Infineon advances Edge AI computing on PSOC Edge with NVIDIA TAO toolkit integration

Microcontrollers (MCU) are at the heart of modern electronics, and integrating the latest AI development and deployment workflows at the edge poses a major challenge for developers. The combination of a high-performance MCU with NPU hardware acceleration and an advanced AI fine-tuning workflows will enable developers to accelerate the deployment of AI models in low-power MCUs: Infineon has today announced support for NVIDIA TAO models on the PSOC Edge MCU family.

Infineon’s PSOC Edge MCU family features Arm Cortex-M55 processors and Ethos-U55 microNPU and enhances energy-efficient machine learning capabilities at the edge. The combination of these versatile microcontrollers with the powerful NVIDIA TAO models and fine-tuning toolkit greatly simplifies the creation, customisation, optimisation, and deployment of high accuracy vision AI models.

“NVIDIA is a key player in the AI/ML space, so we and our lead customers engaged in vision, audio and voice applications are very excited about this effort,” said Steve Tateosian, Senior Vice President IoT Compute & Wireless at Infineon. “By integrating NVIDIA TAO in our PSOC Edge portfolio, we empower developers to create smarter and more efficient systems that work at the edge of the network and solve real-world challenges with speed and precision. This significantly speeds up time-to-market for ML enabled applications in industrial automation, medical, automotive, and smart IoT solutions.”

“NVIDIA TAO brings the latest advances in computer vision models and fine-tuning workflows to the far edge”, said Deepu Talla, Vice President of Robotics and Edge Computing at NVIDIA. “Infineon PSOC Edge’s integration of NVIDIA TAO greatly simplifies the development and deployment of customised AI across a range of devices.”

The integration of NVIDIA TAO features will become available for the entire PSOC Edge family along with a comprehensive development ecosystem, including tools, libraries, and documentation, to accelerate innovation and reduce time-to-market for AI-enabled applications.

https://www.infineon.com

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New module series from Panasonic equipped with Wi-Fi 6 from TI

Panasonic has announced their cost-effective Wi-Fi 6 & Bluetooth LE Combo module series PAN W602, based on the Texas Instruments (TI) SimpleLink WiFi CC3301 companion IC and CC3351 Companion IC.

The PAN W602 will be available in a single band (PAN W602-1) and dual-band variant (PAN W602-2) and will be equipped with an integrated antenna for easy hardware design and easy end-certification. Alternatively, Panasonic Industry also offers a variant with available bottom pad for applications that require an external antenna.
The module series is suitable for low-cost Wi-Fi 6 applications that require low data rates, for example inverters, medical devices, heat pumps, or EV chargers.

TI’s CC3301 and CC3351 devices stand out in particular with Wi-Fi 6 and Bluetooth LE 5.4 support at an affordable price. They feature robust security, including WPA3 and firmware authentication capabilities. The versatile architecture of these chipsets allows seamless integration with processors running Linux/Android or capable microcontrollers (MCU) running RTOS and networking stack, addressing a wide range of industrial and Internet of Things (IoT) applications that require affordable, secure and reliable wireless communication.

Tomislav Tipura, Product Manager at Panasonic Industry comments: “We are proud to continue our decade-long collaboration with Texas Instruments, and we are excited to introduce this new module series, built on their advanced CC3301 and CC3351 chipsets. This collaboration allows us to deliver high-performance solutions that meet the evolving needs of our customers at a competitive price point.”

“In today’s fast-paced IoT landscape, companies designing innovative Wi-Fi 6-enabled applications are focused on reducing time to market for new products while keeping costs low. The PAN W602 family of modules from Panasonic, based on our SimpleLink wireless products, are helping to meet this need, and expand the capabilities of Wi-Fi and cloud-based ecosystems. We look forward to seeing these modules further unlock the potential of our increasingly connected world.” adds Shmulik Elgavi, Product Line Manager, Wi-Fi Connectivity Solutions at Texas Instruments.

The PAN W602 Series Wi-Fi 6 and Bluetooth module will be certified for CE RED, FCC, ISED, MIC, and NZ/AUS. Samples are already available now and the start of mass production is scheduled for end of year 2025.

https://industry.panasonic.eu

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Renesas extends mid-class AI processor line-up for smart factories and intelligent cities of tomorrow

Renesas has expanded its RZ/V Series of microprocessors (MPUs) with a new device that targets the high-volume vision AI market. Similar to its high-end device, the RZ/V2H, the new RZ/V2N MPU comes with Renesas’ proprietary AI accelerator, DRP (Dynamically Reconfigurable Processor)-AI3, boasting 10 TOPS/W (Tera Operations Per Second Per Watt) power efficiency and an AI inference performance of up to 15 TOPS through its advanced pruning (Note 1) technology. With the latest addition of the RZ/V2N, the RZ/V series has now expanded to cover a full range of markets, from the low-end RZ/V2L (0.5TOPS) to the high-end RZ/V2H (up to 80 TOPS).

