Infineon expands XENSIV MEMS microphone lineup

Infineon has expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones designed for exceptional audio performance, energy efficiency, and robustness. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water and dust (IP57), making them suitable for use in demanding environments.

The IM72D128V is distinguished by its top-tier Signal-to-Noise Ratio (SNR) of 71.5 dB(A), making it particularly suited for applications requiring precise low-noise audio pick-up. It operates at ultra-low power consumption, with 430 µA in high-performance mode and 160 µA in low-power mode, which makes it ideal for energy-efficient, battery-powered devices such as high-end headphones. With a footprint of 4 x 3 x 1.2 mm³, it is still small enough to fit most space constraint consumer devices.

The IM69D129F is tailored for compact design, with a footprint of 3.5 x 2.65 x 0.98 mm³, which makes it ideal for space-constrained devices. It achieves reliable audio performance with an SNR of 69 dB(A) and features low power consumption, operating at 450 µA in high-performance mode and 170 µA in low-power mode, contributing to extended battery life in portable devices ensuring extended battery life. Its small size makes it particularly suited for multi-microphone designs in compact systems. The devices can be used in Active Noise Cancellation (ANC) headphones and earbuds, as well as high-quality audio capturing in laptops, tablets, conference systems, and cameras.

The IM72D128V and IM69D129F also support Voice User Interface (VUI) applications in smart speakers, automotive infotainment, IoT devices, and home and industrial automation. Furthermore, both microphones can be used in industrial or home monitoring applications that require audio pattern detection, such as industrial monitoring and home security systems.

In addition, the IM72D128V and IM69D129F are equipped with a low-noise preamplifier and a sigma-delta ADC, providing digital PDM output for seamless integration into modern audio systems. Their shared features include an 11 Hz flat frequency response for precise sound reproduction and a ±1 dB sensitivity tolerance, making them ideal for multi-microphone arrays. Whether used for far-field audio pick-up or portable devices, these microphones enable high-quality audio capturing in challenging environments while enhancing energy efficiency and reliability. Both microphones comply with IEC (60747, 60749) and JEDEC (47/20/22) standards, ensuring reliability and robustness for consumer and industrial applications.

www.infineon.com/mems

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Farnell enhances wireless connectivity offering with Digi International solutions

Farnell is now distributing connectivity solutions from Digi International, a leading global provider of Internet of Things (IoT) connectivity products, services and solutions.

The new relationship is an expansion of Avnet’s existing relationship with Digi and will enhance Farnell’s wireless communications portfolio. It will also enable Digi to utilise the “power of one,” which is the combined strength of Farnell and its parent company Avnet across the product lifecycle. With Avnet and Farnell, customers will be able to find the best solution for their needs around the globe.

Digi International supplies secure embedded technology and connectivity such as system-on-modules, wireless communication systems, and cloud management software to developers in a diverse range of industries, including education, energy, industrial, medical, retail, smart cities and transportation. In every case, it is committed to ensuring that each customer is provided with precisely the right technology for their wireless connectivity requirements.

Steve Ericson, Senior Vice President and General Manager of Digi OEM Solutions said, “We are very excited about leveraging the combined power of both Farnell and Avnet and look forward to expanding our customer base by leveraging Farnell’s expertise and global reach. We have always looked to partner with like-minded companies to ensure our customers have an ecosystem of options that seamlessly integrate, extend value, and bring the future of IoT communications to drive their business.”

Digi’s featured technologies include a range of solutions to support Bluetooth, cellular IoT, edge computing, Fixed Wireless Access, LoRaWAN, 5G, Zigbee Wireless Mesh, and more.

