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Fingerprint sensor authenticates via smartphone’s display

Thu, Dec 12, 2019

Believed to be the largest surface fingerprint-on-display (FoD) module, designed with organic printed electronics, a four-finger authentication module by Isorg will be demonstrated at CES 2020.

It is expected to bring higher data security to mobile devices, says the company. The company specialises in organic photodetectors (OPDs) and large-area image sensors and will demonstrate the full-screen Fingerprint-on-Display (FoD) module which supports up to four fingers simultaneously touching a smartphone display.

Isorg’s FoD module responds to demands from OEMs and end-users for higher security technologies that can support large surface area fingerprint sensing. Solutions currently available are restricted to single finger identification within a surface area of less than 10 x 10mm. Isorg’s FoD module supports one- to four-finger authentication across the entire dimensions of the six-inch (152mm) smartphone display (or even larger). The module is very thin, less than 0.3mm thick, so integration into smartphones is made easy for OEMs, added the company.

In addition to the image sensor, the module includes optimised thin film optical filters developed in-house and driving electronics, as well as software from Isorg’ industrial partners covering the interface with smartphone OS and the matching algorithm. The scalable FoD is compatible with foldable displays, added the company.

Isorg’s four-finger authentication capability paves the way for secure smartphone mobile banking and payments, personal health monitoring and remote home control applications, including enhanced data protection for wearables, such as access control. By enabling more identification data to be captured with multiple fingers, it significantly reduces the risk of false finger identity theft, in addition to the ease of use by being able to place fingerprints anywhere on the display.

Smartphone OEMs will be able to sample Isorg’s Fingerprint-on-Display module in spring 2020. In parallel, Isorg is also extending development of its FoD for application in the biometrics security market, aimed at meeting growing security needs in access control, border control and other identity access management areas, including mobile ID applications.

The live demo will take place at Eureka Park Tech West – Sands Expo, Level 1, Hall G booth #50463 at CES Las Vegas (7 to 10 January 2020)

http://www.isorg.fr

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Infineon showcases smart security

Wed, Nov 27, 2019

At Trustech 2019 (26 to 28 November) Infineon is exhibiting its hardware-based security for digital identification and contactless payment.

Firstly, it will be showcasing Secora ID, a Java Card solution optimised for electronic ID. Based on Infineon’s security controllers, Secora ID comes with an operating system targeted to be certified according to highest security standards, standardised applets and a selection of packages. There will be a live demonstration showing how easily it can be integrated into ID projects and adapted to local needs.

For contactless payment systems, Infineon’s new generation of SLC3x security chips are based on a 40nm geometry which provides performance and scalability for a vast array of smart card applications as well as payment wearables. Smart card manufacturers and payment solution providers will benefit from an Arm-based architecture, Infineon’s contactless expertise, creating what Infineon describes as the industry’s most advanced security controller portfolio.

Biometric authentication for drivers is also featured. Infineon and Next have been working on reference platforms since November 2018, working together to accelerate the adoption of biometric smartcards. Next Biometrics’ fingerprint sensor technology for dual interface smart cards uses a secure element from Infineon. The biometric card module developed by Next operates seamlessly throughout the standard ISO/IEC 14443 near field communication (NFC) range.

Smart ticketing will also be represented with Infineon’s standardised ticket and payment solutions. This includes limited use tickets over seasonal and yearly passes to sophisticated versions for multi-application implementations. Infineon has recently become a gold member of the Calypso Network Association (CNA) and been named member of the board of directors of the CAN, underling the company’s commitment to provide a comprehensive transport ticketing portfolio based on open standards.
Infineon will be exhibiting and demonstrating its security products at Trustech 2019 in Cannes, France from 26 to 28 November, booth RIV C 050.

The company will also be presenting on topics such as “Security by Design” or “JAVA Card”.

http://www.infineon.com/security

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Evaluation kit supports energy harvesting embedded controller

Fri, Nov 01, 2019

For the development of battery maintenance-free IoT equipment, Renesas Electronics has introduced the RE family, which encompasses the company’s current and future line-up of energy harvesting embedded controllers. The RE Family is based on Renesas’ proprietary Silicon on Thin Buried Oxide (SOTB) process technology. SOTB is claimed to dramatically reduce power consumption in both active and standby states, eliminating the need for battery replacement or recharging.

