ICs & Semiconductors

Mouser now shipping Nordic’s Thingy:91 X prototyping platform for wireless IoT applications

Thu, Feb 27, 2025

Mouser is now shipping the new Thingy:91 X Prototyping Platform from Nordic Semiconductor. The Thingy:91 X is an easy-to-use, battery-operated prototyping platform for cellular Internet of Things (IoT) proof-of-concept (PoC) demos and initial cellular IoT device development for logistics, asset tracking, smart city, predictive maintenance, industrial and wearable applications.

The Nordic Semiconductor Thingy:91 X is designed to address the needs of emerging low-power cellular IoT applications utilising Nordic’s nRF9151 cellular IoT system-in-package (SiP) with an integrated Arm Cortex-M33 CPU and Arm TrustZone and CryptoCell security technology, which supports LTE-M, NB-IoT, GNSS, and NR+ certified for global operation. The Thingy:91 X platform comes preloaded with an asset-tracking application and a comprehensive set of sensors that monitor environmental conditions and movement, enhancing its utility in various IoT applications. The Thingy:91 X includes multiple digital and analog interfaces and peripherals for many design possibilities, including expansion options through a debug board connector and an expansion board connector compatible with Qwiic, STEMMA QT, and Grove systems.

The Thingy:91 X Prototyping Platform comes with all necessary modem firmware, RTOS, application software examples, and hardware reference designs to implement a full cellular IoT design. The Thingy:91 X features two user-programmable buttons for user input, with user-programmable RGB LEDs for output, along with a Nano/4FF SIM card slot, supporting (e)SIM, and bundled Onomondo and Wireless Logic SIM cards preloaded with data to connect to nRF Cloud out-of-the-box. The package also includes a 1350mAh rechargeable Li-Po battery to facilitate prototype field testing.

https://eu.mouser.com

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Flexible 1A buck converter from ST powers low-voltage loads in smart meters, home appliances and industrial converters

Wed, Feb 26, 2025

ST’ DCP3601 miniature monolithic buck converter combines extensive feature integration and flexibility, enabling simple, low-BOM designs to achieve high conversion efficiency. The power switches and compensation are built-in, requiring only six components to complete the circuit, including the inductor, bootstrap and filter capacitors, and feedback resistors for setting the output voltage.

With its 3.3V-to-36V input voltage range and 1A output capability, the DCP3601 can power low-voltage loads in applications such as smart meters, domestic appliances, and industrial 24V conversion. Synchronous rectification and a fixed switching frequency of 1MHz ensure high efficiency across the load range and under all operating conditions, reaching 91% at 600mA with 12V input and 5V output.

Flexibility comes from the selection of different variants, offering the choice of forced-PWM operation for noise-sensitive applications or pulse-skipping at light load for minimal power consumption. Additionally, both the low-noise and low-consumption variants are available with frequency dithering to reduce noise power at the 1MHz switching frequency. All variants have extremely low quiescent current of 110µA and an Enable pin that allows turning off the converter with a dedicated signal to maximize power savings.

Designers can quickly start new projects with the DCP3601 using the dedicated evaluation board, STEVAL-3601CV1. The board comes with screw terminals and headers and is ready to power-up out of the box, demonstrating an efficient circuit design with a compact footprint.

First in the new buck-converter product family that will expand throughout the year, the DCP3601 is included in ST’s 10-year longevity program that ensures long-term access to components and support. Packaged as a 3mm x 1.6mm SOT23 6-lead device, the single-chip buck converter is priced from $0.48 for orders of 1000 pieces.

https://www.st.com/dcp360

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Renesas has announced ultra-low-power MCUs with capacitive touch, segment LCD and robust security

Wed, Feb 19, 2025

Renesas has introduced the RA4L1 microcontroller (MCU) group, including 14 new devices with ultra-low power consumption, advanced security features and segment LCD support. Based on an 80-MHz Arm Cortex M33 processor with TrustZone support, the new MCUs deliver a combination of performance features and power savings that enable designers to address a myriad of applications, including water meter, smart locks, IoT sensors and more.

The RA4L1 MCUs employ proprietary low-power technology that delivers 168 µA/MHz active mode @ 80 MHz and standby current of just 1.70 µA with all the SRAM retained. They also are available in very small packages including a 3.64 x 4.28 mm Wafer-Level Chip-Scale Package (WLCSP), addressing the needs of products such as portable printers, digital cameras and smart labels.

The RA4L1 MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. The FSP eases migration of existing IP to and from either RA6 or RA2 Series devices.

Key Features of the RA4L1 MCUs

Core: 80 MHz Arm Cortex-M33 with TrustZone
Memory: 256-512 KB Dual-Bank Flash, 64 KB SRAM, 8 KB Dataflash

Peripherals: Segment LCD, Capacitive Touch, USB-FS, CAN FD, Low Power UART, SCI, SPI, QSPI, I2C, I3C, SSI, ADC, DAC, Comparator, Low Power Timer, Real-Time Clock
Packages: 3.64 x 4.28 mm WLCSP72, 7 x 7 mm LQFP48, 10 x 10 mm LQFP64, 14 x 14 mm LQFP100, 5.5 x 5.5 mm BGA64, 7 x 7 mm BGA100

Security: Unique ID, RSIP security engine supporting TRNG, AES, ECC, Hash

Wide Ambient Temperature Range: Ta = -40º to +125º C for the QFN, QFP and CSP package options; Ta = -40º to +105º C for the BGA package option

Availability
The RA4L1 MCUs are available now, along with the FSP software. Renesas is also shipping an RA4L1 Evaluation Board and an RA4L1 Capacitive Touch Renesas Solution Starter Kit (RSSK).

https://www.renesas.com

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New Bluetooth module from Panasonic Industry

Thu, Feb 13, 2025

The newly launched small and cost-effective PAN B511-1C Bluetooth module from Panasonic Industry features great performance and great memory while minimising current consumption based on the Nordic nRF54L15 single chip controller.
A dedicated number of GPIOs is positioned at the edge of the module, with the rest of the GPIOs located at the bottom pad. In total, the module provides access to all 32 GPIOs of the chip. Despite its hybrid packaging of castellated holes and LGA, the module remains at the small size of a 2-cent coin. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.
The module also features an embedded microcontroller and ARM Cortex- M33 with a high amount of flash memory of 1.5 MB and a RAM size of 256 kB.
An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms. Furthermore, the PAN B511-1C is ideally suited for Matter applications, as it comes equipped with additional flash memory and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. The module will be available in three distinct spec variants to cater to diverse project needs.
The PAN B511-1C Bluetooth module will be certified for CE RED, FCC, ISED and MIC. Samples are already available now and the start of mass production is scheduled for June 2025.

https://industry.panasonic.eu

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