Robust package technology, MRigidCSP, by Alpha and Omega Semiconductor (AOS), is initially offered on its AOCR33105E, 12V, common drain, dual N-channel MOSFET. The packaging technology is designed to decrease on resistance while increasing mechanical strength, and is particularly suited to battery applications in smartphones, tablets and ultra-thin notebooks.
AOS explained that fast charging, which requires lower power loss in the battery management circuit, is now widely adopted for portable devices. As the charging currents increase, ultra-low electrical resistance is needed for improved performance. In standard wafer-level chip scale packages (WL-CSPs), the substrate can be a significant portion of the total resistance when back-to-back MOSFETs are employed in battery management applications. A thinner substrate reduces the overall resistance but drastically reduces the package’s mechanical strength. This reduction of mechanical strength can lead to more stress during the PCB assembly reflow process, potentially causing warping or cracking in the die and, ultimately, failure in the application. The AOCR33105E is designed with trench-power MOSFET technology in a common drain configuration for design simplicity. It features low on resistance with ESD protection to improve performance and safety in battery management, such as protection switches and mobile battery charging and discharging circuits.
“Incorporating the AOS MRigidCSP packaging technology with our new dual N-channel MOSFET combines electrical performance improvements with the benefit of high robustness,” said Peter H. Wilson, senior MOSFET product line marketing director at AOS.
AOS designed the MRigidCSP package technology to be used with high aspect ratio CSP die sizes. The CSP construction delivers “a significantly strengthened battery MOSFET that won’t warp or break during the board manufacturing process,” added Wilson.
The AOCR33105E is available in a 2.08 x 1.45mm package, with RDS(on) of 3mOhm at 4.5V / 4.2mOhm at 3.1V.
The AOCR33105E in the MRigidCSP package is immediately available in production quantities with a lead time of 14 to 16 weeks. It is RoHS 2.0 compliant and is halogen-free.
Wearable
Headset increases productivity with hands-free operation
The next generation of RealWear’s hands-free, wearable computers for frontline workers is the Navigator Z1 Intrinsically Safe (IS) headset, which accesses AI and 5G connectivity.
Built for productivity and safety in industries such as oil and gas, pharmaceuticals, and mining, the hands-free IS wearable solution frees a worker’s hands to make operations smarter, safer, and more efficient.
The Navigator Z1 is certified for use in areas where nearly all electronics are strictly prohibited due to the potential risk of explosion or combustion. It can be used on sites including oil and gas production areas, for rig inspections at sea or for repair in mission-critical production equipment in processing mills, chemical facilities, and mines.
It is “the smartest and lightest IS wearable with integrated battery available to frontline workers who work in some of the most challenging sites on earth,” said Dr. Chris Parkinson, co-founder and CEO of RealWear. “We’re especially keen to introduce AI Core and 5G IS connectivity to create a new frontier of smart, connected wearable solutions for frontline workers,” he added.
Technical improvements in this version of the headset includes the introduction of RealWear’s new AI Core, especially designed for on-device enhanced AI experiences. The headset is also lighter than earlier models but retains the ruggedness and durability levels, said RealWear. There is also improved screen visibility with an HD 720p display and a high resolution front-facing camera (48 Mpixel) for better remote collaboration and low-light image capture for inspections and auditing.
The headset has a wide temperature range for use in more climates and environments, enhanced noise cancellation for improved voice-responsiveness and accuracy and improved connectivity with faster Wi-Fi 6 and an optional 5G IS solution for private and secure enterprise connectivity.
There is also a thermal camera module to spot invisible issues before they become critical and a removable integrated snag-free battery for enhanced safety and for extended use. The headset operates with Enterprise Secure Android 12.
RealWear Navigator Z1 capabilities include purpose-built software for remote expert guidance and training. Remote experts can conduct in-the-moment maintenance and repair, potentially reducing costly travel and downtime via apps like Microsoft Teams and Zoom.
Using just simple voice commands, workers can connect to FSM (field service management) enterprise AI systems to handle work orders safely and quickly, and conduct asset maintenance at reduced operational costs.
