ICs & Semiconductors Archives - Page 63 of 235

FlightSense multi-zone distance sensor has camera-like field of view

Thu, Jul 06, 2023

STMicroelectronics has identified that sensors bring lifelike situational awareness to numerous types of smart equipment. It has released its latest FlightSense multi-zone distance sensor with what it claimed is an industry-best 90 degree field of view to enhance privacy-protected multi-zone ranging, object detection and scene mapping.

The field of view is 33 per cent larger than the previous generation, said the company. The optical sensors bring situational awareness to applications like home automation, domestic appliances, computers, robots, and smart equipment used in stores, factories.

Unlike camera sensors, which are sometimes positioned for these tasks, Time-of-Flight (ToF) sensors like ST’s new VL53L7CX announced today do not capture images and thus ensure full privacy for users. The VL53L7CX extends the field of view to an unprecedented 90° (diagonal) for enhanced peripheral sensing, almost equivalent to that of a camera. This enhances the performance of presence detection and system activation, such as activating a screen or waking an appliance like an oven or coffee machine.

ST’s FlightSense multi-zone sensors have powerful capabilities including 3D scene mapping and simultaneously measuring distance to multiple objects in multiple zones. The multi-zone capability and the motion indicator allow use in applications like people detection and tracking, over-shoulder warning, occupancy detection, and storage / parking management.

The sensor enhances the performance of applications such as smart waste-management for tracking full and empty bins. It can also improve floor sensing, cliff prediction, obstacle avoidance, and small-object detection for robots. Further applications include keystone correction in projectors and extended hand tracking for gesture recognition using the STGesture software pack.

The VL53L7CX has native 64-zone (8 x 8) sensing and can measure distance to multiple objects in each zone, up to 3500mm. ST-patented histogram algorithms allow multi-target detection and measurement within the field of view, as well as smudge immunity above 600mm.

The linearity is consistent when measuring distance to objects as close as 20mm.

In low power mode, the sensor consumes just 5.4mW. The VL53L7CX can operate in autonomous mode that allows the host system to power down and wake only when a threshold value is reached. Thresholds include distance to nearest object, signal rate, and detection of motion. The sensor is pin-to-pin and driver compatible with the previous generation device, VL53L5CX.

Design-in support includes the VL53L7CX Expansion board (X-NUCLEO-53L7A1) and a development pack that includes the VL53L7CX board with an additional STM32F401 Nucleo board. The SATEL-VL53L7CX, a small-outline PCB for easy integration and fast prototyping, is also available.

A full set of software is available to make user development easier, including the Ultra Lite Driver, Linux driver, and STGesture code examples. The X-CUBE-TOF1 software pack for fast STM32 microcontroller programming contains application code examples and is compatible with the STM32CubeMX tools.

The VL53L7CX is in production now and available in a 6.4 x 3.0 x 1.6mm miniature optical LGA16 package.

http://www.st.com

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Dual-band Wi-Fi 6 and dual-mode Bluetooth 5.3 module is automotive-grade

Fri, Jun 30, 2023

In order to prevent wireless network congestion in a vehicle and enhance audio functionalities, the u-blox JODY-W5 is an automotive-grade module with Bluetooth LE Audio. It has a compact form factor and operates in temperatures up to 105 degrees C.

It blends dual-band Wi-Fi 6 and dual-mode Bluetooth 5.3 technologies, including LE Audio, and is described as both cost-effective and compact while enabling different antenna configurations.

The u-blox JODY-W5 can be used in helmet-to-helmet communication for two-wheel vehicles, EV charging solutions such as link/device configuration and data charging via an access point, telematics control and head units such as diagnostics and software updates. It can also be used for infotainment with rear seat entertainment connectivity, smartphone tethering and hands-free calling.

The module is available in two operating temperature variants, operating at up to +85 and +105 degrees C meeting Automotive Grade 2 requirements. On request, the JODY-W5 provides an LTE-coexistence filter and antenna configurations. It is pin compatible with other u-blox JODY modules for ease of migration, design flexibility and upgradability while saving time and cost.

Enhanced security features support secure boot and over-the-air firmware updates, key management, and hardware encryption for critical protocol keys with NXP Semiconductors’ EdgeLock Secure Subsystem, built into NXP’s AW611. These features reduce implementation efforts considerably said u-blox, while helping avoid costly security incidents.

“By integrating the AW611 into the JODY-W5 module, we extend our partnership with u-blox, offering a solution that balances the trade-off between the adoption of latest technologies and product cost,” said Larry Olivas, general manager and vice president, Wireless Connectivity Solutions, NXP Semiconductors.

The JODY-W5 module covers RF design and certification requirements for end devices use and applications, which can be extended globally upon request, said Sebastian Schreiber, Product Strategy, Short Range Radio, at u-blox.

The globally certified module minimises the need for specific radio testing, explained u-blox, enabling a faster time to market. The first samples will be available by the end of the third quarter of 2023.

http://www.u-blox.com

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Small capacity e.MMC and SD memory cards are cost-efficient for green IIoT

Thu, Jun 29, 2023

Swissbit has introduced cost-efficient, small capacity e.MMCs and SD memory cards for IIoT and smart city applications. The EM-30 and S-56(u) series are based on 3D TLC NAND and have capacities from 4Gbyte.

The EM-30 and S-56(u) series are available as an embedded component in the form of an e.MMC or as flexible, interchangeable SD memory cards. They also guarantee data security said Swissbit.

The EM-30 product series (153 ball BGA) complies with e.MMC-5.1 specifications and is fully backwards compatible. It is designed for an extended temperature range of -40 to +85 degrees C and is suitable for use in harsh environmental conditions. Based on durable industrial-grade 3D-TLC-NAND and with storage capacities ranging from 4.0 to 8Gbyte, the range offers sequential data rates of up to 280Mbyte per second read and 120Mbyte per second write, as well as 11k IOPS random read and 16k IOPS random write.

The S-56(u) SD and microSD memory cards attain sequential read and write data rates of 95Mbytes per second and 74Mbytes per second, respectively. Random read IOPS is 2,200 and random write IOPS is 1,300. Over-provisioning and pSLC technology ensure the S-56 series offers the highest endurance for write-intensive workloads. Combined with up to 100,000 PE cycles, its endurance for small data logging even surpasses that of an SLC card for the first time, reported Swissbit.

The cards are suitable for applications which require minimal storage space, for example green IIoT technologies like charging stations, smart meters, and PV inverters. Only a small amount of memory is required to run boot software or to communicate with cloud applications in these instances.

The capacities mean they are suitable for use as boot media or for data logging small amounts of data, without sacrificing performance or durability in green IoT applications such as smart meters, controllers for intelligent building management, or generating and using sustainable energy through charging stations.

Other typical applications for small-capacity flash memory include white goods, payment devices and point-of-sale systems, industrial control systems, and medical diagnostic and patient monitoring devices.

http://www.swissbit.com

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Versal Premium VP1902 is largest FPGA-based adaptive SoC, says AMD

Wed, Jun 28, 2023

AMD said that the Versal Premium VP1902 is the world’s largest FPGA-based adaptive SoC for emulation and prototyping. It offers twice the capacity of earlier generation FPGAs said the company.

The VP1902 adaptive SoC is an emulation-class, chiplet-based device designed to streamline the verification of increasingly complex semiconductor designs. Designers can use it to innovate and validate application-specific integrated circuits (ASICs) and SoC designs.

FPGA-based emulation and prototyping allows fast silicon verification and enables developers to begin software development in advance of silicon tape-out.

As complexity grows in ASIC and SoC designs, coupled with the rapid advancement of AI and ML-based chips, extensive verification of both silicon and software before tape-out is a must, said AMD. The VP1902 delivers 18.5M logic cells for 2X2 higher programmable logic density and 2X4 aggregate I/O bandwidth compared to the previous generation Virtex UltraScale+ VU19P FPGA.

For both pre-silicon verification and concurrent software development, the VP1902 finds and addresses bugs before tape-out. The Versal architecture, including the programmable network-on-chip, provides up to 8X5 faster debugging compared to the prior generation VU19P FPGA.

The AMD Vivado ML design suite provides a comprehensive development platform to quickly design, debug and validate applications and technologies to accelerate time to market. New features that support more efficient development on the VP1902 adaptive SoC include automated design closure assistance, interactive design tuning, remote multi-user real-time debugging and enhanced back-end compilation, which enables end users to iterate IC designs faster, said the company.

AMD has collaborated with EDA vendors, including Cadence, Siemens and Synopsys to help designers access an ecosystem of fully-featured and scalable solutions.

The AMD Versal Premium VP1902 adaptive SoC will begin sampling in Q3 to early access customers with production expected in the first half of 2024.

Kirk Saban, corporate vice president, Product, Software, & Solutions Marketing, Adaptive and Embedded Computing Group, AMD, commented: “Chip designers can confidently emulate and prototype next-generation products using our VP1902 adaptive SoC, accelerating tomorrow’s innovations in AI, autonomous vehicles, Industry 5.0 and other emerging technologies.”

https://www.amd.com

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FlightSense multi-zone distance sensor has camera-like field of view

Dual-band Wi-Fi 6 and dual-mode Bluetooth 5.3 module is automotive-grade

Small capacity e.MMC and SD memory cards are cost-efficient for green IIoT

Versal Premium VP1902 is largest FPGA-based adaptive SoC, says AMD

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