Bluetooth AoA antenna board squeezes into commercial tracking

The ANT-B11 compact antenna board combines Bluetooth technology with u-blox’s positioning and wireless communication technology to deliver direction finding and 2D indoor positioning. 

ANT-B11 can be integrated into commercial tracking solutions, direction-finding applications and indoor positioning in mid-sized spaces.

ANT-B11 joins ANT-B10 which was launched early 2022. Both are designed for indoor location which is currently hampered because technologies such as GNSS do not always perform effectively, said u-blox. ANT-B11 is equipped with u-blox NINA-B411 Bluetooth 5.1 module and runs the u-connectLocate software, which executes the u-blox angle calculation algorithm. Used in conjunction with an application board, ANT-B11 functions as an indoor angle-of-arrival (AoA) anchor point. The angle calculated by the antenna board does not require any additional processing which means it is ready for use at the application level.

Depending on its orientation, ANT-B11 outputs the final azimuth, or elevation angle, in fractions of a second. With this information, it is possible to track assets and plot their positions in applications aiming at 2D visualisation. (The ANT-B10 is for 3D visualisation.)

ANT-B11 is in a compact, 29.5 x 93.5mm form factor to fit into existing enclosures or casings. It can thrive in any direction-finding application, said u-blox. For example, it can be used to follow assets in indoor areas, grant building access and avoid collisions, in industrial, retail and medical environments. In addition, it can be used in indoor spaces for positioning purposes wherein showing the location of an asset in 2D may suffice.

u-blox specialises in positioning and wireless communication technology in automotive, industrial, and consumer markets. The company’s services and products let people, vehicles, and machines determine their precise position and communicate wirelessly over cellular and short range networks. It offers a broad portfolio of chips, modules and secure data services and connectivity to develop IoT solutions.

The company’s headquarters are in Thalwil, Switzerland and it has offices in Europe, Asia, and the USA. 

http://www.u-blox.com

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VSI claims first automotive industry standard, high speed SerDes silicon 

Believed to be the first commercial SerDes IC that complies with the ASA (Automotive SerDes Alliance) Motion Link standard, VS775 provides high speed data transmission for automotive camera applications. 

VSI develops high speed communication semiconductors for vehicles and has introduced the industry’s first commercial serialiser/deserialiser (SerDes) silicon that complies with the ASA standard. It has a data transmission rate of up to 16Gbits per second, so that the engine control unit (ECU) can quickly process high resolution image data collected by vehicle image sensors, especially electric vehicles, and autonomous vehicles. 

The VS775 provides a commercial camera link semiconductor that will resolve the bandwidth concerns associated with using more high resolution image sensors in advanced autonomous vehicle designs for automotive OEMs worldwide, said VSI. 

As the level of autonomous driving becomes more advanced, the number of sensors such as cameras and lidar and radar mounted on vehicles increases, which creates demand for real time, high speed data transmission. For example, it is expected that more than 20 sensors will be required for one vehicle at ASIL 4 and 5 autonomous driving, which requires high speed data transmission technology.

The ASA standardisation means that there are no interoperability issues causes by OEMs using proprietary technology, pointed out VSI.

In addition to high-speed data transmission, the VS775 features a low power design that reduces power consumption by up to 50 per cent compared to existing products, said VSI. The compact size means it is optimised for electric vehicles and automotive camera modules where there is limited space.

Steve Kang, founder and CEO of VSI, said: “As an industry-standard product, the VS775 guarantees interoperability that existing SerDes products cannot provide, which will reduce OEMs’ development periods and drive down costs. This in turn should accelerate the evolution of self-driving cars and electric vehicles and drive the future of the automobile industry.” 

Currently, VSI is in the process of supplying contracts for camera link solutions for advanced driver assistance systems (ADAS) with global automotive parts suppliers (Tier 1). The company plans to expand the support range of high-speed bandwidth to 32 and 64Gbits per second through subsequent development of the VS775. 

VSI is a fabless company that designs high speed communication semiconductors for vehicles and high-speed transmission of large volumes of data generated in real-time from autonomous driving and electric vehicles. 

