Renesas introduces new RA0 series based on the Arm Cortex-M23 processor

The new devices offer extremely low power consumption, extended temperature range, and a wide variety of peripheral functions and safety features.

RA0E2 MCUs are fully compatible with RA0E1 devices, offering pin-expansion while maintaining the same peripherals and ultra-low power. This compatibility lets customers re-use existing software assets. The new devices deliver industry-leading power consumption of only 2.8mA current in active mode, and 0.89 mA in sleep mode. In addition, an integrated High-speed On-Chip Oscillator (HOCO) enables the fastest wake-up time for this class of microcontroller. The fast wake-up enables the RA0 MCUs to stay in Software Standby mode more of the time, where power consumption drops to a minuscule 0.25 µA.

Renesas’ RA0E1 and RA0E2 ultra-low power MCUs deliver an ideal solution for battery-operated consumer electronics devices, small appliances, industrial system control and building automation application.

The RA0E2 devices have a feature set optimised for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0 MCUs also integrate timers, serial communications, analog functions, safety functions and security functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 5mm x 5mm 32-lead QFN.

In addition, the new MCU’s high-precision (±1.0%) HOCO improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs in the industry, it maintains this precision in environments from -40°C to 125°C. This wide temperature range enables customers to avoid costly and time-consuming “trimming,” even after the reflow process.

Key Features of the RA0E2 Group MCUs
Core: 32MHz Arm Cortex-M23
Memory: Up to 128KB integrated Code Flash memory and 16KB SRAM
Extended Temperature Range: Ta -40°C to 125°C
Timers: Timer array unit (16b x 8 channels), 32-bit interval timer (8b x 4 channels), RTC
Communications Peripherals: 3 UARTs, 2 Async UART, 6 Simplified SPIs, 2 I2C, 6 Simplified I2Cs
Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage
Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, output level detection, CRC calculator, register write protection
Security: Unique ID, TRNG, AES libraries, Flash read protection
Packages: 32- and 48-lead QFNs, 32-, 48-, and 64-pin LQFP

The new RA0E2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA0E1 designs to larger RA0E2 devices if customers wish to do so.

https://www.renesas.com/RA0E2

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Infineon introduces new generation of IGBT and RC-IGBT devices

The market for electric vehicles continues to gather pace with a strong volume growth of both battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). The share of electric vehicles produced is expected to see double-digit growth by 2030 with a share of around 45 percent compared to 20 percent in 2024. Infineon is responding to the growing demand for high-voltage automotive IGBT chips by launching a new generation of products. Among these offerings are the EDT3 (Electric Drive Train, 3 rd generation) chips, designed for 400 V and 800 V systems, and the RC-IGBT chips, tailored specifically for 800 V systems. These devices enhance the performance of electric drivetrain systems, making them particularly suitable for automotive applications.

The EDT3 and RC-IGBT bare dies have been engineered to deliver high-quality and reliable performance, empowering customers to create custom power modules. The new generation EDT3 represents a significant advancement over the EDT2, achieving up to 20 percent lower total losses at high loads while maintaining efficiency at low loads. This achievement is due to optimisations that minimise chip losses and increase the maximum junction temperature, balancing high-load performance and low-load efficiency. As a result, electric vehicles using EDT3 chips achieve an extended range and reduce energy consumption, providing a more sustainable and cost-effective driving experience.

The EDT3 chipsets, which are available in 750 V and 1200 V classes, deliver high output current, making them well-suited for main inverter applications in a diverse range of electric vehicles, including battery electric vehicles, plug-in hybrid electric vehicles, and range-extended electric vehicles (REEVs). There reduced chip size and optimised design facilitate the creation of smaller modules, consequently leading to lower overall system costs. Moreover, with a maximum virtual junction temperature of 185°C and a maximum collector-emitter voltage rating of up to 750 V and 1200 V, these devices are well-suited for high-performance applications, enabling automakers to design more efficient and reliable powertrains that can help extend driving range and reduce emissions.

The 1200 V RC-IGBT elevates performance by integrating IGBT and diode functions on a single die, delivering an even higher current density compared to separate IGBT and diode chipset solutions. This advancement translates into a system cost benefit, attributed to the increased current density, scalable chip size, and reduced assembly effort.

