u-blox launches firmware-upgradeable meter-level GNSS for enhanced IoT performance

u-blox has announced the launch of the UBX-M10150-KB chip and the MAX-M10N module – the first M10-platform GNSS hardware designed with firmware upgradeability. Both products run the new SPG 5.30 firmware, introducing Low Energy Accurate Positioning (LEAP) – a mode that reduces power consumption by up to 50 percent while maintaining superior positioning accuracy. Designed for battery-powered devices, the new chip offers ultra-low power consumption of just 8 mW in continuous tracking. The new products are ideally suited for vehicle, people, and pet tracking, as well as livestock monitoring and wearable applications.

The UBX-M10150-KB and MAX-M10N extend the capabilities of the M10 family beyond previous ROM-based products. With SPG 5.30, they offer a set of new technical features: LEAP replaces cyclic tracking mode to achieve significant energy savings including external LNA power cycling, and RTCM corrections input supports positioning accuracy down to the sub-meter level. In addition, the firmware adds data logging and geo-fencing functions, enabling more autonomous tracking and monitoring directly on the device.

Both products include lifetime access to AssistNow Predictive Orbits and Live Orbits, which accelerate start-up times and improve positioning performance when using small antennas or operating in weak-signal environments. The EVK-M102 evaluation kit and u-centre 2 software are available to simplify the design-in phase for developers.

www.u-blox.com

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Rutronik adds SoC from Nordic for advanced Bluetooth LE and Matter applications

With the nRF54LM20A, Rutronik is expanding its SoC portfolio with the latest component from Nordic Semiconductor’s nRF54L series. This flexible wireless SoC combines an ultra-low-power 2.4 GHz radio with 128 MHz Arm Cortex-M33 processor, extensive peripherals and scalable memory configurations. Thanks to integrated high-speed USB, extended memory (2 MB NVM, 512 KB RAM) and modern security functions, the nRF54LM20A enables energy-efficient designs for future-oriented applications such as wearables, gaming peripherals or smart home solutions. The nRF54LM20A SoC and the matching nRF54LM20-DK are available for pre-order. The official sales launch is planned for Q1 / 2026.

The nRF54LM20A complements the nRF54L series and impresses with even more performance and flexibility. Proprietary technologies such as low-leakage RAM and advanced multi-protocol radio design significantly reduce power consumption – a key advantage for developers looking to reduce battery size or extend battery life.

To support cost optimisation and flexibility in the design cycle, the SoCs are available in memory and package configurations with up to 66 GPIOs including pin-to-pin options.

The associated development kit (nRF54LM20-DK) provides a complete functional overview on one board. It is supported by the nRF Connect SDK and tools and enables a quick start. Free training courses from the Nordic Developer Academy round off the offer for developers.

www.rutronik24.com

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Bosch BHI385 programmable smart IMU with on-sensor AI-powered analysis

Mouser is now stocking the BHI385 smart inertial measurement unit (IMU) from Bosch. The BHI385 is an intelligent sensor system that delivers accurate acceleration measurement up to ±28 g – enabling precise motion analysis for high-impact events across sports, fitness, and gaming. The sensor combines a gyroscope and accelerometer with embedded AI software and an integrated 32-bit microprocessor, creating a complete programmable system based on Bosch Sensortec’s field-proven IMU platform.

The BHI385 sensor’s embedded AI supports key motion functions, including 6DoF/9DoF sensor fusion, step counting, activity recognition, and gesture detection (single/double/triple tap). Self-learning cyclic gesture recognition allows it to detect repeated motion patterns and adapt them to the individual, recognizing what is being done and how well it is being performed. This enables advanced use cases such as quality-of-movement evaluation in sports or rehabilitation training.

All processing runs on the integrated low-power processor, avoiding wake-up calls to the host CPU. Typical current consumption is less than 500 μA at 50 Hz for sensor fusion, and under 50 μA for simpler accelerometer-based algorithms.

The BHI385 is offered in a compact 20-pin LGA package measuring 2.5 x 3.0 x 0.95 mm³. Low power consumption and embedded intelligence make it a perfect fit for wearables, hearables, and edge AI systems.

The BHI385 IMU is supported by the BHI385 Shuttle Board 3.0. Enabling the evaluation of the BHI385 smart sensor, the Shuttle Board 3.0 also includes a BME688 AI-based environmental sensor, a BMM350 magnetometer, and an onboard pressure sensor. The BHI385 Shuttle Board 3.0 includes essential passive components and provides access to all sensor pins, making it ideal for standalone testing and integration into larger development systems. The Shuttle Board is designed to work with the Bosch Application Board 3.1 sensor prototyping platform. Bosch’s Motion AI Studio supports fast time-to-market, while the Open SDK enables custom machine learning model integration.

https://www.mouser.com

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Mouser presents new eBook on miniaturised electronics design from ADI and Molex

Mouser has announced a new eBook, in collaboration with Analog Devices, Inc. (ADI) and Molex, that explores the forefront of miniaturisation trends shaping our future.

Across nearly all industries, engineers are being asked to deliver more compact designs for a wide range of purposes. Whether they are wearables for consumers and healthcare, instrumentation advances, or industrial automation solutions, today’s systems are expected to occupy less space and consume less power without sacrificing performance or reliability. In 11 Experts on Miniaturised Electronics Design and Applications, engineers from ADI, Molex, and other companies discuss the many challenges designers face while working towards system miniaturisation. The eBook also highlights several products, available at Mouser, that both ADI and Molex offer to support this transition through advances in integration, packaging, and interconnect design.

The EVAL-ADAQ4224-FMCZ evaluation board provides a demonstration and development platform for ADI’s ADAQ4224 μModule Data-Acquisition (DAQ) System-in-Package (SiP) solution. The ADAQ4224 DAQ integrates the critical passive components required in a data acquisition solution into a single component, using ADI’s iPassives technology, minimising temperature-dependent error sources and offering optimised performance.

The EVAL-AD3530RARDZ evaluation board enables prototyping with ADI’s AD3530 and AD3530R Digital-to-analog converters (DACs). The AD3530 and AD3530R DACs include integrated multiplexers that facilitate monitoring of output voltages, currents, and internal die temperature. The devices incorporate power-on reset (POR) circuits that ensure the DACs output power up to and present at 32kΩ to ground until a valid write is executed. The AD3530R also offers a 2.5V, 5ppm/°C internal reference that is disabled by default.

The Quad-Row board-to-board connectors from Molex feature a staggered circuit layout and a 0.175 mm pitch low-profile design for 30% space savings over conventional connectors. These patent-pending connectors offer product developers and device manufacturers greater freedom and flexibility to support compact form factors, making them ideal for augmented reality/virtual reality automotive, communications, IoT, and other space-constrained applications.

The Molex Easy-On FFC/FPC Connectors are ideal for tight packaging applications and offer an overall compact size for maximum space savings, along with contact assurance and easy operation. These connectors are provided in pitch sizes from 0.20 to 2.00 mm, circuit sizes from 2 to 96, and with actuator types that include front flip, back flip, slider, one-touch and low-insertion force, in a right-angle or vertical orientation.

To read the new eBook, visit https://resources.mouser.com

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