New ST  Bluetooth 5.4 / Thread module for smart and IoT applications now at Mouser

Mouser Electronics is now shipping the new ST67W Wi-Fi 6 / Bluetooth 5.4 / Thread module from STMicroelectronics. The ST67W Module simplifies the development of next-generation wireless solutions for smart homes, smart appliances, healthcare, and industrial IoT applications.

The STMicroelectronics ST67W module, available from Mouser, is powered by Qualcomm’s high-performance 1 × 1 2.4GHz Wi‑Fi 6 and Bluetooth 5.4 QCC743 microcontroller, with support for Matter protocol over Wi-Fi that operates as a future-proof IoT connectivity transceiver, together with an external STM32 host MCU for running applications.

The ST67W module is ready to integrate with any STM32 MCU with all RF front-end circuitry built-in, including power/low-noise amplifiers, the RF switch, balun, and integrated PCB antenna, with 4Mbyte Flash for code and data storage and a 40MHz crystal. The module’s security features, cryptographic accelerators and services, including secure boot and debug reaching PSA Certified Level 1, make it easy for designers to comply with the upcoming Cyber Resilience Act and RED directives. The STMicroelectronics ST67W module is self-contained, pre-certified, and comes in a 32-lead LGA package ready for board placement. The module is offered with a PCB antenna (version B) or an RF connector for an external antenna (version U).

The STMicroelectronics X-NUCLEO-67W61M1 expansion board, also available from Mouser, is a versatile development tool for the ST67W module. The expansion board can be used with the ARDUINO® Uno V3 and Raspberry Pi boards, and is stackable on ST’s Nucleo-64, Nucleo-144, and Discovery boards.

https://www.mouser.com

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Easily integrate technology with Microchip’s portfolio of GNSS disciplined oscillator modules

Aerospace and defence applications rely on Position, Navigation and Timing (PNT) technology for mission-critical accuracy and reliability. However, integrating PNT into a design requires extensive domain knowledge in this area. To fast track the development process, Microchip has announced its portfolio of GNSS Disciplined Oscillator (GNSSDO) Modules that integrate the company’s embedded atomic clock and oscillator technologies, including the Chip-Scale Atomic Clock (CSAC), Miniature Atomic Clock (MAC) and Oven-Controlled Quartz Crystal Oscillators (OCXOs).

The GNSSDO modules process reference signals from GNSS or an alternative clock source and disciplines the on-board oscillator to the reference signal, enabling precise timing, stability and holdover performance based on end application requirements. These GNSSDOs are used in military and defence applications such as radar, satellite communications (SATCOM), mounted and dismounted radios, vehicle platforms and other critical PNT applications including GNSS-denied environments.

A GNSSDO module acts as a PNT subsystem within a larger system design or as a stand-alone system, providing precise timing that is critical to any high-performance system. The local oscillators used in the GNSSDO modules are engineered and manufactured by Microchip, ensuring customers have a product that they can trust. Other Microchip components on the module include 32-bit microcontrollers (MCUs) and SmartFusion® 2 FPGAs.

Microchip’s newly released GNSSDO modules include:

• The MD-013 ULTRA CLEAN is Microchip’s highest performance standard GNSSDO module that can support multiple GNSS constellations, including GPS, Galileo, BeiDou, and NavIC or an external reference input. This module is designed around a high-performance OCXO that enables outputs with ultra-low phase noise and short-term frequency stability characteristics. The respective specifications for phase noise performance are −119 dBc/Hz at a 1 Hz offset and noise floor of −165 dBc/Hz. Short-term frequency stability, measured by Allan Deviation (ADEV), is 3E-13 at 1s tau, 6E-13 at 10s tau and 9E-13 at 100s tau.

This module can generate 1 PPS TTL, 10 MHz sine wave and 10 MHz square wave outputs that are disciplined to an embedded 72-channel single-band GNSS receiver, with the option to upgrade to a configurable L1/L2 or L1/L5 dual-band, multi-GNSS receiver.

• The MD-300 is Microchip’s GNSSDO module for harsh environments, available in a small 1.5 × 2.5-inch footprint. The MD-300 has an embedded MEMS OCXO or TCXO as the local oscillator, enabling low g-sensitivity, high shock and vibration tolerance and low thermal transient response. Due to its Size, Weight and Power (SWaP) performance, the MD-300 is well-suited for applications like drones and manpacks. The module can discipline to an embedded GNSS receiver or external reference and output high- performance 10 MHz and 1 PPS signals.

• The LM-010 is a PPS disciplined module that provides precise timing for Low Earth Orbit (LEO) applications that demand radiation tolerance coupled with stability and holdover capability. As a standard platform module, the LM-010 provides both 1 PPS TTL and 10 MHz sinewave outputs that are disciplined to an external reference input. Internal to the module is Microchip’s digitally corrected OCXO or low-power CSAC SA.45.

