ST releases microprocessors featured for performance and economy

STMicroelectronics has announced mass-market availability of new STM32MP23 general-purpose microprocessors (MPUs), combining high-temperature operation up to 125°C with the speed and efficiency of dual Arm Cortex-A35 cores, for performance and ruggedness in industrial and Internet-of-Things (IoT) edge compute, advanced HMI, and machine-learning applications.

Joining the STM32MP25 series launched in 2024, the new MPUs contain dual 1.5GHz Arm Cortex-A35 cores, a 400MHz Cortex-M33 for real-time applications, and a neural network accelerator with 0.6 TOPS performance. There is also a 3D graphics processor, H.264 decoder, MIPI CSI-2 camera interface with raw data support, dual Gigabit Ethernet ports with time-sensitive networking (TSN), and two CAN-FD interfaces.

Combining diverse processing resources and optimised on-chip features, the STM32MP23 series fulfils numerous sensing, processing, and data-handling roles throughout smart factories, smart cities, and smart homes. With the neural engine, bringing AI and machine-learning capabilities, these MPUs handle intuitive and adaptive HMIs, vision-based interaction, and predictive maintenance. The H.264 decoder supports up to 1080p60 video resolution and the 3D GPU handles high-performance, real-time graphics with support for open-source frameworks including OpenGL, OpenCL, and Vulkan.

The STM32MP23 series targets SESIP3 (already achieved for STM32MP25 MPUs) and PSA Level 1 certifications. Protection features include secure boot, Arm TrustZone architecture, secure key storage, and tamper detection, with hardware cryptographic accelerators.

Coinciding with the STM32MP23 release, ST is also extending support for each release of the OpenSTLinux distribution from two years to five years. The enhanced support ensures stability for customers throughout development and extends access to the latest security patches easing compliance with the EU Cyber Resilience Act (CRA). ST’s commitment to mainlining OpenSTLinux lets developers work comfortably with popular frameworks including Yocto, Buildroot, OpenWRT, and OpenSTDroid, and helps accelerate time to market.

Additional benefits for developers include three BGA package options that offer the choice of high-density 0.5mm interconnect pitch or 0.8mm pitch that allows simplified 4-layer PCBs with plated-through holes. The three packages are all pin-to-pin compatible with STM32MP25 MPUs. The devices operate over the industrial temperature range, from -40°C to 125°C maximum junction temperature.

https://www.st.com

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TI introduces new line of functionally isolated modulators

Texas Instruments (TI) has introduced the industry’s first functionally isolated modulators, helping designers achieve more precise motor control in compact robot designs. The new AMC0106M05, AMC0136 and AMC0106M25 isolated modulators enable increased precision and higher resolution of 12 to 14 effective number of bits (ENOB) for accurate and reliable phase current sensing and DC voltage sensing measurements. Offered in a small lead-less package, the new products in TI’s isolated analog-to-digital converter (ADC) portfolio help designers achieve smooth torque operation and fine motor control, while decreasing size and cost in low-voltage (<60V) robotics designs.

Engineers today are challenged to design smarter robots to perform more detailed tasks. The galvanically isolated modulators enable robotics engineers to achieve precise motor control and system protection in smaller, more sophisticated designs. This precision makes it possible for robots to complete a variety of complex tasks, such as threading a needle or handling small nuts and bolts. In addition, the small size of the new modulators—measuring just 3.5mm x 2.7mm—requires 50% less board space than competing reinforced isolation solutions. With this decrease in size, designers have more space to incorporate additional features that support precise control and reliable operation in compact robot applications.

“These modulators from TI enable designers to increase robotics accuracy and productivity in new use cases and smaller form factors, from the factory floor to the operating room,” said Karthik Vasanth, vice president and general manager of Data Converters and Clocks at TI. “For example, where humanoid robots could previously only complete simple tasks, our new functionally isolated modulators now allow them to carry out more dexterous and precise jobs.”

Production quantities of the new functionally isolated modulators are available now on TI.com in an 8-pin very thin small-outline (VSON) package. To support designers, evaluation modules for all three modulators are available, as well as reference designs and simulation models.

https://www.TI.com

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New Silicon Labs Wi-Fi 6 plus Bluetooth modules for embedded IoT applications

Mouser is now shipping the new SiWx917Y wireless modules from Silicon Labs. The SiWx917Y wireless modules provide ultra-low-power Wi-Fi 6, Bluetooth® Low Energy (LE) 5.4, and Matter connectivity for a host of embedded, battery-powered IoT devices in smart homes, consumer, industrial, and healthcare applications.

