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Reference design develops 3D spatial audio in headsets and earbuds

Fri, Oct 01, 2021

Three companies have collaborated to bring 3D spatial audio hardware and software together in a reference design for consumer electronics OEMs and ODMs.

Wireless connectivity and smart sensing specialist, Ceva, has partnered with wireless communications company, Beken and 3D spatial audio expert, VisiSonics to offer a 3D audio reference design to accelerate development and deployment of headsets and true wireless stereo (TWS) earbuds for use in gaming, multimedia and conferencing.

The reference design leverages Beken’s BK3288X Bluetooth Audio SoC series featuring the Ceva-X2 Audio DSP running VisiSonics’ RealSpace 3D audio software, together with Ceva’s MotionEngine Hear head tracking algorithms. OEMs and ODMs can use the ready-to-deploy SoC with any audio encoding format, to introduce 3D audio for VR, AR and the new generation of motion-aware earbuds. The single chip-based reference design provides a self-sufficient 3D audio solution, residing on the headset side, without the need for a 3D audio rendering engine on the host device. As well as being cost-efficient, this also enables a lower latency design, says Ceva.

Weifeng Wang, vice president of engineering at Beken, comments: “Spatial audio brings the wireless audio user experience to the next level and we’re pleased to partner with Ceva and VisiSonics to make it easy for our customers to leverage this exciting new technology in a cost-effective, power-efficient turnkey offering”.

“Spatial audio is an incredibly hot market right now as the Android and PC ecosystems look to build on the industry momentum behind its use in music and gaming to create immersive audio experiences,” adds Moshe Sheier, vice president of marketing at Ceva.

The 3D Audio Reference Design is available now directly from Ceva, and the associated software package combining VisiSonics’ RealSpace 3D audio with Ceva’s MotionEngine Hear is available now for licensing by Ceva and VisiSonics.

Ceva licenses wireless connectivity and smart sensing technologies. It provides DSPs, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence.

DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio / voice / speech and low-power always-on / sensing applications for multiple IoT markets.

https://www.ceva-dsp.com

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MEMS timing accelerates wireless charging says SiTime

Thu, Sep 30, 2021

For power-sensitive and space-constrained mobile and IoT applications, the SiT3901 uPower digitally controlled MEMS oscillator (DCXO) has been introduced by SiTime. It improves wireless charging speed by up to 25 per cent while reducing the overall timing solution area by up to 90 per cent, says the company. The MEMS oscillator is suitable for wireless charging systems for smart watches, activity trackers, hearing aids, and wearables.

“The power and size requirements of new wireless applications demand a new approach to timing,” says Piyush Sevalia, executive vice president of marketing at SiTime. “The SiT3901 DCXO is the industry’s first µPower digitally controlled oscillator, and it delivers by improving charging efficiency and reducing the area,” he adds.

Wireless charging standards such as Qi and AirFuel rely on resonant power transfer to enable proximity charging. However, environmental interference may dynamically impact the resonant charging frequency, which slows down the charging process. The SiT3901 enables the charger to dynamically tune the resonant frequency, maximising power transfer and delivering up to 25 per cent faster charging. The digital control feature on the SiT3901 DCXO eliminates the need for additional passive components on the board, reducing the timing solution area by up to 90 per cent. The resulting charging system works better and is smaller, more manufacturable, and more reliable, claims SiTime.

The SiT3901 DCXO extends SiTime’s µPower MEMS oscillator family targeting power and space-constrained wearable, hearable, IoT, and mobile applications. The µPower MEMS oscillators consume up to 90 per cent less power and up to 90 per cent less space compared to quartz oscillators, enabling environmentally friendly electronics. The SiT3901 offers high resilience to analogue noise and includes low 105 microA current consumption (typical), a wide digital pull range (up to 15 per cent) for output frequency and a programmable frequency of 1.0 to 26MHz. They are stable over temperature of ±50 and ±100 ppm and have a wide operating temperature range of -40 to +85 degrees C.

The oscillators are supplied in a small 1.5 x 0.8mm package size.

http://www.sitime.com

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MEMS barometric pressure sensors are slim and compact

Tue, Sep 28, 2021

Able to measure a height difference as small as 50mm, the ICP-20100 low noise MEMS barometric pressure sensors have a compact footprint for use in smartphones, tablets, drones, augmented reality / virtual reality (AR / VR) equipment and smart home appliances.