Infineon’s latest EDT3 IGBT chip technology is now integrated into the HybridPACK Drive G2 automotive power module, delivering enhanced performance and capabilities across the module portfolio. This module offers a power range of up to 250 kW within the 750 V and 1200 V classes, enhanced ease of use, and new features such as an integration option for next-generation phase current sensors and on-chip temperature sensing, contributing to system cost improvements.

All chip devices are offered with customised chip layouts, including on-chip temperature and current sensors. Additionally, metallisation options for sintering, soldering and bonding are available on request.

https://www.infineon.com

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Microchip integrates buck converters, LDOs and a controller

The rapid integration of AI into industrial, computing and data centre applications is fuelling a growing demand for more efficient and advanced power management solutions. Microchip has announced the MCP16701, a Power Management Integrated Circuit (PMIC) designed to meet the needs of high-performance MPU and FPGA designers. The MCP16701 integrates eight 1.5A buck converters that can be paralleled, four 300 mA internal Low Dropout Voltage Regulators (LDOs) and a controller to drive external MOSFETs.

This highly integrated device can result in a 48% area reduction with less than 60% of the component count of a discrete solution. The MCP16701 is in a small-form-factor 8 mm × 8 mm VQFN package to offer a compact and flexible power management solution for space-constrained applications. The MCP16701 meets diverse power needs and supports Microchip’s PIC64-GX MPU and PolarFire® FPGAs with a configurable feature set.

The MCP16701 features an I2C communication interface to simply and enhance communication efficiency between the PMIC and other system components. The device operates within a temperature range of TJ −40°C to +105°C for reliable performance in diverse environmental conditions.

A key feature of the MCP16701 is its ability to dynamically change Vout levels for all converters in 12.5 mV/25 mV increments. This maximum flexibility allows designers to fine-tune power delivery to meet specific application requirements, helping enhance overall system efficiency and performance.

The MCP16701 joins a family of Microchip PMIC products, including the MCP16502, MCP16501 and others—that are used to power high-performance MPU applications targeting industrial computing, data centres, IoT and edge AI.

https://www.microchip.com

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u-blox introduces ANNA-B5 a compact, powerful and secure Bluetooth LE module

u-blox has announced the launch of the ANNA-B5 Bluetooth LE module. Built on Nordic Semiconductor’s next-generation wireless SoC, the nRF54L15 chipset is an ultra-compact module (6.5 × 6.5 mm) featuring a fully integrated antenna on the module, high security, a powerful MCU as well as distance measurements capabilities.

Designed with a new antenna solution for size-constrained, battery-powered applications, the ANNA-B5 delivers robust performance across industrial automation, smart home/smart building, healthcare, asset tracking and a broad range of other segments. Supporting Bluetooth LE, 802.15.4 with Thread, Zigbee, and Matter, ANNA-B5 ensures seamless connectivity. Qualified against Bluetooth® Core 6.0, the System in Package (SiP) module includes Bluetooth® Channel Sounding, providing more accurate range measurements.

With its next-generation security features, including physical tamper detection, secure boot, secure storage, and a crypto accelerator, it is designed to meet PSA Certified Level 3. This makes it an ideal choice for applications that require advanced security and compliance with the latest regulatory requirements, ensuring long-term viability in the evolving IoT landscape.

The ANNA-B5 module is powered by the Nordic Semiconductor nRF54L15 ultra-low power wireless SoC, featuring an Arm Cortex-M33 MCU running at 128 MHz, 256 kB of RAM, and 1.5 MB of non-volatile memory. Optimised for ultra-low power consumption, it is ideal for applications demanding extended battery life.

The module’s compact size (6.5 × 6.5 × 1.2 mm) with a fully integrated antenna makes it suitable for a wide range of IoT devices. Its compatibility with other u-blox ANNA modules is key to effortless technology migration, such as transitioning to the latest generation of Bluetooth LE modules.

With its professional-grade u-connectXpress software, ANNA-B5 ensures reduced compliance costs, faster time to market, and seamless international deployment.

https://www.u-blox.com

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