The Silicon Labs SiWx917Y series are fully integrated, shielded modules with a dedicated wireless processing subsystem, an application processing subsystem (MCU), and an advanced security engine. They have a rich set of peripherals framed by an intelligent power management subsystem that includes an antenna (or RF-pin) and worldwide RF regulatory certifications, simplifying development and certification processes.

The SiWx917Y modules’ processing subsystem consists of a network wireless processor (160MHz), baseband digital signal processing, an analog front end, a 2.4 GHz RF transceiver, and a power amplifier. The application processing subsystem features an ARM Cortex-M4 with FPU at 180 MHz, a large, embedded SRAM, Flash, PSRAM, and an option for external Flash/PSRAM. The modules come with modular radio-type approvals for various countries, including the US (FCC), Canada (IC/ISED) and Japan (MIC), and follow the relevant EN standards (including EN 300 328 v2.2.2) for conformity with directives and regulations in EU and UK.

https://eu.mouser.com

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Intel accelerates AI at the Edge through an open ecosystem

Intel is unveiling its new Intel AI Edge Systems, Edge AI Suites and Open Edge Platform initiatives. These offerings help streamline and speed up AI adoption at the edge across industries such as retail, manufacturing, smart cities, and media and entertainment by simplifying integration with existing infrastructure.

With over 100,000 real-world edge implementations with partners, many leveraging AI today, Intel understands the unique challenges of edge AI. These challenges vary significantly by industry, with each having distinct performance and power needs. What works for cloud providers is not suitable for enterprises at the edge, which need to maintain existing platforms and software, while integrating AI, to get the best total cost of ownership (TCO) and power efficiency.

Unlike large data centres with dedicated AI infrastructure, edge AI deployments must seamlessly integrate into preexisting IT systems in space-constrained, low-power and cost-sensitive environments.

Intel AI Edge Systems, alongside Edge AI Suites and the Open Edge Platform, address these challenges by building on Intel’s pervasive technology foundation at the edge. These efforts empower the ecosystem to bring edge AI to market faster and more efficiently.

The open edge approach allows Intel to deliver better end-to-end performance and overall TCO in a variety of key industries. In an edge AI video analytics use case, tera operations per second (TOPs) alone don’t deliver real-world performance needs. When comparing Intel Core Ultra processors to leading AI competition, although competition may lead in TOPs, Intel delivers up to a 2.3x increase in end-to-end pipeline performance, and up to 5x better performance per dollar2.

While many edge deployments today incorporate AI using traditional machine learning and computer vision, Intel’s AI Edge Systems, Edge AI Suites and Open Edge Platform are designed to accelerate the deployment of advanced AI applications. Through a robust ecosystem of trusted partners, Intel enables enterprises to tackle industry-specific challenges and drive innovation in edge AI deployments.

Intel’s edge systems speed up AI deployment at the edge. Builders – original equipment manufacturers (OEMs) and original design manufacturers (ODMs) – have access to standardised blueprints, benchmarks and verification tools optimised for edge AI use cases. These resources enable customers and solution providers to easily configure systems to meet the performance needs of use cases like vision AI or generative AI (GenAI). With a range of power levels, sizes and performance options, these solutions ensure optimal integration of hardware and software.

Edge AI Suites: Edge AI Suites are open, industry-specific AI software development kits (SDKs) for independent software vendors (ISVs), system integrators and solutions builders. These suites simplify the creation of custom AI solutions for various industries by providing curated reference applications, sample code and benchmarks to accelerate application development. Currently, Intel offers four suites, optimised for retail, manufacturing, smart cities, and media and entertainment.
Open Edge Platform: The Open Edge Platform is a modular, open source platform that simplifies the development, deployment and management of edge and AI applications at scale. With cloud-like simplicity, this platform allows ISVs, solution builders and operating system vendors to integrate software components efficiently and leverage performance optimisations from Intel’s latest software advancements. Partners can easily deploy containerised workloads on remote edge devices — without the need for on-site visits — and manage these deployments with tools like Intel vPro®/Intel® Active Management Technology, enabling collaboration and innovation across the software ecosystem.

https://newsroom.intel.com/

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