STM32H5 microcontroller is designed with security in mind

Combining an Arm Cortex-M33 and Trust EE Secure Manager, the STM32H5 microcontroller has been designed by STMicroelectronics to make security simpler and to boost performance and security for smart applications.
The STM32H5 microcontrollers contain the Arm Cortex-M33 embedded core, which blends performance with security, energy efficiency and affordability, said ST to address the mid-range class of MCU-based applications. According to the company, the STM32H5 is the world’s highest performing Cortex-M33 implementation, running at 250MHz and 375 DMIPS for an EEMBC CoreMark industry reference score of 1023.

The STM32H5 series is designed to accelerate innovation at scale for the coming generations of smart, connected devices, which provide more intelligence “in the edge” and also strengthens defence against attacks on IoT assets. The Cortex-M33 core brings Arm’s TrustZone architecture. ST adds a range of its own security features, including some developed with ST Authorized Partner, ProvenRun.
The STM32H5 is believed to be the first MCU series to come with SoC security services accessed via an industry-standard application programming interface (API). This is called the STM32Trust TEE Secure Manager which saves developers writing their own code while providing security services developed according to known best practice. It simplifies development while ensuring effective protection.
Ricardo De Sa Earp, executive vice president general purpose microcontroller sub-group, microcontrollers and digital ICs group expects the STM32H5 microcontrollers to be used in smart homes, factories and cities making them intelligent, safe, and sustainable.
The STM32H5 MCUs also improve energy efficiency by leveraging ST’s advanced 40nm CMOS process technology and improved on-chip power conversion circuits. Power dissipation is no longer a constraint when using a 250MHz device in harsh environments where the ambient temperature can reach 125 degrees C, added ST. The STM32H5 microcontrollers are SIL-ready for products that must meet an appropriate safety integrity level (SIL), thanks to native hardware features that address a wide range of industrial and medical applications.
Typical applications include air conditioning systems, appliances, and alarm systems, industrial programmable logic controllers (PLCs), motor controls, industrial pumps, communication gateways, lighting controls, and energy conversion. They are also used in consumer products such as PC peripherals, smartphones, and accessories.
ST has been a lead development partner with Arm, supporting development of the Cortex-M33 core to comply with the PSA Certified Level 3 and GlobalPlatform SESIP3 security specifications. ST has collaborated with Microsoft Azure on middleware with strong security.

The STM32Trust TEE Secure Manager is developed with ProvenRun and powered by ProvenCore-M to ensure today’s highest security-assurance levels. The SoC security services provided include isolation, cryptography, key storage, and initial attestation.
To help users maximise its potential, ST has created dedicated development kits NUCLEO-H503RB, NUCLEO-H563ZI and STM32H573I-DK with examples showing how to use the security services and integrated all the necessary software tools and support in the STM32Cube development ecosystem.
The new devices also provide in-ST factory pre-provisioning credentials for seamless registration to various cloud and OEM servers, multi-tenant IP protection, and remote pre-integrated 3rd party public key infrastructure (PKI) lifecycle management.
The Kudelski IoT keyStream root of trust, from ST authorised partner Kudelski IoT, was pre-qualified on the STM32Trust TEE Secure Manager to allow remote credential lifecycle management services.
The STM32H5 MCUs raise dynamic efficiency to 61 microA per  MHz in switched mode (SMPS) and 120 microA per MHz running off the linear (LDO) converter (at VDD = 3.3V and 25 degrees C) in run mode with peripherals off.
The product lines initially available include the STM32H503 product line with128kbyte flash, allowing 250MHz computing capability in space- and cost-constrained applications. The STM32H562 and STM32H563 product lines have up to 2Mbyte flash, rich connectivity, and deliver 250MHz over the extended temperature range up to 125 degrees C. The STM32H573 includes AES cryptographic acceleration and security services.
Mass production is beginning now, starting with the STM32H503 and STM32H563.

http://www.st.com

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Dual-band Wi-Fi 5 and Bluetooth module extends battery life for the IoT

Extending the Infineon Airoc portfolio, the company has introduced the CYW43022 Wi-Fi 5 and Bluetooth module which extends battery life for IoT applications with up to 65 per cent power reduction.

The CYW43022 low power architecture results in up to a 65 per cent reduction in power usage during deep sleep mode, to extend the battery life for applications such as smart locks, smart wearables, IP cameras and thermostats.

Sivaram Trikutam, vice president of Wi-Fi product line at Infineon, said: “By optimising the sleep power for battery-operated IoT devices, consumers can now enjoy longer battery life compared to competing solutions. With the industry’s lowest power consumption for a Wi-Fi and Bluetooth combination, [the CYW43022] enables more devices to be smarter, connected, and more versatile in a wide range of environments,” he added.

The Aitoc CYW43022 low power, dual-band Wi-Fi 5 and Bluetooth 5.3 device includes Wi-Fi network offloads and an embedded Bluetooth stack reducing power demands on host processors. To support designs with smaller antennas or designs that require longer reach, it includes a Class 1 Bluetooth power amplifier with +18dBm transmit power. To protect against hacker attacks, there is secure boot with firmware image authentication which requires signed Infineon firmware protects against hacker attacks.

Infineon’s Airoc wireless products, including Wi-Fi, Bluetooth, Bluetooth Low Energy and Wi-Fi and Bluetooth combinations with a broad portfolio of high-performing, reliable, low power products that deliver robust industry-leading performance.