VSI is a semiconductor technology-intensive start up and its major customers are global automotive OEMs and Tier 1 and Tier 2 companies. 

http://www.vsitech.co.kr 

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Security IC using 28nm targets high volume payment systems

Believed to be the first 28nm-based security IC, the SLC26P targets high volume payment applications. based on the future-proof 28 nm technology node.

According to Ioannis Kabitoglou, head of digital security and identity, at Infineon, the use of 28nm technology represents the company’s long term commitment to the security IC market. It is planning for a fast ramp up of production  Business Line of Infineon. It plans a fast ramp up in the first half of next year to relieve the semiconductor shortages currently experienced by the security IC sector.

The SLC26P is claimed to be the first security controller optimised for payments based on the 28nm technology. An EMVCo certification, for multi-vendor card transations, is expected to be available in December 2022. 

The IC features Arm v8-M architecture optimised for deeply embedded systems and designed for low-latency processing.

Infineon and partner TSMC have developed the security IC products. Capacity issues at mature technologies like 90, 65 and 40nm have been a limiting factor for the strong demand in security applications, leading silicon foundries to build new capacity. The 28nm technology node for security ICs offers increased sourcing flexibility but also conrtributes to higher performance, more energy efficient and environmentally-friendly products for this segment, said Infineon. 

The portfolio of products based on 28nm process technology is expected to meet demand for smart card and embedded security IC applications, such as payment and transportation, as well as identity and authentication, in the coming years.

Infineon plans to ramp up production in the first half of 2023. Samples based on SLC26P are available upon request.

Infineon will be at TRUSTECH (booth G035, 5.2) in Paris, Porte de Versailles, from 29 November until 1 December 2022. Experts will be available for discussions about Infineon’s security controller offering based on 28nm technology.

http://www.infineon.com

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Rohm eliminates cloud server with on-device learning edge AI chip

Artificial intelligence (AI) at the edge enables real-time failure prediction without requiring a cloud server, said Rohm Semiconductor at the launch of its on-device learning AI chip. This is an SoC with on-device learning AI accelerator for edge computer endpoints in the IoT. The chip uses AI to predict failures (known as predictive failure detection) in electronic devices which are equipped with motors and sensors. It does this in real-time with low power consumption, said Rohm.

Generally, AI chips perform learning and inferences to achieve AI functions. Learning requires that a large amount of data gets captured, compiled into a database and updated as needed, which means that the AI chip which is learning requires substantial computing power. 

Based on an ‘on-device learning algorithm’ developed by Professor Matsutani of Keio University, Rohm has developed an AI chip which mainly consists of an AI accelerator (AI-dedicated hardware circuit) and Rohm’s high-efficiency, eight-bit CPU, the tinyMicon MatisseCORE. 

Matisse is the micro arithmetic unit for tiny size sequencer. The tinyMicon MatisseCORE was developed specifically to make analogue ICs more intelligent for IoT ecosystem. 

Combining the compact, 20,000-gate AI accelerator with a high performance CPU enables learning and inference with low power consumption of just a few tens of mW (1,000 times smaller than conventional AI chips capable of learning, said Rohm). This allows real-time failure prediction in a wide range of applications, since ‘anomaly detection results (anomaly score)’ can be output numerically for unknown input data at the site where equipment is installed without involving a cloud server.

An instruction set optimised for embedded applications and the latest compiler technology delivers fast arithmetic processing in a smaller chip area and program code size, explained Rohm. It is also feasible for high-reliability applications, such as those requiring qualification under the ISO 26262 and ASIL-D vehicle functional safety standards. The proprietary onboard real-time debugging function prevents the debugging process from interfering with program operation, allowing debugging to be performed while the application is running.

Rohm has announced plans to incorporate the AI accelerator in this AI chip into various IC products for motors and sensors. Commercialisation is scheduled to start in 2023, with mass production planned in 2024.

The AI chip was evaluated used an evaluation board equipped with Arduino-compatible terminals that can be fitted with an expansion sensor board for connecting to an MCU (Arduino). Wireless communication modules (Wi-Fi and Bluetooth) along with 64kbit EEPROM are mounted on the board. Connecting units such as sensors and attaching them to the target equipment it will be possible to verify the effects of the AI chip from a display, said Rohm. 

This evaluation board will be available on loan from the company.

http://www.rohm.com

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