Renesas announces memory technology for AI

Renesas Electronics has developed an AI accelerator that performs convolutional neural network (CNN) processing at high speeds and low power.  A test chip with this accelerator has achieved the power efficiency of 8.8Tera operations per second per W (TOPS/W), which is the industry’s highest class of power efficiency, reports Renesas. The accelerator is based on the processing-in-memory (PIM) architecture, in which multiply-and-accumulate (MAC) operations are performed in the memory circuit as data is read out from that memory.

To create the new AI accelerator, Renesas developed three technologies. The first is a ternary-valued (-1, 0, 1) SRAM structure PIM technology that can perform large-scale CNN computations. The second is an SRAM circuit to be applied with comparators that can read out memory data at low power. The third is a technology that prevents calculation errors due to process variations in the manufacturing. Together, these technologies achieve a reduction in the memory access time in deep learning processing and a reduction in the power required for the MAC operations. As a result, the accelerator achieves the industry’s highest class of power efficiency while maintaining an accuracy ratio more than 99 per cent when evaluated in a handwritten character recognition test (MNIST), claims Renesas.

Before this development, the PIM architecture was unable to achieve an adequate accuracy level for large-scale CNN computations with single-bit calculations because the binary (0,1) SRAM structure was only able to handle data with values 0 or 1. Additionally, process variations in the manufacturing reduced the reliability of these calculations. The technologies developed by Renesas resolve these issues and can be applied to implement AI chips of the future and e-AI solutions for applications such as wearable equipment and robots that require both performance and power efficiency, says Renesas.

Since introducing the embedded AI (e-AI) concept in 2015, Renesas has defined classes based on the effectiveness of e-AI and applications that are implemented and has been developing e-AI solutions based on four classes: judging the correctness or abnormality of signal waveform data; judging correctness or abnormality using real-time image processing; performing recognition in real time and enabling incremental learning at an endpoint.

https://www.renesas.com 

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Accelerometers support CAN or RS-422 protocols

Accelerometers added to the Seiko Epson (Epson) portfolio can monitor the health of the wearer or buildings and infrastructure, as the company releases the M-A352 and the M-A552xxx accelerometers.

The M-A352 accelerometer is designed for infrastructure health monitoring. It  provides the necessary noise performance of one micrG/√Hz or better (servo accelerometer class) for a stable supply and cost competitiveness, says Epson.

The M-A552AC1 and M-A552AR1 three-axis accelerometers boast the same performance as the M-A352 but are equipped with the controlled area network (CAN) and RS-422 interfaces, respectively. These interfaces are widely used in industrial applications. The M-A552AC1 and M-A552AR1 are housed in metal packages that provide IP67-equivalent protection against water and dust.

This level of protection against the elements enables the accelerometers to be used in a range of industrial applications that require long distances, stability and reliability, says Epson.

The accelerometers make it easy for developers to build multi-node (multi-point) measurement systems, synchronised measurement systems and other complex, sophisticated measurement systems. They are easy to install, connect, and use even outdoors and under other harsh environmental conditions, adds Epson, and can reduce customer system development times.

Samples of the new products will begin shipping in the summer of 2019, with volume production scheduled for the spring of 2020.

The MA-A552AC1 (CAN) and MA-A552AR1 (RS-422) accelerometers can be used in structure health monitoring to monitor buildings, bridges, tunnels, and steel towers for earthquake detection, environmental vibration measurement and industrial equipment monitoring. They can also be used in unmanned vehicles (e.g., terrestrial vehicles, undersea probes), and for the measurement of the vibration and path of industrial equipment and vehicles.

Epson Europe Electronics is a marketing, engineering and sales company and the European headquarters for electronic devices of Seiko Epson, Japan. Headquartered in Munich, Germany, since 1989, Epson Europe Electronics has 50 employees, European sales representatives and a Europe-wide network of distributors. Epson Europe Electronics provides value added services for semiconductors, sensors, sensing systems and timing devices for a variety of markets, including industrial, automotive, medical, and communications.

http://www.epson-electronics.de

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Arm introduces CPU and GPU for 5G mobiles

At Computex in Taiwan this week, Arm has unveiled the latest Cortex CPU, a new Mali GPU. Based on a new architecture and a processor for machine learning.

