ST announces mass production for turnkey Bluetooth/Wi-Fi modules developed with Qualcomm

STMicroelectronics has announced mass-production start for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module, describing the early success of Siana, a lead customer for its fast-to-market connectivity.

The module is the first product of ST’s collaboration with Qualcomm Technologies, announced by the two companies in 2024, to simplify implementing wireless connectivity in systems containing STM32 microcontrollers (MCUs). Their vision, now realised in silicon, fuses ST’s expertise in embedded design and the STM32 ecosystem of microcontrollers, software, and development tools integrated with Qualcomm Technologies’ wireless connectivity technologies.

“Wireless connectivity is a key enabler for the cloud-connected intelligent edge and demand for smart, connected devices continues to expand and accelerate throughout consumer and industrial markets,” said Jerome Vanthournout, Connectivity Business Line Director, STMicroelectronics. “Mastering the complex Wi-Fi and Bluetooth protocols, and bringing that connectivity to devices and IoT applications, are huge challenges. Our modular solution, created with industry-leading knowhow of all aspects, lets product developers focus their resources at the application level and bring new products to market quickly.”

Shishir Gupta, Senior Director, Product Management at Qualcomm Technologies added, “Qualcomm Technologies is thrilled to see the impact of our collaboration with STMicroelectronics through the ST67W module. This module, which contains Qualcomm Technologies’ wireless connectivity components, not only simplifies the integration of Wi-Fi and Bluetooth into a wide range of devices powered by STM32 microcontrollers but also offers incredible flexibility and scalability. This module is a testament to our joint commitment to driving innovation and excellence in the IoT space.”

The ST67W module is ready to integrate with any STM32 MCU and contains a Qualcomm Technologies multiprotocol network coprocessor and 2.4GHz radio. All RF front-end circuitry is built-in, including power/low-noise amplifiers, the RF switch, balun, and integrated PCB antenna, with 4Mbyte Flash for code and data storage and a 40MHz crystal. The module comes pre-loaded with Wi-Fi 6 and Bluetooth 5.4 and is pre-certified according to mandatory specifications. Thread and Matter will be supported soon via software update. There is also an optional coaxial antenna or board-level connections for an external antenna. Security is handled with cryptographic accelerators and services including secure boot and secure debug reaching PSA Certified Level 1, making it easy for customers to comply with the upcoming Cyber Resilience Act and RED directives.

Product developers need no RF design expertise to create a working solution using this module. Highly integrated in a 32-lead LGA package, it is ready to place on the board and permits simple, low-cost PCB designs with as few as two layers.

Siana Systems is among the first IoT technology companies to explore the opportunities this wireless connectivity module brings to enhance product performance and accelerate time to market.

“The ST67W module expands opportunities to add Wi-Fi to devices powered by various STM32 microcontrollers and worry less about the minimum requirements. We can simply integrate the module and quickly get Bluetooth and Wi-Fi connectivity, with minimal additional engineering, which provides us with a simple go-to solution for our next generation designs,” said Sylvain Bernard, Founder and Solution Architect, Siana Systems. “The module’s RF performance, with the radio and front-end circuitry integrated, is very strong, and the flexible power management with fast wake-up times lets us create extremely energy-efficient new products.”

The ST67W611M1 leverages the STM32 ecosystem, which contains over 4,000 commercial part numbers, powerful STM32Cube tools and software, and enhancements that boost edge AI development. The STM32 family covers a broad spectrum from economical Arm® Cortex®-M0+ devices to variants with high-performing cores like Cortex-M55, Cortex-M4 with DSP extensions, and Cortex-A7 in the STM32MP1/2 MPUs.

http://www.st.com

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BeagleBoard Wi-Fi 6 Bluetooth LE wireless modules now at Mouser

Mouser is now shipping the CC33 wireless modules from BeagleBoard. The BM3301 modules are high-performance 2.4GHz Wi-Fi® 6 and Bluetooth Low Energy 5.4 combo wireless modules for industrial IoT, automotive, smart home, consumer electronics, healthcare, and embedded systems applications.

The BeagleBoard CC33 wireless modules, available from Mouser, are powered by TI’s 10th-generation connectivity chip (CC3301), delivering application throughput of up to 50 Mbps and are designed for reliable performance in extreme conditions (-40°C to +85°C), making them ideal for diverse applications requiring robust wireless connectivity. There are two variants to this module: The BeagleMod BM3301-1313 is a 13mm × 13mm BGA module, footprint-compatible with the TI WL18xxMOD series for easy drop-in design upgrades. The BeagleMod BM3301-1216 is a 12mm × 16mm M.2 1216 LGA module that includes an IPEX Gen 4 connector, and a u.FL antenna connector to simplify board layout, with both featuring Wi-Fi 6, Bluetooth LE 5.4, and integrated 2.4 GHz PA for complete wireless solutions with up to +20.5 dBm output power.

