announced that its patented printed electronics fabrication technology has been fully qualified for volume production of temperature and force sensors as small as 1µm long.

Digid sensors are believed to be the world’s smallest – and are set to become even smaller: Digid’s technology roadmap forecasts future production of sensors that are just 10nm long.

This nanoscale sensing technology provides the key that will unlock the potential of multiple emerging markets, including physical AI and humanoid robots. In robotics, for instance, Moravec’s paradox – that robots struggle with tasks which humans find easy, such as handling a delicate wine glass – has persisted in part because robot hands lack the billions of nerve endings on a human finger.

Now Digid offers the opportunity for machines to mimic human sensory capabilities: its nanoscale printed sensors can be applied to surfaces such as a robot’s shell in arrays of up to 16 x 16 sensors.
Other applications for Digid sensors include:
Force sensing on the blade of a scalpel in robotic surgical equipment
Temperature sensing on the tip of a temperature probe used in minimally invasive surgery
Temperature sensors embedded inside battery cells, for safety and performance monitoring
Biosensors for detecting biological objects such as viruses, or the chemical markers of drugs in the bloodstream

Dr Konstantin Kloppstech, Chief Technology Officer of Digid, said: ‘With the start of mass production of Digid sensors, the opportunities to embed sensing on almost any surface or in almost any device have become limitless. Our sensor is so small that it cannot be seen with the naked eye. Now it is up to the imaginations of design engineers to dream of uses for sensing where sensing has never before been possible.’

For each design project, Digid supplies a custom sensor and sensor assembly backed by hardware and software integration support. The sensor provides either a voltage or resistance measurement output via an I2C interface. Digid signal processing software converts the raw measurement outputs to useful temperature or force data.

digid.com

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Bosch Sensortec launches BMI5 motion sensor platform at CES

At CES 2026, Bosch Sensortec introduces the BMI5 platform, a new generation of inertial sensors designed to provide consistent, high-precision performance across multiple device classes. Built on a shared hardware foundation and adapted through intelligent software, the platform launches with three variants – BMI560, BMI563 and BMI570.

At the core of the BMI5 platform is Bosch’s latest MEMS architecture, which defies thermo-mechanical stress effects, provides ultra-low noise, vibration robustness and twice the full-scale range of the previous generation. A latency of below 0.5 ms, combined with a time increment of approximately 0.6 µs and a timing resolution of 1 ns, ensures responsive and reliable motion tracking in highly dynamic environments. A compact industry-standard LGA package further simplifies integration. A programmable Edge-AI classification engine supports always-on functionality by analysing motion patterns directly on the sensor, reducing system power consumption and accelerating customer-specific use cases.

The BMI560 is optimised for XR headsets and glasses, where low noise, low latency and precise time synchronisation enable natural head motion, frame prediction and intuitive 3D interaction. For smartphones and action cameras, its advanced OIS+ performance helps capture stable, high-quality footage even in dynamic environments.

The BMI563 combines an extended Full Scale Range (FSR) with the platform’s vibration robustness, supporting Simultaneous Localisation and Mapping (SLAM), high-dynamic XR motion tracking and motion-based automatic scene tagging in action cameras. Its design ensures reliable data acquisition under demanding robotic motion profiles.

The BMI570 provides dependable activity tracking, advanced gesture recognition and accurate head-orientation data for spatial audio. Its robustness under dynamic sports and everyday movements makes it a strong fit for next-generation wearables and hearables.

Across all variants, the BMI5 platform meets Bosch Sensortec’s highest ecological standards to date, combining technical performance with responsible innovation. This unified architecture enables device makers to streamline development across product lines, while supporting future edge-AI and ML-enabled enhancements.

www.bosch-sensortec.com

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Nordic Semiconductor simplifies edge AI for billions of IoT devices

Nordic Semiconductor is bringing AI intelligence and functionality to the smallest battery-powered IoT devices. With an ultra-low-power Edge AI solution, Nordic accelerates the arrival of a new generation of devices with integrated edge AI intelligence – combining energy efficiency with unmatched ease of use for developers.

“AI factories train intelligence, but Nordic deploys it – on device, at the edge, where the world happens – said Vegard Wollan, CEO at Nordic Semiconductor. “Edge AI is no longer optional – it’s the only way to deliver safety, privacy, and sustainability at scale. Nordic’s edge AI solution enables millisecond decisions without round-trip latency to the cloud, ensures compliance through local processing, and delivers radically improved battery life for billions of connected devices. This is the new standard for ultra-low-power edge AI and Nordic is defining it.”

In 2023, Nordic acquired Atlazo and its Axon technology. The nRF54LM20B SoC is the first large-memory member of the nRF54L Series, integrating the Axon Neural Processing Unit (NPU), an ultra-efficient AI hardware accelerator, to supercharge demanding edge AI workloads. Axon delivers up to 7 times faster performance and up to 8 times higher energy efficiency versus competing solutions for tasks such as sound classification, keyword spotting, and image-based detection.