Rebeca Obregon, President, Farnell, said, “We are delighted to grow our distribution relationship with Digi and expand our M2M and IoT product offerings. The alliance will enhance our customer experience, and we look forward to further infusing Digi’s excellent range of solutions with our global distribution presence and marketplace knowledge.

https://uk.farnell.com

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TI unveils the industry’s most sensitive in-plane Hall-effect switch

Texas Instruments has introduced the industry’s most sensitive in-plane Hall-effect switch for position sensing, offering engineers a cost-effective, user-friendly alternative to magnetoresistive sensors. TI’s TMAG5134 Hall-effect switch features an integrated a magnetic concentrator, enabling it to detect magnetic fields as weak as 1mT in applications such as door and window sensors, personal electronics, home appliances, and more. This level of sensitivity allows for the use of smaller magnets, further reducing system-level costs. Additionally, the TMAG5134’s in-plane sensing capability enables it to detect magnetic fields parallel or horizontal to a printed circuit board, giving engineers greater design flexibility.

Engineers seeking high sensitivity levels in low-power, compact position-sensing designs today rely on reed switches or tunnel magnetoresistive (TMR), anisotropic magnetoresistive (AMR) or giant magnetoresistive (GMR) sensors. However, these technologies often come with high costs and manufacturing complexities because they require specialised materials and fabrication techniques. In contrast, Hall-effect technology eliminates the need for specialised manufacturing and enables engineers to significantly reduce design costs and speed time to market.

Historically, designers have not considered Hall-effect switches as viable replacements for TMR, AMR, GMR or reed switches because of their limited sensitivity. The introduction of TI’s TMAG5134 represents a fundamental shift for the position sensing market; engineers can now achieve greater sensitivity than traditional Hall-effect sensors without the additional cost and complexity of magnetoresistive sensors.

“The electronics we interact with in our daily lives, from our laptops to our smart home systems, use sensors to help make decisions based on the world around them,” said Jason Cole, vice president and general manager, Sensing Products at TI. “For decades, TI’s sensing portfolio has enabled engineers to achieve greater accuracy, power efficiency and reliability in their designs. The TMAG5134 Hall-effect switch builds on these years of innovation, delivering a simplified, cost-effective solution that creates new possibilities for design engineers across industries.”

The TMAG5134 Hall-effect switch helps extend battery life in sensing applications by consuming just 0.6µA on average. Its integrated magnetic concentrator technology amplifies the sensor signal, eliminating the need to bias the device with as much current.

https://www.ti.com

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New ST  Bluetooth 5.4 / Thread module for smart and IoT applications now at Mouser

Mouser Electronics is now shipping the new ST67W Wi-Fi 6 / Bluetooth 5.4 / Thread module from STMicroelectronics. The ST67W Module simplifies the development of next-generation wireless solutions for smart homes, smart appliances, healthcare, and industrial IoT applications.

The STMicroelectronics ST67W module, available from Mouser, is powered by Qualcomm’s high-performance 1 × 1 2.4GHz Wi‑Fi 6 and Bluetooth 5.4 QCC743 microcontroller, with support for Matter protocol over Wi-Fi that operates as a future-proof IoT connectivity transceiver, together with an external STM32 host MCU for running applications.

The ST67W module is ready to integrate with any STM32 MCU with all RF front-end circuitry built-in, including power/low-noise amplifiers, the RF switch, balun, and integrated PCB antenna, with 4Mbyte Flash for code and data storage and a 40MHz crystal. The module’s security features, cryptographic accelerators and services, including secure boot and debug reaching PSA Certified Level 1, make it easy for designers to comply with the upcoming Cyber Resilience Act and RED directives. The STMicroelectronics ST67W module is self-contained, pre-certified, and comes in a 32-lead LGA package ready for board placement. The module is offered with a PCB antenna (version B) or an RF connector for an external antenna (version U).

The STMicroelectronics X-NUCLEO-67W61M1 expansion board, also available from Mouser, is a versatile development tool for the ST67W module. The expansion board can be used with the ARDUINO® Uno V3 and Raspberry Pi boards, and is stackable on ST’s Nucleo-64, Nucleo-144, and Discovery boards.

https://www.mouser.com

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