The new MPU is significantly smaller than the RZ/V2H, with its package area measuring only 15 mm square, reducing the area required for mounting by 38%. Inheriting the advanced features of the RZ/V series, the RZ/V2N combines high AI performance with low power consumption. These optimised features suppress heat generation, eliminating the need for additional cooling fans and reducing the size and cost of embedded systems. Developers can easily implement vision AI in a wide range of applications, from AI cameras for traffic and congestion analysis in commercial facilities, industrial cameras for visual inspection on production lines, to driver monitoring systems for behaviour analysis.

Double-angle image processing with two cameras
Similar to the RZ/V2H, the new RZ/V2N is equipped with four best-in-class Arm Cortex-A55 CPU cores and a single Cortex-M33 core, coupled with a high-quality image signal processor (ISP), Arm Mali-C55. The RZ/V2N also has two channels of MIPI camera interfaces, which allow two cameras to be connected to capture double-angle images. The two-camera system significantly improves spatial recognition performance compared to a single camera system and enables more precise human motion line analysis and fall detection. Furthermore, the dual-camera system captures images from different locations, allowing a single chip to count cars in a parking lot and recognise license plates efficiently.

“Since launching the RZ/V2H last year to target next-generation robotics requiring vision AI and real-time control, we have received tremendous interest in using the Renesas DRP-AI accelerator,” said Daryl Khoo, VP of Embedded Processing at Renesas. “With the addition of the RZ/V2N, sharing the same lineage as the RZ/V2H, we are extending our reach to address mid-range applications, particularly endpoint vision AI that does not need to be realised with power hungry designs. I am excited that our customers will be able to select the best AI MPU from Renesas that meets their system and budget requirements.”

“Vision AI applications across markets including smart city, enterprise and industrial are broad and varied, but all demand sustained performance and efficient processing,” said Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm. “Renesas’ new RZ/V2N MPU leverages the leading-edge capabilities of the Arm compute platform to deliver against the performance and efficiency needs of next generation vision AI use cases.”

The RZ/V2N will be available with the Renesas evaluation board kit and a software development environment, along with various AI applications covering more than 50 use cases that are provided in the AI Applications and AI SDK (GitHub). The SDK assists users without in-depth AI knowledge to quickly evaluate and develop AI applications, shortening time to market. Additionally, partner companies will provide a SOM (system-on-module) board, SBC (single board computers), camera modules, and other products that incorporate the Renesas RZ/V2N. This reduces hardware design work, allowing developers to focus on AI application development and bring their products to market rapidly.

Renesas has developed the AI Camera Solution, which targets a variety of applications, including factories, public facilities, and commercial facilities. This solution consists of the RZ/V2N, power management IC, and real-time clock IC, and can be used as a reference for AI camera systems.

https://www.renesas.com/rzv2n

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Synaptics launches ultra-low-power Wi-Fi/Bluetooth SoC family for embedded Edge AI IoT

Synaptics has extended its Veros Triple Combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0 and Bluetooth Low Energy (BLE), and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for the embedded Edge AI Internet of Things (IoT), the SYN461x is optimised for power, system integration, size, and rapid time to market while delivering rate-over-range performance and seamless interoperability. The versatile Matter-compliant SoCs offer advanced Bluetooth features, such as Channel Sounding and LE Audio—including Auracast. The SYN461x specifically targets consumer and industrial applications and is tailored for devices such as wearables, smart watches, audio speakers and headsets, home appliances, security cameras, asset trackers, and factory automation.

Launched in 2024, Veros encompasses Synaptics’ entire wireless portfolio of solutions characterised by performance, interoperability, coexistence, power efficiency, and bill of materials integration. Veros features built-in support for Synaptics Astra, the AI-Native compute platform for the IoT.

“The SYN461x family is a breakthrough addition to our Veros portfolio,” said Vineet Ganju, VP of Wireless Product Marketing at Synaptics. “The SoCs are our first in a series designed from the ground up for ULP embedded Edge AI IoT applications. We believe their low-power architecture, software support, and low-density packaging extend our broad-market reach and position us to share in a ~$3.2 billion market opportunity.

“The degree of versatility required to meet the unique connectivity needs of the diaspora of diverse low-power IoT applications demands a high degree of domain expertise,” said Phil Solis, Research Director at IDC. “Ultra-low-power and highly flexible solutions such as the SYN461x make a solid case for discrete, targeted, wireless SoCs in markets where more options are needed.”

The SYN461x family extends Synaptics’ Triple Combo series into ULP, highly optimised IoT applications where it delivers reliable connectivity of up to 50 Mbps while extending battery life and maximising range. Features include:

● Up to tri-band 1×1 Wi-Fi support across 2.4, 5, and 6 GHz with power-optimised architecture
● Low-power Bluetooth/BLE—with Channel Sounding for precise distance measurement
● IEEE 802.15.4 (Thread/Zigbee) with Matter support for seamless interoperability across popular low-power networks
● Integrated Tx/Rx switch, LNAs, and PAs that reduce area BOM and system cost while simplifying design by only requiring a direct antenna connection
● Low-pin-count WLBGA package option for low-cost, plated-through-hole (PTH) PCBs (25% reduction in typical board cost)
● An integrated processor that offloads the host application processor to help minimise system power consumption
● Secure Boot to help ensure system integrity

https://www.synaptics.com

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