GaN eToF laser driver IC can lower lidar system cost, says EPC

Time-of-flight (ToF) lidar applications including robotics, 3D security cameras, 3D sensing and vacuum cleaner can benefit from the EPC21701, an 80 V laser driver IC, said Efficient Power Conversion (EPC). The 80V, 15A GaN eToF laser driver IC, the EPC21701, is capable of 15A pulsed current, suitable for ToF lidar applications.

The monolithic device integrates an 80V, 40A FET with gate driver and 3.3V logic level input. The IC is tailored for lidar systems for gesture recognition, ToF measurement, robotic vision or industrial safety, said EPC.

The EPC21701 laser driver uses 5.0V supply voltage and is controlled using 3.3V logic. It is capable of high frequencies greater than 50MHz and super short pulses down to two nanoseconds to modulate laser driving currents up to 15A. Voltage switching time is less than one nanosecond and delay time from input to output is less than 3.6 nanoseconds. 

The EPC21701 is a single-chip driver plus GaN FET using EPC’s proprietary GaN IC technology in a chip-scale BGA form factor that measures only 1.7 x 1.0 x 0.68mm.   

The wafer level packaging is small with low inductance, added EPC. The small form factor and the integration of several functions mean that the overall solution is 36 per cent smaller on the PCB compared to an equivalent multi-chip discrete implementation, said EPC.

The 80V EPC21701 complements the ToF driver IC family in chip-scale package (CSP) that also includes the 40V, 15A EPC21601 and the 40V, 10A EPC21603 devices.

Integrated devices in a single chip are easier to design, easier to layout, easier to assemble, said EPC and additionally save space on the PCB, increase efficiency, and reduce cost to enable faster adoption of ToF across a wider array of end user applications.

Alex Lidow, CEO, and co-founder of EPC, commented: “Integrating a GaN FET with driver on one chip generates an extremely powerful and fast IC and reduces size and cost for wider adoption in consumer and industrial applications.” The EPC21701 extends the family and Lidow confirmed that the company will soon announce a further extension to 100V and 125A.

The EPC9172 development board features the EPC21701 eToF laser driver IC and is primarily intended to drive laser diodes with short, high current pulses. Capabilities include minimum pulse widths of less than two nanoseconds, 15A peak currents, and bus voltage rating of 40V. 

The EPC21701 and EPC9172 are available for immediate delivery from Digi-Key.

Designers interested in replacing silicon MOSFETs with a GaN device can use EPC’s GaN Power Bench, a cross-reference tool, to find a suggested replacement. The tool can be accessed on the EPC website.

EPC specialises in enhancement mode gallium nitride (eGaN) -based power management. eGaN FETs and ICs provide performance many times greater than the best silicon power MOSFETs in applications such as DC/DC converters, remote sensing technology (lidar), motor drives for eMobility, robotics, and drones, and low-cost satellites.

http://www.epc-co.com

> Read More

Renesas introduces eight-pin package for RL78 / G15 MCU 

A general purpose microcontroller (MCU) has been added to the Renesas Electronics low power RL78 family. The small, eight-pin package size targets eight-bit MCU applications, advised Renesas.

The versatile RL78 / G15 packs many peripheral functions and four to 8kbyte of code flash memory in package sizes ranging from eight to 20 pins, with the smallest eight-pin device measuring only 3.0 x 3.0mm. They are designed to keep system size small and reduce the cost of end systems, such as industrial, consumer, sensor control, lighting, and inverter applications. The maximum operating ambient temperature of 125 degree C covers a wide temperature range and allowing the MCU to be used near heat-generating components such as inverter motors.

All pins can be used for general-purpose I/O, except VDD and VSS power supply pins. In addition to up to 8kbyte of code flash memory, the MCU has 1kbyte of code flash memory, 1kbyte of data flash and 1kbyte of SRAM.

It supports operating voltages from 2.4 to 5.5V and supports CSI, UART, Simple I2C, and multi-master I2C serial interfaces. The MCU has a high-precision oscillator (±1.0 per cent) and a built-in comparator.

Engineers designing with the RL78 / G15 can use the GUI-based Smart Configurator to generate driver code for peripheral functions. Renesas also offers the Fast Prototyping Board (FPB) for evaluation, which comes with Arduino Uno and Pmod Type 6A interfaces with access to all pins. Debugging and programming are possible using only a USB cable. Developers can gain access to RL78 development resources using just an Arduino library that can run on the FPB. They can also access the resources offered through the Arduino ecosystem.

The RL78 / G15 is available today in volume production. 

Renesas Electronics combines embedded processing, analogue, power and connectivity expertise to deliver semiconductors for the automotive, industrial, infrastructure and IoT market sectors.

http://www.renesas.com

> Read More

Intel optimises fourth general Xeon Scalable processors for data centre power

The fourth generation Intel Xeon Scalable processors are Intel’s most sustainable data centre processors, said the company. They have a range of features for optimising power and performance, to help achieve customers’ sustainability goals, said Intel.

Code-named Sapphire Rapids, the Xeon processors are claimed to have the most built-in accelerators of any CPU available today, making them suitable for AI, analytics, networking, security, storage and high performance computing (HPC) applications.

Compared to earlier generations, they increase performance per Watt efficiency by a factor of 2.9, using built-in accelerators, to save up to 70W power per CPU in optimised power mode with minimal performance loss, said Intel. This equates to between 52 and 66 per cent low total cost of ownership (TCO).

