Ventana launches RISC-V CPU for data centres at RISC-V Summit

At this week’s RISC-V Summit in San Jose, California, Ventana Micro Systems introduced Veyron V1. The data centre class RISC-V CPU runs at 3.6GHz and will be offered in the form of high performance chiplets and IP. 

The Veyron V1 is the first RISC-V processor to provide single thread performance that is competitive with the latest incumbent processors for data centre, automotive, 5G, AI and client applications, claimed Ventana Micro Systems. Its efficient microarchitecture also enables the highest single socket performance among competing architectures, said the company.

The efficient performance of the Veyron, combined with RISC-V’s open and extensible architecture optimises the workload for efficiency gains which are enhanced further through domain specific acceleration that will extend Moore’s Law to deal with the emerging energy and thermal constraints for data centres, the company said.

The standards-based Veyron V1 compute chiplet and reference platform are claimed to accelerate time to market by up to two years and reduce development costs by up to 75 per cent. Chiplet based solutions provide flexibility and are economical by right sizing compute, IO and memory while composable architectures leveraging chiplets allow companies to focus on innovation. 

Ventana provides a software development kit (SDK) which includes an extensive set of software building blocks already proven on Ventana’s RISC-V platform.

The RISC-V CPU core is the centrepiece of the first compute chiplet solution with chiplets supplied by different companies. Ventana’s Veyron platform also enables integration of a flexible domain specific accelerator for hardware / software codesign. 

Veyron V1 will be available in the second half of 2023 and is the first in a series of products from Ventana.

“Ventana has a world class team with an average of twenty plus years of experience bringing multiple new CPU architectures to market,” said Patrick Moorhead, founder and chief analyst at Moor Insights & Strategy. “Ventana is the first big core in RISC-V to show up, the only game in town, and has a jump on the market.”

Key features include a 5nm process technology, 16 cores per cluster and a high core count multi-cluster scalability up to 128 cores. There is 48Mbyte of shared L3 cache per cluster, advanced side channel attack mitigation for cybersecurity and I/O memory management and advanced interrupt architecture (AIA) system IP.

https://www.ventanamicro.com/ 

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Mouser stocks NXP’s latest EdgeReady processors for 3D facial recognition

Distributor, Mouser Electronics is now stocking the i.MX RT117F crossover processors from NXP Semiconductors. This is the latest of NXP’s EdgeReady portfolio. The i.MX RT117F crossover processors offer an inexpensive, embedded, secure 3D facial recognition system for smart locks and other access control systems. It can add machine learning-based secure facial recognition capabilities quickly and efficiently to smart homes and smart industrial IoT-based applications using NXP’s eIQ machine learning software.

The i.MX RT117F crossover processors feature NXP’s Arm Cortex-M7 CPU core with 2Mbytes of on-chip SRAM, running at up to 1GHz for fast, more accurate facial recognition and improved power efficiency. The i.MX RT117F has dual core processing and security features. It also provides a 2D GPU (graphics processing unit), two Gigabit Ethernet ports (and one 10/100 port), two high speed USB OTG with PHY and support for a MIPI display and camera. The i.MX RT117F crossover processor can be combined with a 3D structured light module (SLM) camera for security of 3D facial recognition at the edge. According to Mouser, it addresses privacy concerns and eliminates latency typically associated with cloud-based alternatives.

The i.MX RT117F also includes a license to run NXP’s facial biometric authentication library. In the comprehensive library there are camera drivers, image capture and pre-processing tools, face detection, tracking, alignment and recognition tools, wireless drivers and automation scripts.

Mouser is also stocking the SLN-VIZN3D-IOT development kit. This implements an onboard i.MX RT117F processor for secure facial recognition with 3D liveness detection and features integrated, turnkey software. It also includes an available remote registration capability to allow end-users to register their faces from mobile devices.

Mouser says it offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s website hosts an technical resources, including a Technical Resource Centre, product data sheets, supplier-specific reference designs, application notes, technical design information and engineering tools.

https://www.mouser.com

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Bluetooth AoA antenna board squeezes into commercial tracking

The ANT-B11 compact antenna board combines Bluetooth technology with u-blox’s positioning and wireless communication technology to deliver direction finding and 2D indoor positioning. 

