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Xsens tracks further with rugged modules

Fri, May 21, 2021

Two products have been added by Xsens to MTi 600-series. They extend the portfolio of industrial tracking modules with and without an integrated satellite positioning receiver.

The first module to be added is the MTi-670G. This is a GNSS/inertial navigation system (INS) module. The second is a rugged attitude and heading reference system (AHRS), the MTi-630R. Both additions are suitable for use in harsh environments in maritime, mining and agricultural applications, says Xsens.

The MTi-670G and MTi630R are housed in an IP68-rated aluminium enclosure which measures 40.9 x 56.5 x 36.8mm. This design is “highly vibration- and shock-proof”, says Xsens. Both modules also feature standard controlled area network (CAN) and RS232 interfaces and an output data rate of up to 400Hz.

The MTi-670G GNSS/INS module includes a u-blox ZED F9 GNSS receiver. Sensor fusion firmware combines the receiver’s inputs with integrated 3D attitude (tilt, inclination) and heading measurements to provide absolute positioning accuracy of better than ±1m. The sensor has support for Xbus and standard NMEA and CAN protocols, for ease of integration into designs. There is also the provision of Xsens’ MT Software suite for developers. This includes the MT Manager graphical user interface (GUI) for Windows or Linux operating systems and a magnetic field mapper function.

The MTi-630R AHRS is a ruggedised version of Xsens’ MTi-630 AHRS. It offers roll/pitch measurement accuracy of ±0.2 degrees, and heading accuracy of ±1 degree. It is also supported with the MT Software suite, which also includes drivers for the LabVIEW, ROS and GO development languages.

The MTi-670G and MTi-630R are available for sampling now. Ruggedised versions of the MTi-610 inertial measurement unit (IMU) and MTi-620 vertical reference unit (VRU), the MTi-610R and MTi-620R, are available on request.

Xsens provides 3D motion sensing technology and products. Its sensor fusion technologies enable a seamless interaction between the physical and the digital world in applications such as industrial control and stabilisation, health, sports and 3D character animation. Clients and partners include Electronic Arts, NBC Universal, Daimler, Autodesk, ABB, Siemens and other leading institutes and companies around the world.

Xsens has offices in the Netherlands (Enschede), the USA (Los Angeles), China (Shanghai and Hong Kong) and India (Bangalore).

https://www.xsens.com.

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CAN bus modules meet demand for unmanned systems

Fri, May 21, 2021

Demand for unmanned systems has seen marked growth since 2020 – a report from Fortune Business Insights estimates a CAGR of 12.23 per cent for the unmanned aerial vehicle (UAV) market. They are used in vertical industry sectors such as agriculture, logistics, transportation, and aerospace. Rising complexity and requirements for increased efficiency mean that the controlled area network (CAN) bus module must operate in harsh conditions, like extreme temperatures and electromagnetic interference (EMI).

Innodisk says its CAN bus modules all support a wide temperature range, 2.5kV isolation protection and the high-layer protocols SAE J1939 and CANopen to ensure optimal performance in extreme conditions without degrading.

Innodisk’s USB to CAN module has been built into autonomous commercial drones, as well as agriculture machine, robot operating system (ROS), automated guided vehicles (AGVs). CAN Bus is enabled to control the system, interact with the on-board computer and various CAN devices, and diagnose issues in ground stations.

Until now, CAN bus solutions capable of handling the strain of these harsh environments have been a major roadblock for reliable systems development. Innodisk says its CAN bus modules provide complete hardware and software integration and offer different form factors to fit diverse demands.

Innodisk is a service-driven provider of flash memory, DRAM modules, and embedded peripheral products for industrial and enterprise applications.

https://www.innodisk.com

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Moxa develops wireless add-on module for MXview network management

Fri, May 21, 2021

For smart factories, network infrastructure specialist, Moxa, has introduced the MXview Wireless add-on module for its MXview industrial network management software. MXview streamlines network management by visualising networks and helping non-IT staff simplify operations and improve network uptime.

The software is used in power, intelligent transportation and manufacturing. As smart factories gain popularity and wi-fi applications increase, the MXview Wireless add-on module can be used in both static and dynamic wireless smart manufacturing applications.

Intelligent process control is a typical static wireless application where customers use wi-fi to establish the communication between the clients installed at production lines and the control centre. An unstable or dropped wireless connection affects production processes. It can be difficult to know the exact status of the wi-fi connection and to fix issues immediately when they occur. The MXview

Wireless add-on module simplifies network management by allowing users to get detailed device information and performance indicator charts for individual and client devices from a single control dashboard. In addition to allowing operators to see the factory’s network conditions, and making network management easier, they can also monitor connectivity patterns and customise alert settings for problem notifications. Engineers can then perform on-site troubleshooting quickly and efficiently.