The number of built-in accelerators means that the fourth generation Xeon processor needs less additional discrete acceleration.

The new optimised power mode can deliver up to 20 per cent socket power savings with a less than five per cent performance impact for selected workloads. Innovations in air and liquid cooling reduce total data centre energy consumption, added Intel. 

The manufacturing process of the processors uses 90 per cent or more renewable electricity at Intel sites with water reclamation facilities.

In AI, and compared to the previous generation, the processors increase PyTorch real time inference and training performance with built-in Intel Advanced Matrix Extension (Intel AMX) accelerators. 

The low latency network and edge workloads mean that the fourth generation Xeon processors are “a critical part of the foundation driving a more software-defined future for industries ranging from telecommunications and retail to manufacturing and smart cities,” said Intel. For 5G core workloads, the built-in accelerators help increase throughput and decrease latency, while the processors’ power management enhances both the responsiveness and the efficiency of the platform, Intel added. 

Compared to earlier generations, they deliver up to twice the virtualised radio access network (vRAN) capacity without increasing power consumption. This enables communications service providers to double the performance-per-Watt to meet critical performance, scaling and energy efficiency needs.

The latest Xeon processor combines up to four Intel 7-built tiles on a single package, connected using Intel EMIB (embedded multi-die interconnect bridge) packaging technology. It delivers increased memory bandwidth with DDR5, increased I/O bandwidth with PCIe5.0 and Compute Express Link (CXL) 1.1 interconnect.

http://www.intel.com

> Read More

NXP targets advanced edge applications with the i.MX 95 family

Part of NXP’s SafeAssure portfolio, the i.MX 95 applications processor family uses an advanced heterogeneous domain design. This not only powers safety-enabled platforms but also integrates a real time safety domain.

The i.MX 95 family combines high performance compute, immersive Arm Mali-powered 3D graphics, a new NXP accelerator for machine learning and high speed data processing. The technology is suitable for automotive, industrial, networking, connectivity and advanced human machine interface (HMI), says NXP. The i.MX 95 family also delivers high performance safety and security features, developed in compliance with automotive ASIL-B and industrial SIL-2 functional safety standards and including an integrated EdgeLock secure enclave.

A critical requirement for the next wave of edge applications is advanced processing and machine learning capabilities, with high-speed connectivity, to analyse the environment and make intelligent decisions locally, explained NXP. The i.MX 95 family is the first i.MX applications processor family to integrate NXP’s eIQ Neutron neural processing unit (NPU). It also includes a new image signal processor (ISP), developed by NXP.

“The i.MX 95 family brings unparalleled features and performance to markets like automotive and industrial where security and safety are key,” stated Rafael Sotomayor, executive vice president and general manager of Secure Connected Edge at NXP. He believed that the combination of processing and graphics, integrated heterogeneous safety domain and networking capabilities, will support “ a new generation of safe and secure edge platforms”.

The i.MX 95 family integrates a secure enclave to simplify implementation of security critical functions in edge applications, such as secure boot, cryptography, trust provisioning, and run-time attestation. Combined with NXP’s EdgeLock 2 GO key management services, manufacturers can securely provision i.MX 95 SoC-based products for secure remote management of devices deployed in the field, including secure over the air updates (OTA), said NXP. 

The i.MX 95’s integrated eIQ Neutron NPU is part of a vision processing pipeline for use with multiple camera sensors or network-attached smart cameras. The SoC integrates an NXP ISP supporting a wide array of imaging sensors to enable vision-capable industrial, robotics, medical and automotive applications, all backed by comprehensive NXP developer support. The Arm Mali GPU enables scaling from multi-display automotive infotainment centres to industrial and IoT HMI-based applications.

The multi-core application domain, with up to six Arm Cortex-A55 cores, is complemented by an independent safety domain consisting of Arm Cortex-M7 and Arm Cortex-M33 CPUs for low power, real time and high performance processing. The i.MX 95 family is designed to enable ISO 26262 ASIL-B and SIL-2 IEC 61508 compliant platforms. Its functional safety domain serves as a critical capability for many automotive and industrial applications. The i.MX 95 can be used in automotiv safety critical actions, for example voice warnings, instrumentation and cameras. In industrial factory automation, the functional safety domain helps to ensure that an industrial control system will always return to a pre-determined state, even when rest of the system fails.

The 10GbE and two 1GbE ports will contribute to industry 4.0, automotive connectivity domain controllers and IoT smart home gateways, said NXP. In addition to time sensitive networking (TSN) capabilities, wireless connectivity (Wi-Fi, Bluetooth Low Energy, satellite radio, or 5G) can be added via two independent PCIe ports, a USB 3 port and integrated BSP-level drivers, said NXP.

Other features include NXP’s Energy Flex architecture that enables fine-grained independent power management of Cortex-A applications domain and real time Cortex-M safety domain. This allows developers to run the real-time safety domain at all times for sensor data monitoring. It also allows the powering up of the applications domain only when necessary to minimise system-level energy consumption.

There is also support for LPDDR5 and LPDDR4X DRAM and multiple options, within the family to scale performance and features to suit power, performance, and application requirements.

The i.MX 95 applications processors are expected to begin sampling for lead customers in 2H 2023.

http://www.nxp.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration