Wearable

Rutronik UK supports STM32MP1 processor

Wed, May 15, 2019

System memory for the recently introduced STM32MP1 multi-core microprocessor series includes compute and graphics support combined with power-efficient real-time control. The aim is to aid the development of high-performance solutions for industrial, consumer, smart home, health and wellness applications.

Rutronik UK has combined STM32MP1 technology with approved technology partners Nanya in the form of a 4Gbit DDR3L SDRAM 16-bit and also Toshiba Memory’s 4GByte eMMC. The multi-core microprocessors and the memories, recommended by ST, are available from the distributor.

Engineers can used the STM32MP1 microprocessor series to develop a range of applications using the new heterogeneous architecture that combines up to two Arm Cortex-A7 and a Cortex-M4 core. This flexible architecture performs fast processing and real-time tasks on a single chip, always achieving the greatest power efficiency, reports Rutronik UK. The STM32MP1 embeds a 3D graphics processor unit (GPU) to support human machine interface (HMI) displays.

Rutronik also offers an evaluation board, the STM32MP157C-EV1 and two Discovery kits, the STM32MP157A-DK1 and STM32MP157C-DK2.

A firmware package, STM32CubeMX, is designed for software and hardware configuration of both the Cortex-A7 and Cortex-M4 cores. It handles C-code generation for the M4 core, DDR SDRAM interface configuration, and tuning tool. It can also generate Linux device trees.

Rutronik UK operates as an independent company in the UK. Its parent company, Rutronik Elektronische Bauelemente, is a broadline distributor for semiconductors, passive and electromechanical components in addition to storage technologies, displays and boards and wireless products. The markets that the company primarily targets include automotive, medical, industrial, home appliance, energy and lighting. It also offers support in the areas of product development and design, individual logistics and supply chain management.

http://www.rutronik.com

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Pressure sensor is sensitive for extended temperatures

Tue, May 14, 2019

A ceramic port is included in the design of the Bourns Model BPS140 pressure sensor to enhance its compatibility with certain harsh media, explains the company.

The pressure sensor is added to Bourns’environmental sensors. It is based on microelectromechanical systems (MEMS) technology, which provides extremely accurate condition readings in a miniature package size. Designed to deliver high sensitivity/accuracy and long-term reliability, the BPS140 pressure sensors offer extended temperature capability and certain harsh media compatibility.

Model BPS140 is robust with a structure that is capable of handling high pressure ranges (15 to 500 PSI) even at high temperatures. This rugged structure is combined with rear pressure measurement that minimises the number of media-sensitive wetted materials. The purpose of this sensing design is to ensure the measured media only touches the back of the measurement element, explains Bourns.

The structure enhances sensor accuracy because all electronic components and other sensitive surfaces are isolated from the media, explains Bourns. In addition, by reducing the number of wetted materials,  the media sensitivity of the sensor is effectively decreased, adds the company.

Bourns’ latest sensor family offers stable performance over the product’s lifespan, and the ability to work with a wide range of pressures offering a total error band of 2.5 per cent full scale over a temperature range of –40 to +150 degrees C (six sigma process), and a lifetime drift of 0.5 per cent full scale. These features make the BPS140 pressure sensor particularly suitable for a range of industrial, energy, heavy equipment, building and home control and medium/low risk medical designs.

Bourns¨ Model BPS140 pressure sensors are available now, and are RoHS** compliant. Bourns also offers port configuration and calibration customisation.

Bourns manufactures and supplies position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products.

The company is headquartered in Riverside, California, USA, and serves a broad range of markets, including automotive, industrial, consumer, communications, medical (low/medium risk), audio and various other

http://www.bourns.com

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Murata and Cypress develop battery saving Wi-Fi-Bluetooth module

Fri, Apr 26, 2019

A collaboration between Murata and Cypress Semiconductor has led to the development of small form factor Wi-Fi and Bluetooth module. The Type 1LV (CYW43012) module is claimed to be the lowest power, small form factor Wi-Fi and Bluetooth module and to improve battery life in wearables, smart home products, and portable audio applications.

It is based on the Cypress CYW43012 combo chipset, the small dual-band Wi-Fi 11a/b/g/n/ (11ac Friendly) +Bluetooth 5.0 module which provides data transference rates up to 78Mbits per second on Wi-Fi and 3Mbits per second on Bluetooth.

The Type 1LV supports a range of popular processors including PSoC6, i.MX RT, STM32, i.MX, and IP camera platforms, as well as Linux and RTOS-based applications.

The Type 1LV uses enhanced hardware mechanisms and algorithms to ensure that Wi-Fi and Bluetooth co-existence is optimised. An embedded Ipv6 network stack can be used to keep the host processor in sleep mode while maintaining network connections.

The module also supports BLE 2Mbits per second, LE Secure Connections, LE Privacy 1.2, and LE Data Packet Length Extension. The device operates seamlessly in dual-band networks with increased energy efficiency and enhanced security providing optimal performance in Wi-Fi 5 networks, says Murata.

The module measures 10.0 x 7.2 x 1.4mm. It will have a reference antennae design for FCC/IC certifications and CE conducted test to provide a lower development cost and faster time to market.

The Type 1LV module is now in mass production.

http://www.murata.com

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