Airoc products leverage a common software framework across Android, Linux, RTOS platforms and are pre-integrated with Infineon’s ModusToolbox software and tools, allowing developers to deliver differentiated products to market on time and on budget. 

Infineon’s Airoc CYW43022 low power, dual-band Wi-Fi 5 and Bluetooth is available now. IT will be exhibited by Infineon at Embedded World in Nuremberg, Germany (14 to 16 March) Hall 4A-138.

http://www.infineon.com

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Advantech bases MIC-733 AI computing on Nvidia’s Jetson AGX Orin

Industrial edge AI provider, Advantech, has released MIC-733, an Nvidia Jetson AGX Orin-based AI computing system.

It has sufficient computing power, flexible video input support and wireless communication for video + AI + 5G applications. Buttressed by 24/7 remote management support, the MIC-733 is claimed to be the best industrial edge AI computing system for AMR/AGV (automated mobile robot/autonomous guided vehicle) applications, with potential for use in smart agriculture and smart transportation. 

The compact fanless system is capable of operating wide operating temperatures (-10 to around +60 degrees C) found in outdoor / harsh environments. The MIC-733 delivers a flexible array of expansion slots and multiple I/O including four USB 3.2, two Mini-PCIe and two M.2. Additionally, it offers iDoor and iModule expansion and support for diverse peripherals

There is also I/O module customisation available through the Mini-PCIe and full PCIe interfaces. This includes the use / modification of CANBus controllers, Cameralink frame grabbers, or PoE modules for IP cameras. 

The Nvidia Jetson AGX Orin is a system on module designed for energy-efficient autonomous machines. It uses Nvidia AI software stacks with up to four CUDA cores and eight times the performance of the Nvidia Jetson AGX Xavier modules. They also support multiple sensors and the latest high-speed interfaces, said Advantech.

In order to integrate existing video with AI computing, MIC-733 provides support for multiple video inputs, for example GMSL, USB, and PoE. By inserting a GMSL card, MIC-733 can support two GMSL2 cameras. It is also equipped with four USB 3.2 Gen2 (10Gbits per second) for high data transmission USB cameras. With iModule expansion, the MIC-733 version can support eight USB 3.2 Gen2, four GbE PoE or eight GMSL2 cameras. To help implement AI video solutions at the edge, MIC-733 supplies up to 60W of power to cameras from four PoE ports (which can be upgraded from four LANs) to help customers integrate cameras. Customers can choose either four 15W per port or two 30W per port.

MIC-733 preserves Mini-PCIe expansion to support 4G / Wi-Fi modules for mobile communication. The growing demand for 5G communication means that the MIC-733 has a dedicated M.2 3052 for 5G applications. 

Advantech has collaborated with Allxon to provide a 24/7 remote management service on the Nvidia Jetson edge AI and robotics platform, enabling large-scale deployment and device management through over-the-air (OTA) and out-of-band (OOB) service. 

MIC-733 is also Azure IoT-certified with the Microsoft reference configuration.

http://www.advantech.com/en-eu

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Optical interconnect scales to AMD’s adaptive SoCs

At OFC, the optical communications and networking conference in San Diego, California (05 to 09 March), Ranovus has demonstrated a low power consumption,  800Gbits per second Ethernet interoperable link which is interoperable with AMD’s adaptive SoCs for AI / ML (artificial intelligence / machine learning) applications.

The Odin direct drive CPO 2.0 optical interconnect has 5pJ/bit energy efficiency and is claimed to be best-in-class for co-packaged, near-packaged optics and pluggable module form factors. 

The company demonstrated interoperability of the AMD Versal adaptive SoCs with the co-packaged Odin 800G direct drive optical engine and third party 800G DR8+ retimed pluggable modules. 

Ranovus’ Odin is a low latency, high density, protocol agnostic and standards-based optical engine that delivers massive optical interconnect bandwidth with industry-leading cost and power efficiency, claimed the company. Built on GlobalFoundries’ Fotonix monolithic RF / CMOS silicon photonics (SiPh) platform, Odin incorporates Ranovus’ proprietary RF CMOS, silicon photonics, laser and packaging technologies for volume manufacturing.  Odin is well suited for next-generation data centre architectures built on co-packaged optics, near-packaged optics, and pluggable OSFP / QSFP-DD / OSFP XD optical modules.

Dr Christoph Schulien, head of Systems and high speed IC R&D of Ranovus, said that the inherent versatility enables hyperscale data centre providers to drastically reduce power consumption and optimise density and cost as they deploy novel hybrid data centre architectures in response to the insatiable growth in AI / ML workloads.

Yohan Frans, vice president, engineering at AMD, said: “We are proud of our collaboration with Ranovus in demonstrating the performance and versatility of monolithic silicon photonics interconnects as data centre and 5G customers deploy highly efficient and cost-effective systems for next generation workloads.”

The interoperability between CPO and pluggable modules is a key proof point that their interconnect technology supports the flexibility and scalability with the lowest power consumption sought by hyperscalers as they optimise their data centres for AI / ML workloads,” said Vladimir Kozlov the founder and CEO of Lightcounting.

 Ranovus will demonstrate its Odin optical interconnect CPO, NPO and 800Gbits per second DR8+ pluggable module portfolio at the Ranovus booth 2019 and the GlobalFoundries booth 5216.  

http://www.ranovus.com

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