Inspectors can inspect a job site, take high quality photos and dictate notes using the field data collection component of an inspection data management system (IDMS) such as hands-free solutions from RealWear and HUVR. Captured data is instantly uploaded and geocoded for integrity verification, auditing and compliance purposes.
Device administrators can access RealWear’s enterprise-grade RealWear Cloud web portal to add approved apps to the headset, adjust a variety of settings, and even remotely connect to the headset to offer remote device troubleshooting.
To take full advantage of the powerful Qualcomm 6490 chipset, RealWear has begun to offer early access of the new headset to its global developer community.
“We’re thrilled that RealWear is utilising the Qualcomm 6490 platform in RealWear Navigator Z1 that will help frontline workers in extremely hazardous zones where rugged equipment and safety is essential,” said Jeff Henckels, director of XR Product Management, Qualcomm Technologies. “The Qualcomm 6490 is a perfect fit for RealWear’s next generation headsets as it enables powerful connections and reduced latency, an advanced ISP and advanced Edge-AI computing to deliver astonishing performance at lower power.”
The headset will launch with certifications for ATEX Zone 1, CSA C1/D1 and IECEx.
Embedded chip antennas are small and durable for the IoT
Surface mounted embedded antennas have been added to the antenna portfolio by Amphenol RF. The surface mounted chip antennas offer electrical performance up to 8.5GHz and support cellular 4G/5G-FR1 frequencies as well as Wi-Fi and Bluetooth / Bluetooth Low Energy (BLE) and LoRa, UWB and GNSS.
The embedded RF antennas are compact and have a durable construction, making them suitable for IoT and smart devices.
By surface mounting the chip antenna directly on the PCB, with antenna ensure there is no need for external antennas. They are manufactured from ceramic or FR-4 materials and are omnidirectional. In addition, said Amphenol RF, they are easy to tune and available in tape and reel packaging.
The small size of ceramic chip antennas enables efficient integration into compact devices where space is at a premium. These antennas are well suited for smart utility meters, robotics, intelligent transport systems, set-top boxes and gateways, and mobile electronic wallets.
Amphenol RF provides local technical support and matching of antennas.
Amphenol RF manufactures coaxial connectors for use in radio frequency, microwave, and data transmission system applications. Headquartered in Danbury, Connecticut, USA, Amphenol RF has sales, marketing and manufacturing locations in North America, Asia and Europe. Standard products include RF connectors, coaxial adapters and RF cable assemblies. Custom engineered products include multi-port ganged interconnect, blind mate and hybrid mixed-signal solutions.
NFC antennas expand Amphenol RF portfolio for keyless access
The near field communication (NFC) antennas that Amphenol RF has added to its portfolio of internal RF antennas support keyless access and smart tag applications. The antennas are easy to use, said the company and are designed to support NFC Forum standards.
NFC antennas offer high performance capabilities which support NFC Forum wireless standards. They are available in standard configurations with adhesive mount options. They are short range internal antennas which operate at 13.56MHz and are therefore suitable for compact IoT devices such as smartphones, tablets and portable gaming systems as well as in payment readers and ticketing systems. They are also commonly used in devices that require pairing with a Bluetooth device.
NFC antennas are extremely small in size and are manufactured from either PI or FR-4 materials, with or without ferrite and adhesive.
Testing, tuning and measurement capabilities of NFC antennas is available. The antennas are for use in quick, short range data transfer within smart IoT devices, advised Amphenol RF.
The NFC antennas are the latest additions to Amphenol RF’s range of internal and external options. They are designed to meet any design requirement, said the company but custom designs are also available if additional assembly is needed such as cable and connector or combo-design with a wireless charging coil.
Amphenol RF is a manufacturer of coaxial connectors for use in radio frequency (RF), microwave and data transmission system applications. The company is headquartered in Danbury, Connecticut, USA and has sales, marketing and manufacturing locations in North America, Asia and Europe. Standard products include RF connectors, coaxial adapters and RF cable assemblies. Custom engineered products include multi-port ganged interconnect, blind mate and hybrid mixed-signal solutions.
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