Following the introduction of the RE01 microcontrollers, the first of the RE family, the RE01 Group evaluation kit is now available to allow users working with the RE01

Hiroto Nitta, senior vice president, Head of SoC Business, IoT and Infrastructure Business Unit at Renesas, said: “We hope this will accelerate the spread of IoT equipment powered by energy harvesting.”

The RE01 evaluation kit includes an evaluation board with an RE01 embedded controller, an interface for the energy harvesting device and a rechargeable battery interface. There is also an Arduino-compatible interface for easy expansion and evaluation of sensor boards and a Pmod connector to expand and evaluate wireless functionality. There is also a low power memory in pixel (MIP) LCD expansion board so that users can evaluate display functions faster. The kit also contains sample code and application notes that serve as references for power management design that eliminates the need for battery maintenance, and driver software that supports CMSIS, Arm’s Cortex Microcontroller Software Interface Standard. Sample code for low power ADCs, digital filter and fast Fourier transform (FFT) routines, 2D graphics MIP LCD displays, and secure boot and secure firmware update functions for improved security are available.

The kit can be used to adopt energy harvesting based on RE01 Group devices at the system level and will accelerate the development of equipment that does not require battery maintenance.

IAR Embedded Workbench for Arm which can use the high efficiency IAR C/C++ compiler, and e2 studio (note 2) which can use the free GNU compiler are available as the developmental environment.

The RE01 evaluation kit is available now.

http://www.renesas.com

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Bluetooth low energy module from u-blox includes direction finding

Thu, Oct 31, 2019

Features such as direction finding, long range and operation up to +105 degrees C make up the u-blox NINA-B4 series of standalone modules. They are designed for indoor positioning applications and for deployments in harsh environments.

The u-blox NINA-B4 Bluetooth low energy modules are based on Nordic Semiconductor’s recently announced nRF52833 chip. The module enables Bluetooth long range, Bluetooth mesh, and Bluetooth direction finding for applications in the connected industry, smart homes, buildings, and cities, asset tracking, and healthcare.

Bluetooth’s new direction finding feature, part of the Bluetooth v5.1 specification, brings the benefits of high precision positioning to indoor applications, says u-blox. NINA-B4 is the first u-blox module designed to act as both a transmitter and a receiver in angle of arrival (AoA) and angle of departure (AoD) direction finding and indoor positioning applications.

In AoA-based implementations, stationary beacons equipped with multi-antenna arrays determine the angle of arrival of signals emitted by a tracking device to pinpoint the tracker’s location with sub-meter level accuracy. When AoD is used, the tracking device triangulates its position by calculating the angle of departure of signals from the stationary Bluetooth beacons’ multi-antenna arrays.

The NINA-B4 enables wireless mesh networks for robust communication between large numbers of connected devices. The networks relay messages from node to node and, by simplifying the control of groups of devices, can be used in smart lighting systems in cities and buildings. These applications also further benefit from the module’s enhanced operating temperature range (up to +105 degrees C).

Bluetooth long range is also a feature for the NINA-B4 series, making it suitable for deployments in harsh environments, e.g. to enable wirelessly connected and configurable equipment. Long range not only increases the distance that Bluetooth signals can travel in undisturbed environments, it also makes communications more robust and reliable in unfavourable ones, such as in production plants or on factory floors.

The NINA-B4 series is supplied with u-blox u‑connect software. It provides an interface to configure the required connectivity to integrate Bluetooth into new and existing products.

There is also a powerful Arm Cortex-M4F microcontroller with an open CPU architecture. This allows customers to run their own applications right on the module. Supporting Zigbee and Thread, the first members of the NINA-B4 family have an internal PCB antenna, or alternatively, are supplied with a U.FL connector for an external antenna of choice.

Samples of the NINA-B4 will be available in December.

http://www.u-blox.com

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Fingerprint sensor authenticates via smartphone’s display

Infineon showcases smart security

Evaluation kit supports energy harvesting embedded controller

Bluetooth low energy module from u-blox includes direction finding

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