Mouser also stocks the BeagleY-AI single-board computer (SBC), a low-cost, open-source, community-supported development platform in a familiar form factor compatible with other popular SBC accessories. It was developed to streamline the process of building smart human-machine interfaces (HMI), incorporating cameras and high-speed connectivity into a reliable embedded system. The BeagleY-AI SBC features a powerful 64-bit, quad-core A53 processor and numerous powerful AI accelerators paired with C7x DSPs capable of 4 TOPS (trillion-operations per second) combined (2 TOPS each), an integrated 50GFLOP GPU supporting up to three concurrent display outputs and modern connectivity with USB 3.1 and PCIe Gen 3. An onboard BeagleMod CC33 module (BM3301- 1313) provides Wi-Fi 6 and BLE 5.4 connectivity.

https://www.mouser.com

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Rutronik offers USB Type-C connectors from Molex for industrial and consumer applications

With USB Type-C connectors from Molex, Rutronik offers future-proof interface solutions for industrial and consumer electronics applications. The connectors support data rates of up to 40 Gbit/s (USB4), currents of up to 5.0 A and power delivery of up to 100 W – ideal for applications with high power requirements and limited space, such as portable medical devices, industrial electronics, AR / VR systems and smart home appliances.

Thanks to their compact design, IPX8-certified variants and high mechanical robustness (up to 10,000 mating cycles), the components are particularly suitable for applications where reliability and continuous operation are key. Various mounting options – including vertical, top and mid-mount versions – offer maximum design flexibility in a small space.

Benefits at a glance:
• USB4-compatible: data transfer rates up to 40 Gbit / s
• Power delivery capable: Up to 100 W charging power (5.0 A / 20 V)
• Metal-reinforced mating area for high mating cycles (up to 10,000 mating cycles)
• Mating force on PCB: 0
• Mating force: 5 to 20 N
• Unmating force: 8 to 20 N (1 to 30 cycles); 6 to 20 N (after 10,000 cycles)
• Sockets with liquid protection according to IPX8, thanks to LSR moulding (liquid silicone rubber) ·
• Variants with 6, 14, 16 or 24 contacts available

Application examples:
• Portable medical devices (e.g. glucose meters, inhalers)
• Smart home and (I)IoT components
• AR/VR end devices and wearables
• Industrial electronics, measuring and testing devices
• Cash register systems and projectors

https://www.rutronik.com/

 

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Rohm develops new compact surface-mount near-infrared LEDs

Rohm has expanded its portfolio of surface-mount near-infrared (NIR) LEDs with new compact top-view types. They are optimised for applications such as VR/AR devices, industrial optical sensors, and human detection sensors.

The demand for advanced sensing technologies utilising near-infrared (NIR) has grown in recent years, particularly in VR/AR equipment and biosensing devices. These technologies are used in applications such as eye tracking, iris recognition, and blood flow/oxygen saturation measurements that require high accuracy. At the same time, miniaturisation, energy efficiency, and design flexibility are becoming increasingly important. In industrial equipment, near-infrared LEDs are playing a greater role with the rise of precise printer control and automation systems. In response, Rohm is expanding customer options by developing a lineup of compact packages and wavelengths that offer greater design flexibility, while contributing to higher precision and power savings by achieving high radiant intensity.

The new lineup consists of six models in three package configurations, including two ultra-compact (1.0mm × 0.6mm), ultra-thin (t=0.2mm) products as part of the PICOLED series: SML-P14RW and SML-P14R3W. In addition, there are four variants in the industry-standard (1.6mm × 0.8mm) size, featuring a narrow beam circular lens package (CSL0902RT, CSL0902R3T) and flat lens design that emits light over a wide range (CSL1002RT, CSL1002R3T). Each package is available in two wavelengths, 850nm (860nm for the SML-P14RW) and 940nm, allowing customers various options for their specific application needs. The 850nm wavelength is ideal for phototransistors and camera sensors, making it suitable for high-sensitivity applications such as eye tracking and object detection in VR/AR. At the same time, the 940nm wavelength is less affected by sunlight and does not appear red when emitting light, making it suitable for motion sensors. It is also widely used in biosensing applications such as pulse oximeters to measure blood flow and oxygen saturation (SpO2).

The light source incorporates an NIR element with an optimised emission layer structure utilising proprietary technology developed through in-house manufacturing expertise. This has made it possible to achieve industry-leading radiant intensity in a compact package, which was previously considered difficult. For example, compared to a standard 1006 size product, the SML-P14RW delivers approx. 1.4 times the radiant intensity at the same current. In other words, the SML-P14RW consumes 30% less power to achieve the same radiation intensity. This technology improves sensing accuracy and power savings for the entire system.

https://www.rohm.com

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