Infineon PSOC Control C3 MCUs for Next-Generation Motor Control now at mouser

Mouser is now stocking the PSOC Control C3 microcontrollers (MCUs) from Infineon Technologies. The PSOC Control C3 MCUs combine power and performance, allowing designers to bring the next generation of industrial solutions to the market. Developed specifically for motor control applications, the PSOC Control CM3 product line is ideal for EV charging, industrial motor control, robotics, server and telecom power supply units (PSUs), and smart home appliances.

The Infineon Technologies PSOC Control C3 microcontrollers, now available at Mouser, feature an Arm® Cortex®-M33-based core with real-time control for high-performance motor control products. A 12-bit, 12-Msps ADC with true synchronous “idle” sampling of up to 16 analogue signals delivers results up to 25% faster without sampling jitter, while a CORDIC Accelerator can switch off the CPU and increase computational power for real-time critical tasks. The PSOC MCUs also integrate a programmable timer/counter pulse-width modulator (TCPWM) with a Motion Interface (MOTIF) block that can be used to communicate motor control signals. These dedicated subsystems allow the PSOC MCU to reduce the system bill of materials (BOM) while improving the performance of next-gen products. The PSOC Control MCUs are PSA Certified™ Level 2, featuring advanced security features such as cryptography, secure boot, and processing isolation. The MCUs are delivered with ready-to-use code examples and development tools supported in the ModusToolbox™ software suite.

Infineon Technologies offers two development kits for the PSOC Control C3 Microcontrollers. The PSOC Control C3M5 Evaluation Kit is for developing motor control solutions using PSOC Control C3. The kit includes a PSOC Control C3M5 EVK board, a USB Type-A to USB Type-C® cable, jumper wires, and a quick start guide. The PSOC Control C3M5 Complete System Motor Control Kit offers a C3M5 motor control card for developing motor control solutions in combination with power stage evaluation boards.

https://eu.mouser.com

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Microchip enhances their digital signal controller lineup

Evolving security and functional safety demands, coupled with the growing complexity of real-time embedded applications, are driving designers to seek innovative solutions that deliver greater accuracy, improved reliability and compliance with industry standards. To address these challenges, Microchip Technology has added the dsPIC33AK512MPS512 and dsPIC33AK512MC510 Digital Signal Controller (DSC) families to its dsPIC33A DSC product line. The devices enable the implementation of computation-intensive control algorithms for improved energy efficiency in motor control, AI server power supplies, energy storage systems and complex sensor signal processing with Machine Learning (ML)-based inferencing.

The dsPIC33AK512MPS family delivers precise, high-speed control through 78 ps high-resolution Pulse Width Modulations (PWMs) and low-latency 40 Msps ADCs, enabling fast and accurate control loops essential for optimising the performance of Silicon Carbide (SiC) and Gallium Nitride (GaN)-based DC-DC converters. Additionally, dsPIC33AK512MPS devices include advanced security features, an integrated touch controller and a high pin count of up to 128 pins. The dsPIC33AK512MC family is designed to offer low-latency, 40 Msps ADCs and 1.25 ns PWM resolution, providing a feature- and cost-optimised solution for multi-motor control and complex embedded applications.

The dsPIC33A DSC families, with up to 512 KB Flash and a rich peripheral set, integrate a double precision floating-point unit to accelerate mathematical computations and leverage a 32-bit architecture for seamless adoption of model-based design code. Their enhanced instruction set and Digital Signal Processing (DSP) capabilities, including single-cycle MAC operations and a 200 MHz core speed, make these devices highly efficient for low-latency, real-time control applications. Supported by MPLAB Machine Learning Development Suite, dsPIC33A devices streamline the ML workflow by automating data preparation, feature extraction, training, validation and firmware conversion of optimized models.

With a range of hardware safety features, dsPIC33AK512MPS/MC DSCs are compliant with functional safety standards and are developed in accordance with International Organisation for Standardisation (ISO) 26262 and International Electrotechnical Commission (IEC) 61508 processes, making them suitable for safety-critical automotive and industrial applications. To further enhance system-level security, the dsPIC33AK512MPS DSC family includes integrated crypto accelerators and a Flash security module, enabling immutable root of trust, secure boot, secure firmware upgrades and secure debug capabilities.

https://www.microchip.com

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Infineon expands ID portfolio for enhanced flexibility and faster time-to-market

Electronic identification (eID) documents are seeing growing demand worldwide as governments push ahead with their digitalisation efforts. To meet these rapidly evolving requirements more quickly and flexibly, Infineon has introduced two new solutions, SECORA ID V2 and the eID-OS. These solutions offer local security printers and card manufacturers greater flexibility in selecting the right solution for their specific project requirements, while helping to reduce development time and accelerate deployment.