Microchip’s GNSSDO modules utilise a common serial communication protocol and Graphical User Interface (GUI) for command and control of the unit. A variety of parameters can be configured through the software including inputs, outputs, auto switching, holdover parameters, GNSS tracking and observables, as well as reporting messages coming off the serial interface.

Development Tools
The GNSSDO portfolio is supported by Microchip’s VDOM3 software and GUI to help developers adjust performance parameters of the GNSSDO modules and quickly test integrating these products into their systems. The MD-01X Evaluation Kit is also available to easily connect and monitor the MD-01 series of GNSSDOs.

https://www.microchip.com

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Renesas introduces ultra-low-power MCUs for next-generation smart home appliances

Renesas has introduced the new 16-bit RL78/L23 microcontroller (MCU) group, expanding its low-power RL78 family. Running at 32MHz, the RL78/L23 MCUs combine industry-leading low-power performance with essential features such as dual-bank flash memory, segment LCD control, and capacitive touch functionality to support smart home appliances, consumer electronics, IoT and metering systems. These compact devices address the performance and power requirements of modern display-based human-machine interface (HMI) applications.

The RL78/L23 is optimised for ultra-low power consumption and ideal for battery-powered applications that spend the majority of time in standby. They offer an active current of just 109μA/MHz and a standby current as low as 0.365μA, along with a fast 1μs wake-up time to help minimise CPU activity. The LCD controller’s new reference mode, VL4, reduces LCD operating current by approximately 30 percent when compared to the existing RL78/L1X group. The MCUs come with SMS (SNOOZE Mode Sequencer), which enables dynamic LCD segment display without CPU intervention. By offloading tasks to the SMS, the devices minimise CPU wake-ups and contribute to system-level power savings.

The RL78/L23 offers a wide operating voltage range of 1.6V to 5.5V, which supports direct operation from 5V power supplies commonly used in home appliances and industrial systems. This capability reduces the need for external voltage regulators. The MCUs also integrate key components such as capacitive touch sensing, a temperature sensor, and internal oscillator, reducing BOM cost and PCB size.

Its built-in segment LCD controller and capacitive touch realize sleek, responsive user interfaces for products such as induction cooktops and HVAC systems. The IH timer (Timer KB40) enables precise multi-channel heat control, which is essential in smart kitchen appliances such as rice cookers and IH cooktops. The devices include dual-bank flash memory for seamless firmware updates via FOTA (Firmware Over-the-Air), allowing continuous system operation in applications like metering, where downtime must be minimised. The dual-bank architecture allows one memory bank to run the user program, while the other receives updates. This approach keeps the system functional throughout the process for improved reliability.

The RL78/L23 comes with an easy-to-use development environment. Developers can leverage support tools such as Smart Configurator and QE for Capacitive Touch to streamline system design. Renesas offers the RL78/L23 Fast Prototyping Board which is compatible with Arduino IDE, and a capacitive touch evaluation system for in-depth testing and validation.

https://renesas.com

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Infineon introduces 75 mΩ industrial CoolSiC MOSFETs for medium-power applications

Infineon is expanding its CoolSiC MOSFETs 650 V G2 portfolio with new 75 mΩ variants to meet the demand for more compact and powerful systems. The devices are available in multiple package options, including TOLL, ThinTOLL 8×8, TOLT, D2PAK, TO247-3, and TO247-4. As a result, the product family supports both Top Side Cooling (TSC) and Bottom Side Cooling (BSC) approaches and offers developers a high degree of flexibility. The devices are ideal for high- and medium-power switching mode power supplies (SMPS) in different applications, including AI servers, renewable energy, electric vehicle and e-mobility chargers, humanoid robot chargers, televisions, and drives.

The CoolSiC MOSFETs 650 V G2 are based on the second-generation (G2) of CoolSiC technology and offer improved figures of merit, higher reliability, and enhanced ease of use compared to the previous generation. The different packages offer various advantages: TOLL and ThinTOLL 8×8 packages provide high thermal cycle stability on the PCB and enable compact system designs. When used in SMPS, they reduce the space requirements on the PCB and lower manufacturing costs at the system level. The list of target applications for TOLL and ThinTOLL 8×8 has been expanded, enabling PCB designers to address cost-reduction challenges. The addition of TOLT strengthens Infineon’s growing TSC product family, which also includes CoolMOS 8, CoolSiC, CoolGaN and Optimos. The TSC variants allow up to 95 percent direct heat dissipation and enable designers to use both sides of the PCB, improving space utilisation and reducing parasitic effects.

https://www.infineon.com

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