The nRF54LM20B SoC pairs the Axon NPU with 2 MB NVM, 512 KB RAM, a 128 MHz Arm Cortex-M33 plus RISC-V coprocessor, high-speed USB, up to 66 GPIOs, and Nordic’s fourth-generation ultra-low-power 2.4 GHz radio supporting Bluetooth® LE, Bluetooth Channel Sounding, Matter over Thread, and more.

The Neuton models are ultra-tiny, CPU-run edge AI models that are typically under 5 KB and up to 10 times smaller, faster, and more efficient than other CPU-run models. Nordic Edge AI Lab helps developers generate custom Neuton models for anomaly detection, activity and gesture recognition, biometric monitoring, and more – delivering privacy-preserving, real-time intelligence on tiny batteries and constrained memory, without cloud dependency.

With Nordic Edge AI Lab and Neuton models, intelligence moves from concept to reality without complexity. One recent deployment illustrates this: A global supply chain solution upgraded its smart tracking devices with AI models created in Nordic Edge AI Lab effortlessly, enabling detection of real handling events such as shock, shaking, and transportation directly on an nRF54L Series SoC. These AI-driven insights were rolled out across an entire fleet without operational disruption, thanks to Nordic’s nRF Cloud lifecycle services.

“With Nordic Edge AI Lab, Neuton models, and the Axon NPU, Nordic makes advanced on-device AI practical for every embedded developer,” said Oyvind Strom, EVP Short-Range BU at Nordic Semiconductor. “Developers get the simplicity to move fast, and the disruptive performance to scale from wearables to industrial sensing – all enabled within Nordic’s trusted ultra-low-power hardware solutions.”

As intelligence moves to the edge, the need for OTA management and deep observability is growing. At the same time, cloud-based lifecycle services remain critical for device management, embedded observability, and location services. Manufacturers increasingly need continuous insight into device performance – not just to improve products in real time, but to meet growing regulatory and customer requirements. Using data from deployed devices enhances features and optimises performance without disrupting the user experience. This ensures connected products can evolve securely and efficiently throughout their lifecycle.

www.nordicsemi.com

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Taoglas expands compact chip antenna range for Wi-Fi 6/7, UWB and ISM applications

Taoglas has announced the expansion of its embedded antenna portfolio with a new range of Low Temperature Co-fired Ceramic (LTCC) chip antennas optimised for Wi-Fi 6/7, Ultra-Wideband (UWB), and ISM connectivity. The new ILA.257, ILA.68, and ILA.89 are designed for next-generation IoT, consumer, industrial, and wearable applications.

Built on Taoglas’ LTCC technology, the new chip antennas combine high radiation efficiency and frequency stability, ensuring consistent performance even in densely integrated, multi-radio designs. Each antenna supports automated pick-and-place SMT integration and is supplied in tape and reel format, simplifying assembly and enabling high-volume production.

The Taoglas ILA.257 is a compact, high-performance LTCC antenna designed for Wi-Fi 6 and Wi-Fi 7 applications. It supports tri-band operation across the 2.4 GHz, 5.8 GHz, and 7.125 GHz frequency ranges, providing full coverage for the latest and emerging wireless standards, including Wi-Fi 6E and beyond. Measuring just 3.2 × 1.6 × 0.5 mm, it offers radiation efficiency and stable signal integrity across all bands, even in high-frequency regions where many chip antennas suffer degradation. The ILA.257’s small footprint, minimal keep-out area, and low profile make it ideal for ultra-compact devices such as wearables, portable consumer electronics, and industrial IoT modules.

The Taoglas ILA.68 has been engineered specifically for UWB applications across the 6 GHz to 8.5 GHz spectrum. With dimensions of just 3.2 × 1.6 × 1.1 mm, it delivers a stable omnidirectional radiation pattern, excellent repeatability, and low insertion loss across temperature and frequency variations. The ILA.68 supports a broad range of applications, including precision indoor positioning, secure access control, and short-range radar. Its performance-to-size ratio makes it particularly well-suited for automotive sensors, smart home systems, and miniaturised IoT devices that demand reliable UWB connectivity within the smallest possible form factor.

The Taoglas ILA.89 is a high-efficiency LTCC chip antenna designed for operation within the 868 MHz and 915 MHz ISM bands. Supporting both European and US frequency allocations, it enables global deployment of devices using LPWAN and LoRa technologies. The antenna achieves up to 47.9% radiation efficiency and a peak gain of 0.56 dBi within a compact 4.0 × 12.0 × 1.6 mm footprint, making it ideal for small, battery-powered IoT products with limited PCB real estate. The ILA.89’s simple layout requirements and region-specific variants reduce design complexity and time-to-market while lowering total cost of ownership for OEMs.

www.taoglas.com

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