TI expands MCU portfolio and software ecosystem to enable edge AI in every device

Texas Instruments has introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company’s commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate TI’s TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimises deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge.

TI’s embedded processing portfolio is supported by a development ecosystem, including the CCStudio integrated development environment (IDE). Its generative AI features allow engineers to use simple language to accelerate code development, system configuration and debugging through industry-standard agents and models paired with TI data. Altogether, TI is accelerating the adoption of edge AI in any electronic device, from real-time monitoring in wearable health monitors and home circuit breakers to physical AI in humanoid robots. These end-to-end innovations are featured in TI’s booth at embedded world 2026, March 10-12, in Nuremberg, Germany.

Consumers are always looking for everyday technology to be more intelligent, from fitness wearables to home appliances and electrical systems. However, many engineers believe that AI capabilities are exclusive to higher-end applications given high costs, power demands and coding requirements. TI’s new MSPM0G5187 Arm Cortex-M0+ MSPM0 MCU represents a fundamental shift for embedded designers, who can now bring edge AI to a wide range of simpler, smaller and more cost-effective applications.

With local computation, the TinyEngine NPU executes computations required by neural networks in parallel to the primary CPU running application code. Compared to similar MCUs without an accelerator, this hardware acceleration:
• Minimises the flash memory footprint.
• Lowers latency by up to 90 times per AI inference.
• Reduces energy utilisation by more than 120 times per AI inference.

Motor control applications in appliances, robotics and industrial systems increasingly call for intelligent features such as adaptive control and predictive maintenance, but implementing these capabilities has historically required complex, multi-chip designs. TI’s new AM13Ex MCUs are the industry’s first to integrate a high-performance Arm Cortex-M33 core, TinyEngine NPU and advanced real-time control architecture into a single chip.

This degree of integration enables designers to implement sophisticated motor control and AI features simultaneously without external components, lowering bill-of-materials costs by up to 30%. Key enhancements include:
• The ability to maintain precise real-time control loops for up to four motors while the TinyEngine NPU runs adaptive control algorithms for load sensing and energy optimisation.
• An integrated trigonometric math accelerator that performs calculations 10 times faster than coordinate rotation digital computer (CORDIC) implementations, delivering more precise, responsive motor-control performance.

Both MCU families are supported by TI’s CCStudio Edge AI Studio, a free development environment that simplifies model selection, training and deployment across TI’s embedded processing portfolio. This edge AI toolchain gives engineers full flexibility to run AI models on TI MCUs through either hardware or software implementations. Today, there are more than 60 models and application examples available in the tool to help developers start deploying edge AI in any device, with additional tasks and models planned in the future.

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NXP’s new i.MX 93W fuses edge compute and secure wireless connectivity

NXP Semiconductors has announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, the i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 discrete components with a single package. Pre-certified reference designs eliminate many common integration challenges, reducing the complexity, cost and risk traditionally associated with RF design. Supported by NXP’s software and industry-leading eIQ AI enablement solutions, the i.MX 93W also supports smaller form factors and is designed to accelerate time-to-market for physical AI applications.

Physical AI requires coordinated AI agents to collaborate locally, taking real-time action with low latency and high reliability. For example, AI agents might coordinate across a smart building’s lighting, HVAC, access control, occupancy and smart energy systems to autonomously optimise comfort, energy efficiency, and operational responsiveness securely in real time.

NXP’s new i.MX 93W addresses this need by integrating scalable edge compute, AI acceleration, and secure wireless connectivity in a single package, supported by NXP’s software, eIQ AI enablement and pre-certified reference designs. This allows coordinated AI agents to locally manage physical environments, such as a group of healthcare agents working together to coordinate wearables, smart diagnostics, sensors and health gateways that deliver real-time healthcare insights and actions. The highly integrated i.MX 93W SoC also allows customers to rapidly scale physical AI across healthcare devices, smart building controllers, industrial gateways, energy infrastructure monitors and smart home hubs.

The i.MX 93W applications processor combines a dedicated AI NPU with secure tri-radio wireless connectivity in a single package. This eliminates the need for up to 60 discrete components, significantly reducing board area, design and supply chain complexity and system-level costs. The i.MX 93W features a dual-core Arm CortexA55 applications processor with a dedicated Arm Ethos NPU capable of up to 1.8 eTOPs. The integrated IW610 tri-radio combines Wi-Fi 6, Bluetooth Low Energy, and 802.15.4 connectivity supporting Matter and Thread deployments. This eliminates complex RF tuning steps and coexistence challenges that traditionally slow development and certification, speeding time-to-market.

The i.MX 93W SoC integrates an EdgeLock Secure Enclave (Advanced Profile), addressing regulatory requirements, including European Cyber Resilience Act (CRA). The embedded EdgeLock Secure Enclave is a hardware root of trust simplifying implementation of security-critical functions like secure boot, secure update, device attestation and secure device access. Combined with NXP’s EdgeLock 2GO key management services, OEMs can securely provision i.MX 93W SoC-based products at device manufacturing or in the field.

NXP’s pre-certified i.MX 93W SoC-based single and dual-antenna reference designs minimise RF tuning effort and eliminating many common integration challenges. Certified across multiple countries and regions, these reference designs reduce the complexity, cost and risk traditionally associated with RF design and wireless certification. By leveraging validated antenna options and pre-approved designs, customers can shorten regulatory approval timelines, reduce development cost, and bring products to market faster.

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Nordic Semi debuts low-power nRF93M1 Cat 1 bis module at MWC 2026

Nordic Semiconductor is demoing the nRF93M1 module with LTE Cat 1 bis connectivity and its associated development kit at MWC 2026. This will be part of Nordic’s suite of additions to its future-ready cellular IoT portfolio.