ANT-B11 can be integrated into commercial tracking solutions, direction-finding applications and indoor positioning in mid-sized spaces.

ANT-B11 joins ANT-B10 which was launched early 2022. Both are designed for indoor location which is currently hampered because technologies such as GNSS do not always perform effectively, said u-blox. ANT-B11 is equipped with u-blox NINA-B411 Bluetooth 5.1 module and runs the u-connectLocate software, which executes the u-blox angle calculation algorithm. Used in conjunction with an application board, ANT-B11 functions as an indoor angle-of-arrival (AoA) anchor point. The angle calculated by the antenna board does not require any additional processing which means it is ready for use at the application level.

Depending on its orientation, ANT-B11 outputs the final azimuth, or elevation angle, in fractions of a second. With this information, it is possible to track assets and plot their positions in applications aiming at 2D visualisation. (The ANT-B10 is for 3D visualisation.)

ANT-B11 is in a compact, 29.5 x 93.5mm form factor to fit into existing enclosures or casings. It can thrive in any direction-finding application, said u-blox. For example, it can be used to follow assets in indoor areas, grant building access and avoid collisions, in industrial, retail and medical environments. In addition, it can be used in indoor spaces for positioning purposes wherein showing the location of an asset in 2D may suffice.

u-blox specialises in positioning and wireless communication technology in automotive, industrial, and consumer markets. The company’s services and products let people, vehicles, and machines determine their precise position and communicate wirelessly over cellular and short range networks. It offers a broad portfolio of chips, modules and secure data services and connectivity to develop IoT solutions.

The company’s headquarters are in Thalwil, Switzerland and it has offices in Europe, Asia, and the USA. 

http://www.u-blox.com

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VSI claims first automotive industry standard, high speed SerDes silicon 

Believed to be the first commercial SerDes IC that complies with the ASA (Automotive SerDes Alliance) Motion Link standard, VS775 provides high speed data transmission for automotive camera applications. 

VSI develops high speed communication semiconductors for vehicles and has introduced the industry’s first commercial serialiser/deserialiser (SerDes) silicon that complies with the ASA standard. It has a data transmission rate of up to 16Gbits per second, so that the engine control unit (ECU) can quickly process high resolution image data collected by vehicle image sensors, especially electric vehicles, and autonomous vehicles. 

The VS775 provides a commercial camera link semiconductor that will resolve the bandwidth concerns associated with using more high resolution image sensors in advanced autonomous vehicle designs for automotive OEMs worldwide, said VSI. 

As the level of autonomous driving becomes more advanced, the number of sensors such as cameras and lidar and radar mounted on vehicles increases, which creates demand for real time, high speed data transmission. For example, it is expected that more than 20 sensors will be required for one vehicle at ASIL 4 and 5 autonomous driving, which requires high speed data transmission technology.

The ASA standardisation means that there are no interoperability issues causes by OEMs using proprietary technology, pointed out VSI.

In addition to high-speed data transmission, the VS775 features a low power design that reduces power consumption by up to 50 per cent compared to existing products, said VSI. The compact size means it is optimised for electric vehicles and automotive camera modules where there is limited space.

Steve Kang, founder and CEO of VSI, said: “As an industry-standard product, the VS775 guarantees interoperability that existing SerDes products cannot provide, which will reduce OEMs’ development periods and drive down costs. This in turn should accelerate the evolution of self-driving cars and electric vehicles and drive the future of the automobile industry.” 

Currently, VSI is in the process of supplying contracts for camera link solutions for advanced driver assistance systems (ADAS) with global automotive parts suppliers (Tier 1). The company plans to expand the support range of high-speed bandwidth to 32 and 64Gbits per second through subsequent development of the VS775. 

VSI is a fabless company that designs high speed communication semiconductors for vehicles and high-speed transmission of large volumes of data generated in real-time from autonomous driving and electric vehicles. 

VSI is a semiconductor technology-intensive start up and its major customers are global automotive OEMs and Tier 1 and Tier 2 companies. 

http://www.vsitech.co.kr 

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