In automated material handling (AMH) systems, the wi-fi connections must be able to dynamically adapt to the constantly moving vehicles. An unstable wireless signal could easily disrupt the operation of these systems. The MXview Wireless add-on features a dynamic topology view to let users see the status of wireless links and connection changes at a glance. Automated vehicles constantly roam around the facility, so users can overlay the network topology on top of a floor map of the facility to locate a vehicle by just checking the client’s wireless connection. This saves a great deal of time when trying to identify a malfunctioning client device. The roaming playback function lets users review a client’s history over the past 30 days to repeat an incident. Users can leverage this function to find and address the root cause more efficiently, instead of having to consolidate and examine individual device logs.

The module has been developed by Moxa for automated factories, smart logistics, and other intelligent applications.

Picture credit: istock_Alex LMX

http://www.moxa.com/MXview

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Entry level RZ/V2L microprocessors handle AI inference and image processing

Thu, May 20, 2021

Claimed to have best-in-class power efficiency, the RZ/V2L microprocessors from Renesas incorporate its Dynamically Reconfigurable Processor artificial intelligence accelerator (DRP-AI) designed to make embedded AI more power efficient.

DRP-AI handles both AI inference and image processing functions, eliminating external image signal processor (ISP) requirements.

The latest additions to the RZ/V series of microprocessors are designed for entry level, AI-enabled applications.

The new RZ/V2L shares the high-precision AI inference capabilities combined with power efficiency of the previous RZ/V2M series. Additionally, it includes optimisations such as tailoring the DRP-AI operating frequency and memory interface for an entry-level microprocessor.

The DRP-AI provides both real time AI inference and image processing functions with the capabilities essential for camera support such as colour correction and noise reduction. This enables customers to develop AI-based vision applications, such as point-of-sale (PoS) terminals and robot vacuum cleaners, without requiring an external image signal processor (ISP). The power efficiency eliminates the need for heat dissipation measures such as heat sinks or cooling fans. According to Renesas, the RZ/V2L means AI can be implemented cost-efficiently not only in surveillance cameras and industrial equipment, but also in a range of applications including home appliances and consumer electronics.

The RZ/V2L is also package- and pin-compatible with the existing RZ/G2L general-purpose microprocessors from Renesas. This allows RZ/G2L users to upgrade to the RZ/V2L for additional AI functions without needing to modify the system configuration. This helps to keep migration costs low.

The entry level AI accelerator products allow customers to select the most suitable product from Renesas’ microprocessor range.

As part of the RZ/V2L development environment, Renesas offers the complimentary DRP-AI Translator, which automatically converts AI models into an executable format. The input format is the industry-standard Open Neural Network Exchange (ONNX). Developers can leverage the DRP-AI while using the tools they are accustomed to, allowing them to immediately start using the RZ/V2L to evaluate AI models based on proven learning data.

The RZ/V2L microprocessors feature a 64-bit Arm Cortex-A55 (1.2GHz, dual or single core) and Cortex-M33 processor with DRP-AI (1Terra operations per second per W) AI accelerator capable of running the Tiny YOLOv2 program at 28 frames per second.

Simple ISP functions required for machine vision are provided in the DRP library. There is also a 16-bit, single-channel DDR memory interface, 3D graphics functions via an Arm Mali-G31 graphics processor unit (GPU), video codec (H.264) and CMOS sensor interfaces (MIPI-CSI and Parallel) for camera input. There are also MIPI-DSI and parallel display interfaces and error checking and correction (ECC).

A Verified Linux Package (VLP) based on Civil Infrastructure Platform Linux is standard with an industrial-grade Linux implementation also available.

The RZ/V2L series is available in 15mm or 21mm square BGA packages that are pin-compatible with the RZ/G2L

RZ/V2L evaluation boards are provided as Smart Mobility ARChitecture (SMARC) system on modules (SoMs). The reference designs provide an optimised circuit diagram and board layout, and include a power supply circuit and timing tree. A power management IC (PMIC) optimised for the RZ/V2L is in development, confirms Renesas and solutions incorporating the RZ/V2L and new PMIC are expected to be available in the second half of 2021.

Sample shipments of the RZ/V2L start today, and mass production is scheduled to begin in December 2021.

https://www.renesas.com

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Xsens tracks further with rugged modules

CAN bus modules meet demand for unmanned systems

Moxa develops wireless add-on module for MXview network management

Entry level RZ/V2L microprocessors handle AI inference and image processing

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