“nRF93M1 delivers what customers have been asking for – a high‑quality, low-power Cat 1 bis module that’s smaller, easier to integrate, and built for the cloud from day one,” says Oyvind Birkenes, EVP Long-Range at Nordic Semiconductor. “It brings more performance with less complexity, giving developers a powerful, future‑ready platform.”

Bringing LTE Cat 1 bis connectivity to Nordic’s long-range portfolio, the nRF93M1 offers fully compatible regional and global module options for widespread, reliable, scalable IoT deployments. With the nRF54L host MCU reference design, evaluation kit, and open documentation, companies get a much faster development cycle, including quick bring-up, easier integration, and fewer technical barriers when moving from prototype to product. Ultra-low-power features ensure that battery-powered devices operate for years in the field, while standardised, Nordic-optimised interfaces and peripherals make it easy to slot the nRF93M1 into new and existing system designs.

The nRF93M1 is built for flexibility, supporting Wi Fi and cellular eCID location, multiple embedded peripherals, coexistence control, and multiple SIM options, including IoT eSIM (SGP.32) remote provisioning support and low-power SoftSIM. Global and regional regulatory and mobile operator certifications are ongoing to ensure compliance and accelerate time-to-market for customers.

“The nRF93M1 delivers reliable 4G performance with lower device complexity, broad coverage, and power-efficient operation – key advantages for scalable IoT deployments,” says Kristian Sæther, Senior Product Director Long-Range at Nordic Semiconductor. “Combining Nordic’s ease of use with Cat 1 bis connectivity empowers companies to build high‑performing devices today, while we continue to develop a further optimised eRedCap solution as the 5G ecosystem matures.”

The nRF93M1 DK provides a complete out-of-the-box experience for rapid evaluation and prototyping with the nRF93M1 module, the nRF54L host MCU reference design, and the pre-provisioned nRF Cloud services support.

The nRF93M1 will ship with nRF Cloud’s power-optimised cellular and Wi-Fi location services, embedded observability, and firmware OTA capabilities, all built into the modem. It can be activated on the modem via simple AT commands and extended to a Nordic host MCU via integration with the nRF Connect SDK. This combination of production-ready services means easier product development, lower-risk product launches, simpler in-field maintenance, and streamlined scale up.

Together, the nRF93M1, its development kit, and nRF Cloud deliver a low-power, developer-friendly platform for building more data-intensive cellular IoT products.

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Aria Sensing and Algorized unveil a breakthrough in AI powered UWB radar

Aria Sensing and Algorized have announced a strategic collaboration that redefines what Ultra-Wideband technology can achieve. By combining 3D UWB radar System-on-Chip with Algorized’s Edge-Native Nervous System, the companies have introduced a powerful AI-based UWB sensing platform, starting with a next-generation Automotive Child Presence Detection (CPD) system unveiled at Mobile World Congress 2026.

While most UWB chips on the market were originally designed for secure ranging, Aria Sensing’s hydrogen 4×4 UWB Radar SoC was engineered from the ground up for radar performance.

“Traditional UWB solutions were never optimised for high-resolution radar sensing,” said Alessio Ciaccatori, CEO of Aria Sensing. “Hydrogen changes the paradigm. Combined with Algorized’s real-time edge-AI engine, we are delivering a sensing platform that dramatically outperforms conventional UWB and mmWave solutions in sensitivity, angular resolution, power efficiency, and real-world robustness.”

At the core of the breakthrough is Hydrogen, the world’s first UWB radar SoC featuring:
• True 3D detection
• Integrated digital beamforming (~5° angular resolution)
• Up to 1.8 GHz programmable bandwidth
• Ultra-low power radar architecture

The result: high-resolution in-cabin sensing capable of detecting micro-motions, respiratory activity, precise occupancy mapping, behavioural patterns and more — dramatically reduced latency, and at a fraction of the power consumption and cost of legacy radar architectures.

When powered by Algorized’s embedded edge AI foundation model, the platform delivers:
• AI-powered people counting and tracking
• Micro-motion and baby monitoring
• Behavioural pattern recognition
• Secure positioning and classification
All running directly on a compact, scalable hardware platform ready for mass deployment.

First Application: Next-Generation Child Presence Detection
The collaboration debuts with an advanced Automotive Child Presence Detection (CPD) in-cabin solution, designed for OEM and Tier-1 integration and aligned with emerging global safety regulations.

Beyond Automotive: A New Standard for Human-Centric Radar
The joint platform extends far beyond CPD. Aria Sensing and Algorized are enabling a new class of intelligent sensing devices for:
• Smart buildings
• Consumer electronics
• HVAC and appliances
• Industrial safety systems
• Elderly monitoring

From ceiling-mounted building sensors to embedded smart devices, the companies provide turnkey demonstrators and a fully integrated IC + AI software stack designed for rapid scaling into high-volume production.

“Aria Sensing’s mission is to provide world’s best UWB single-chip radar devices,” said Alessio Cacciatori, CEO of Aria Sensing. “Joining advanced Edge-AI features extraction with low-power, high-resolution single-chip radar devices truly enables a paradigm shift in how appliances, home, cars, and robots interact with persons.”

“Algorized’s mission is to give machines human-level environmental awareness,” said Natalya Lopareva, CEO of Algorized. “By combining AI with a purpose-built 3D UWB radar architecture, we are unlocking capabilities that were simply not possible with legacy silicon.”

Hydrogen will be demonstrated at MWC Barcelona (March 2–5, 2026) on Aria Sensing booth, Hall 7, Booth 7D71, Stand 26, and specific CPD Evaluation kits are available for customer evaluation.

ariasensing.com

algorized.com

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