The latest Cortex CPU, the Cortex-A77 improves instruction per cycle (IPC) performance by 20 per cent, compared with the Cortex-A76 for machine learning, augmented reality and virtual reality (ML, AR and VR).

The Arm Mali-G77 GPU is based on Valhall architecture and is intended for use in mobile devices to deliver graphics at increased efficiency, according to Arm. Microarchitecture enhancements including engine, texture pipes, and load store caches, which achieve 30 per cent better energy efficiency and 30 per cent more performance density. The Valhall architecture is claimed to deliver close to 40 per cent performance improvement compared with the Mali-G76 in devices today.

Arm also says that it boosts inference and neural net (NN) performance for ML and to deliver more immersive games for mobile apps.

A dedicated ML processor delivers up to five tera operations per second (TOPS) per W as part of Project Trillium. The ML processor and open-source Arm NN software framework was announced in 2018 and enhancements to the ML processor include more than double energy efficiency to 5TOPS/W, memory compression improved by up to a factor or three and scaling to peak next-generation performance up to eight cores for up to 32TOPS.

http://www.arm.com

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Embedded Vision Alliance awards REAL3 image sensor as “Product of the Year”

Smartphone cameras increasingly require 3D vision capabilities as differentiating factor. Hence, Infineon Technologies developed the REAL3™ IRS2381C, a premier 3D imager sensor solution especially designed for the mobile device market.

The Embedded Vision Alliance now awarded the 3D Time-of-Flight (ToF) single chip solution as “Product of the Year” in the category “Sensors”. The Award recognises the innovation and achievement of the industry’s leading technologies, services, and products from companies enabling next generation of practical applications for computer vision.

“Congratulations to Infineon for winning Best Sensor in our 2019 Vision Product of the Year awards,” said Jeff Bier, Founder of the Embedded Vision Alliance. “Innovative sensor designs, like Infineon’s 3D Image Sensor, are enabling new 3D vision experiences such as smartphone face recognition and augmented reality. Infineon has been a pioneer in creating 3D image sensors for visual AI applications. I applaud the company’s ongoing investment in innovation and quality in this rapidly changing and often confusing market. I’m proud that Infineon is a member of the Embedded Vision Alliance and delighted they have been recognised with this outstanding honour.”

“We would like to thank the Embedded Vision Alliance for having honoured us with the ‘Product of the Year’ Award, which recognises Infineon’s innovation and performance of our REAL3™ ToF-based 3D imager the category ‘Sensors’, said Philipp von Schierstaedt, Vice President, RF & Sensors, Infineon. “Building upon the combined expertise of Infineon and pmdtechnologies, the novel sensor delivers a new level of 3D camera capabilities in mobile device applications. Infineon’s REAL3TM ToF sensor enables a unique user’s experience in secure face-authentication, computational photography and seamless AR-applications”.

Time-of-Flight (ToF) is the most advanced image sensing technology powering 3D cameras in new generation mobile devices and is posed to fuel the dramatic growth of 3D image sensing application market expected for future years. “Time-of-flight” stands for the time the photons need to travel from the camera to the subject or object of desire and back to the REAL3 sensor. Behind this concept there is unparalleled innovation: it enables the next level of highly secure user smartphone interaction.

The awarded IRS2381C image sensor ensures a high-quality, real time and secure 3D vision experience with supreme performance at all light conditions including outdoor. Compared to other 3D technologies like structured light, Infineon’s 3D ToF technology reduces the number of key components from three to two. Moreover, as distance is measured directly, it requires the least computational resources on the application processor. All this makes the application much more reliable, reduces the size and leads to more competitive costs, while enormously cutting the power drain.

Availability

The new 3D image sensor chip was developed in Graz, Dresden and Siegen and combines the know-how of Infineon’s German and Austrian locations in a single solution. With proven high volume production and a fast, in-factory enabled and lifetime valid calibration process, IRS2381C is the 3D image sensor of choice for 3D camera manufacturing in mobile device applications. More information about Infineon’s 3D image sensor family is available at www.infineon.com/real3.

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