Compact Wi-Fi and Bluetooth LE modules have enhanced security

The Nora-W3 series has been added to u-blox’s Wi-Fi standalone module portfolio. The modules make dual-band capability available for the first time in this compact form factor, said u-blox. The modules are suitable for healthcare, HVAC, energy management, EV charging, professional grade power tools and industrial sensing or monitoring applications.

Saturation of Wi-Fi channels in the 2.4GHz band, size constraints, need Wi-Fi and Bluetooth Low Energy (LE) to work in conjunction in order to connect to infrastructure, back-end systems, sensors and mobile devices. There is a balance that needs to be struck between cost and functionality. The Nora-W3 modules comprise dual band Wi-Fi 4 (IEEE 802.11a/b/g/n) and Bluetooth LE 5 based upon a Realtek Ameba chipset. 

The modules feature u-connectXpress to simplify the task of integration for designers. This only requires the use of high-level AT commands. The compact modules integrate two microcontrollers, the Arm Cortex-M33-compatible, operating at 200MHz as the main MCU. The second is an Arm Cortex-M23-compatible, operating at 20MHz for low power operation. This system allows the complete communication firmware to run on the module. To ease integration, Nora-W3 comes with the option to use an embedded antenna, said u-blox.

By offering dual-band Wi-Fi and Bluetooth LE, the u-blox Nora-W3 modules ensure a robust Wi-Fi connection in the field, partly due to the ability to operate in the less congested 5GHz band. The inclusion of u‑connectXpress significantly reduces software effort by removing the need for competence in embedded Wi-Fi and Bluetooth LE, claimed u-blox, allowing designs to be delivered to the market quicker.

The modules offer a wide range of security features including secure boot, encryption, trusted execution environment, authentication and storage that protect sensitive data and prevent unauthorised access.

The Nora-W3 modules measure just 14.3 x 10.4 x 1.9mm, making them suitable for space-constrained designs and includes an embedded antenna within this envelope. 

Nora-W3 is an upgrade, from single to dual band, for customers using u-blox’s Nina-W15 and a smooth transition for those using Odin-W2, said u-blox. The common form factor and pin-out allows simple migration for customers already using, for instance the Nora-W1 and Nora-B1 modules.

There are two variant, the u-blox Nora-W36 with the u-connectXpress software simplifying the integration into the end-product and the u-blox Nora-W30 with an open CPU architecture, allowing customers to run their own applications on the modules.

The Nora-W3 series will be globally certified for use with the internal antenna or a range of external antennas, reducing time, cost and effort for customers integrating Wi-Fi and Bluetooth LE in their designs.

http://www.u-blox.com

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3D magnetic sensor provides contactless position sensing for vehicles

The A31316 3D Hall-effect position sensor is the latest addition to Allegro MicroSystems’ 3DMAG line of 3D sensors. 

The sensors are offered in what is claimed to be the industry’s smallest 4.0 x 4.0mm body PCB-less package. They are suitable for automotive safety and advanced driver assistance systems (ADAS) applications that require reliable performance in harsh conditions such as powertrain and chassis applications. They are also suitable for industrial applications that require linear or rotary sensing.

Powertrain and chassis applications, passenger restraint systems, and shifter systems, are subjected to environmental vibrations and contaminants that can degrade performance. The position sensors used in powertrain and chassis applications typically require support components, like PCBs and capacitors. When a position sensor is required in a dirty, high-vibration environment—the assembly of system components can become corrupted by debris and vibration, which can inhibit the performance of the assembly. The same is true for many industrial linear and rotary sensing applications.

The A31316 3D Hall sensor eliminates the need for a PCB or other external components. It integrates the die and capacitors in a single package and for vibration-robust designs, the A31316 pins can be welded or soldered directly to connector leadframes and can be over-moulded or potted for a tight seal. 

Designed for both rotary and long-stroke linear applications, the A31316 maintains high angle accuracy across the full Grade 0 temperature range (–40 to +150 degrees C). Its flexible calibration table (33 fixed points or 22 freely placed points) enables options to reduce the time and complexity of end-of-line calibration and minimise errors due to mechanical misalignment. 

The 3DMAG family of rotary and linear magnetic position sensor ICs for automotive and industrial applications combine Allegro’s proven planar and vertical Hall-effect technologies to measure magnetic field components along three axes (X, Y, Z). They enable true 3D sensing capabilities with a wide magnetic dynamic range without saturation, said the company. The A31316, is Allegro’s first magnetic position sensor to provide multi-direction measurement in a PCB-less SIP package. It provides designers with a configurable signal path and flexible linearisation for end-of-line calibration to optimise measurement accuracy. The IC can compensate for non-linear fields and static sensor-to-magnet misalignment errors. The high degree of configurability makes it easy for designers to optimise for accuracy and calibration time. This helps minimise processing in the electronic control unit (ECU) and maximises end-of-line yield for nonideal magnets and mechanical assembly tolerances. Multi-level output using binning can integrate the functions of multiple magnetic switch ICs into a single A31316.

The A31316 integrates a Manchester interface for programming the EEPROM through the output pin, which eliminates the need for a separate programming interface. 

A high-voltage supply is not required for EEPROM programming, and the A31316 can be programmed directly with a 5V supply voltage enabling integration with microcontrollers or other low supply devices.