The InvenSense ICP-20100 sensors combine a barometric pressure and a temperature sensor in a 2.0 x 2.0 x 0.8mm package. The low noise pressure sensing capabilities, with a range of 30 to 110 kPa, allows the device to detect altitude changes of less than 50mm.

The performance extends InvenSense’s SmartPressure family and offers multiple input voltage levels of 1.2V, 1.8V and 3.3V. There is also a choice of interfaces, namely I²C, I3CSM and SPI. The ICP-20100 can be configured to achieve low noise or low power performance.

The SmartPressure family uses a capacitive MEMS architecture to deliver lower power consumption and lower noise than competing pressure sensors technologies, explains InvenSense. In addition to operation over a wide temperature range, the ICP-20100 pressure sensor can deliver the measurement accuracies required by applications such as 3D geolocation and emergency location service (E911), mobile indoor / outdoor navigation, sport and fitness activity tracking and altitude-hold in drones. The sensor’s low power consumption assists in extending battery life for always-on applications, for example in the IoT. The pressure sensor temperature co-efficient offset is ±0.5 Pa/ degrees C.

A development kit, the DK-20100, and evaluation platform with software are also available.

The ICP-20100 joins the existing ICP-10125, ICP-10101, and ICP-10111 pressure sensors in the SmartPressure family.

Target applications in addition to smartphones and tablets are sports, and fitness activity monitoring devices, altitude control for drones and aerial toys, gaming equipment, including virtual reality. The ICP-20100 can also be used for indoor / outdoor navigation, for example in detecting, floors in a lift or steps. In smart home appliances, they can be used in robotic vacuum cleaners and other equipment which needs sensing capabilities.

TDK was established in 1935 to commercialise ferrite, a key material in electronic and magnetic products. The company’s portfolio features passive components such as ceramic, aluminium electrolytic and film capacitors, as well as magnetics, high-frequency and piezo and protection devices. There are also sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors, power supplies and energy devices.

Products are marketed under the product brands TDK, Epcos, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.

https://invensense.tdk.com

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Smallest Arduino Pro board brings sensing to the edge

Mon, Sep 27, 2021

Claimed to be the smallest Arduino board to date, Nicla Sense ME has been created by Arduino Pro and Bosch Sensortec. It makes sensing and intelligence at the edge accessible to all, says Bosch Sensortec.

The Sense ME is the first product in the Nicla family. It combines low-power sensor nodes with the ability to handle AI and machine learning (ML) on the edge. Dimensions are just 22.86 x 22.86mm.

The Nicla Sense ME has a nine degrees of freedom (DoF) smart motion sensor and a 4DoF environmental sensor with AI capabilities. It uses Bosch Sensortec’s BHI260AP artificial intelligence (AI) sensor system with integrated motion sensor, BMM150 magnetometer, BMP390 pressure sensor, and the BME688 four-in-one gas sensor with AI and integrated high linearity and high accuracy pressure, humidity and temperature sensors.

The board can sense and process different types of data on the edge and reduces latency and power consumption for more privacy without minimal bandwidth, says Bosch. Arduino Pro’s Adriano Chinello describes it as “a tiny board with a really great mix of sensors combined with high computational power, opening up a whole new range of applications leveraging on sensor fusion. Smart building automation, mobile and wearable devices, industrial and professional equipment are key targets”.

Power-saving operation and clear programming structure make the small board suitable for research projects, rapid prototyping and development. It is included in the starter kit provided to all teams participating in the Bosch Sensortec’s 2021 IoT Innovation Challenge, an online competition for students.

“Bosch Sensortec’s self-learning AI smart motion sensor, the environmental sensor with AI capabilities and all the other sensors allow a broad range of applications to address the different segments of the IoT market. This way developing intelligent, low-power and scalable edge sensing applications is easier than ever before” says Dr. Stefan Finkbeiner, CEO of Bosch Sensortec.

The Nicla Sense ME can be powered by a battery and used as a complete standalone board, or attached to an Arduino board to expand its capabilities. It is equipped with Arduino’s fast deployment and easy configuration and is also future-proof, says Bosch, as it allows for additional sensors. It is compatible with upcoming Nicla products, as well as the Arduino Pro MKR and Portenta families.

https://www.bosch-sensortec.com

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Reference design develops 3D spatial audio in headsets and earbuds

MEMS timing accelerates wireless charging says SiTime

MEMS barometric pressure sensors are slim and compact

Smallest Arduino Pro board brings sensing to the edge

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