SECORA ID V2 is the successor to the SECORA ID V1 Java Card solution for electronic ID and authentication applications in the public sector. The V2 version of SECORA ID increases transaction speed by up to 80 percent compared to its predecessor. It is based on a 40 nm hardware architecture and can transfer data at speeds of up to 6.8 MBit/s. This enables faster personalisation and processing of ID documents and allows for quick and smooth identity checks at borders and security checkpoints. SECORA ID V2 is based on the latest Java Card 3.1 standard and supports biometric match-on-card functions to increase user data protection. Customers benefit from Infineon’s broad applet toolset. It also supports payment tools such as Visa, Mastercard, and Calypso as well as the crypto vision ePasslet Suite. This wide range of applets enables developers to easily integrate and quickly deploy highly customised ID solutions. Furthermore, the sandbox enables the integration of native code without compromising security standards. The SECORA ID V2 platform is Common Criteria EAL6+(high) certified and EMVCo approved.

Infineon eID-OS is the latest addition to the portfolio of native solutions, combining the latest TEGRION security controller with a native operating system. Designed for basic ID application projects, it offers a performance and cost-optimised solution with fast time-to-market. The standards compliant solution is targeting CC EAL 5+ eMRTD (Common Criteria Evaluation Assurance Level for electronic Machine Readable Travel Document) certification and is housed in advanced packaging technology. It optimises the development process, enables rapid deployment, and reduces maintenance costs. Featuring a powerful 32-bit CPU, advanced cryptography accelerators, and the robust Integrity Guard 32 security architecture, eID-OS enables fast and secured transactions with processing times of less than 0.5 seconds. Thanks to simplified implementation, personalisation, and administration, as well as a secured chain of trust and automatic data size detection, customers benefit from low total cost of ownership. In addition, Infineon’s ultra-thin contactless coil-on-module package supports thinner electronic data pages, reducing document costs and the carbon footprint. The space saved can alternatively be used for an additional security layer, making this solution ideal for modern eID projects.

http://www.infineon.com

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ST announces mass production for turnkey Bluetooth/Wi-Fi modules developed with Qualcomm

STMicroelectronics has announced mass-production start for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module, describing the early success of Siana, a lead customer for its fast-to-market connectivity.

The module is the first product of ST’s collaboration with Qualcomm Technologies, announced by the two companies in 2024, to simplify implementing wireless connectivity in systems containing STM32 microcontrollers (MCUs). Their vision, now realised in silicon, fuses ST’s expertise in embedded design and the STM32 ecosystem of microcontrollers, software, and development tools integrated with Qualcomm Technologies’ wireless connectivity technologies.

“Wireless connectivity is a key enabler for the cloud-connected intelligent edge and demand for smart, connected devices continues to expand and accelerate throughout consumer and industrial markets,” said Jerome Vanthournout, Connectivity Business Line Director, STMicroelectronics. “Mastering the complex Wi-Fi and Bluetooth protocols, and bringing that connectivity to devices and IoT applications, are huge challenges. Our modular solution, created with industry-leading knowhow of all aspects, lets product developers focus their resources at the application level and bring new products to market quickly.”

Shishir Gupta, Senior Director, Product Management at Qualcomm Technologies added, “Qualcomm Technologies is thrilled to see the impact of our collaboration with STMicroelectronics through the ST67W module. This module, which contains Qualcomm Technologies’ wireless connectivity components, not only simplifies the integration of Wi-Fi and Bluetooth into a wide range of devices powered by STM32 microcontrollers but also offers incredible flexibility and scalability. This module is a testament to our joint commitment to driving innovation and excellence in the IoT space.”

The ST67W module is ready to integrate with any STM32 MCU and contains a Qualcomm Technologies multiprotocol network coprocessor and 2.4GHz radio. All RF front-end circuitry is built-in, including power/low-noise amplifiers, the RF switch, balun, and integrated PCB antenna, with 4Mbyte Flash for code and data storage and a 40MHz crystal. The module comes pre-loaded with Wi-Fi 6 and Bluetooth 5.4 and is pre-certified according to mandatory specifications. Thread and Matter will be supported soon via software update. There is also an optional coaxial antenna or board-level connections for an external antenna. Security is handled with cryptographic accelerators and services including secure boot and secure debug reaching PSA Certified Level 1, making it easy for customers to comply with the upcoming Cyber Resilience Act and RED directives.

Product developers need no RF design expertise to create a working solution using this module. Highly integrated in a 32-lead LGA package, it is ready to place on the board and permits simple, low-cost PCB designs with as few as two layers.

Siana Systems is among the first IoT technology companies to explore the opportunities this wireless connectivity module brings to enhance product performance and accelerate time to market.

“The ST67W module expands opportunities to add Wi-Fi to devices powered by various STM32 microcontrollers and worry less about the minimum requirements. We can simply integrate the module and quickly get Bluetooth and Wi-Fi connectivity, with minimal additional engineering, which provides us with a simple go-to solution for our next generation designs,” said Sylvain Bernard, Founder and Solution Architect, Siana Systems. “The module’s RF performance, with the radio and front-end circuitry integrated, is very strong, and the flexible power management with fast wake-up times lets us create extremely energy-efficient new products.”

The ST67W611M1 leverages the STM32 ecosystem, which contains over 4,000 commercial part numbers, powerful STM32Cube tools and software, and enhancements that boost edge AI development. The STM32 family covers a broad spectrum from economical Arm® Cortex®-M0+ devices to variants with high-performing cores like Cortex-M55, Cortex-M4 with DSP extensions, and Cortex-A7 in the STM32MP1/2 MPUs.

http://www.st.com

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