The IC includes the industry’s fastest SENT protocol with 0.5 to 10 microseconds tick times, and includes a pulse-width modulation (PWM) interface with 125Hz to 16kHz carrier for simple digital interface to microcontrollers. 

Following Safety Element out of Context (SEooC) functional safety guidelines, the A31316 sensor supports ASIL B system-level integration in accordance with ISO 26262 and is automotive qualified to AEC-Q100 Grade 0.

The A31316 is available in a three-pin PCB-less SIP package (UC suffix). Product pricing and samples are available now.

http://www.allegromicro.com.

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AMD adds AU7P and ZU3T to UltraScale+ portfolio 

Building on the Zynq UltraScale+ MPSoCs and Artix UltraScale+ FPGAs, AMD has introduced the AU7P FPGA and ZU3T MPSoC. Both are based on the 16nm FinFET process for low power, high performance per Watt and small form factor applications. The SoCs are small, low cost, and low power entry points to the programmable logic transceiver-based UltraScale+ family, said AMD, with improved features such as high IO-to-logic density, UltraRAM and DSP.

The Artix UltraScale+ AU7P FPGA is claimed to be the lowest density, lowest power, and most cost-optimised 12.5Gbits per second transceiver-based FPGA in the Artix UltraScale+ portfolio. It offers high I/O-to-logic ratio and high memory-to-logic ratio for storing and buffering large amounts of data for processing and compute applications.

They provide up to 50 per cent lower static power, 20 per cent more I/O-to-logic ratio and twice as many 3.3V HDIO compared to the AU10P device, confirmed AMD.

The innovative InFO packaging with dimensions of 8.5 x 10.5mm means that the  AU7P is suitable for applications requiring high compute density in a small footprint. InFO packaging’s thermal and power distribution contributes to compact, power-sensitive applications such as medical imaging, machine vision, professional cameras/monitors, and automotive radar/lidar.

The ZU3T MPSoC device is the smallest device added to the Zynq UltraScale+ family with 12.5Gbits per second GTH transceivers for cost-optimised applications. The GTH transceivers are highly configurable and tightly integrated with programmable logic resources of the UltraScale+ architecture. It also has five times the transceiver bandwidth compared to the ZU3 device for critical networking applications, vision and video processing, and secured connectivity.

It also has a higher DSP slice count compared to the ZU3 for better signal processing compute, said AMD. The additional UltraRAM adds 2.5 times the embedded memory for embedded and video processing applications. 

The ZU3T contains a 64-bit processor combining real-time control with soft and hard engines for graphics processing. An Arm-based CPU sub-system is integrated for advanced analytics and there is on-chip programmable logic for task acceleration, making the MPSoC suitable for camera monitors, medical imaging and automotive infotainment systems.

The AU7P device is expected to begin shipping pre-production and production silicon in the second half of 2023.The ZU3T device is expected to begin shipping pre-production silicon to early access customers in the first half of 2023, with production silicon expected in the second half of 2023. 

Both will be available in automotive (XA) grade, qualified according to AEC-Q100 test specifications with full ISO26262 ASIL-C level certification. 

http://www.amd.com

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Software kits by Texas Instruments streamline Matter adoption

Claiming to unify the fragmented IoT ecosystems with Matter protocol -enabled wireless microcontroller software, Texas Instruments has introduced Matter-enabled software development kits for Wi-Fi and Thread SimpleLink. 

Engineers can use the new software and wireless microcontrollers, the CC3235SF and CC2652R7 for example, to create low-power and secure, battery-powered smart home and industrial automation IoT applications that seamlessly connect with devices across proprietary ecosystems. 

Matter is the royalty-free connectivity protocol developed by the alliance, formerly the Zigbee Alliance. Matter runs on Thread and Wi-Fi network layers and uses Bluetooth Low Energy for commissioning, allowing devices from different ecosystems to communicate, even if they are manufactured by different brands. By providing a unified application layer based on proven technologies, manufacturers can leverage this open-source protocol to accelerate IoT development. 

Matter-enabled SimpleLink wireless MCUs, for example, can enhance system efficiency and security, said TI. The MCUs can help designers reduce standby power consumption up to 70 per cent in Thread applications compared to competing devices, claimed TI, to extend battery life up to four years while using five-second polling. For long-range connectivity applications, the integrated power amplifier in these wireless MCUs enables reliable connectivity by consuming 101mA at +20dBm. This is claimed to be the industry’s lowest power consumption, further reducing battery power consumption at higher output power.

Designers of Matter-enabled Wi-Fi applications can leverage TI’s dual-band, multi-layer security approach to protect device data and secure against cyberthreats without the need for additional external components.

Engineers can streamline a design of Matter-enabled applications by connecting with applications engineers through the TI E2E Wireless Connectivity design support forums available online, advised TI.

They can start prototyping with LaunchPad development kits for Thread LP-CC2652R7 and Wi-Fi LP-CC3235SF.

The CC2652R7 and the CC3235SF are now available through TI and authorised distributors.  

TI is a board member of the alliance and one of the participants in the development of Matter. In addition to helping engineers build wider and more interconnected IoT ecosystems, overcoming compatibility challenges caused by fragmented ecosystems, the company is also a contributor within the Thread Group and a key contributor to the Wi-Fi Alliance. 

TI will demonstrate the Matter protocol’s ability to enable smarter EV charging management at home at electronica 2022 in Munich (15 to 18 November) in Hall C4-157.

http://www.TI.com.

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