ICs & Semiconductors Archives - Page 60 of 235

Silicon Labs unveils Amazon Sidewalk optimised SoCs

Wed, Aug 23, 2023

Two SoCs unveiled by Silicon Labs, the SG23 and SG28, are optimised for Amazon Sidewalk.

To address the varied technologies and protocols that exist in the IoT today, the Silicon Labs portfolio includes different device families and derivatives for different parts, such as the BG line of Bluetooth SoCs and the ZG line of Z-Wave SoCs, and this latest addition, the SG family of SoCs optimised for Amazon Sidewalk.

The always-on Amazon Sidewalk network uses Bluetooth LE for device provisioning and nearby device connectivity, sub-GHz FSK for connectivity up to one mile, and a proprietary CSS radio for extreme long range. Most Amazon Sidewalk end-devices will support Bluetooth LE and either FSK or CSS. The SG28 includes two dual-band SoCs with radios for both sub-GHz FSK as well as Bluetooth LE. These dual-band parts help simplify devices and reduce cost by including the two most commonly used radios on Sidewalk end devices in a single package. The SG23 provides security and a robust sub-GHz link budget for long range, end node devices.

The company has also introduced developer tools as the company continues to work closely with Amazon to provide developers with the hardware, software, and development tools needed to navigate the Amazon Sidewalk development process.

Silicon Labs has worked directly with Amazon to create the Amazon Sidewalk Developer’s Journey, a guide with 12 steps organised in three stages, covering determining if a targeted region has Amazon Sidewalk coverage, device deployment and ongoing support for devices in the field. The guide includes technical documentation, videos, and code samples, with the option to engage a Silicon Labs expert for support. Silicon Labs provides all the tools needed for each step, and by following the Developers Journey, device makers are well-positioned for Amazon Web Services and Amazon Sidewalk certification and approval.

Silicon Labs develops secure, intelligent wireless technology for a more connected world with an integrated hardware and software platform, intuitive development tools, ecosystem and robust support for building advanced industrial, commercial, home, and life applications.

http://www.Silabs.com

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u-blox and Orbcomm create terrestrial and satellite IoT comms

Wed, Aug 16, 2023

IoT for industrial operations technology developer Orbcomm, has partnered with u-blox to develop solutions for the convergence of terrestrial and satellite IoT communications markets.

The cellular and satellite IoT communications markets have grown substantially. The Ericsson Mobility Report (2022) said the number of cellular IoT connections was approximately 0.5 billion in 2016 and projected to reach around 5.5 billion by 2028. At the same time, the satellite IoT comms market is expected to triple by 2025 (source: The Satellite IoT Communications Market report by Berg Insights). Combining satellite and cellular IoT comms can uncover new areas and be more attainable for IoT deployers, said u-blox.

As part of the collaboration, u-blox will directly integrate support for Orbcomm’s satellite communication protocols into its UBX-R52/S52 LPWA (low power wide area) modem SoC. The small chipset offers dual connectivity at a low cost, said the company. It will be at the core of future u-blox module products supporting terrestrial LPWA and satellite IoT protocols enabling connected solutions almost anywhere in the world, claimed u-blox.

The UBX-R52/S52 chipset is specifically designed for IoT applications with long lifecycle needs, it will further strengthen u-blox’s leadership in asset tracking, said Martin Leach, head of product centre cellular at u-blox. The partnership will integrate satellite protocol support alongside cellular protocols to expand the addressable market for IoT applications, including remote locations without reliable cellular coverage, added Leach.

“We are excited to see the convergence of cellular and satellite technologies into a powerful single device,” said David Roscoe, executive vice president of satellite communications and products at Orbcomm. He said that the combination of Orbcomm’s satellite technology with the UBX-R52/S52 chipset will “allow customers deploying IoT solutions in the supply chain, heavy equipment, and agriculture industries” for what he described as ubiquitous, reliable coverage “virtually anywhere on Earth, including remote locations, areas with poor cellular coverage, and isolated environments such as in the middle of the ocean”.

Industrial IoT applications that can benefit from these solutions include asset tracking in logistics, retail, and manufacturing, tracking and telematics equipment for agriculture, construction, and mining, livestock tracking and industrial sensors.

http://www.u-blox.com

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Radar sensor is smallest 60GHz with antennas in package, says Infineon

Mon, Jul 31, 2023

The BGT60UTR11AIP Xensiv 60GHz radar sensor is in a compact antenna in package (AIP) for a footprint of just 16mm², for use in consumer electronics, IoT applications and healthcare devices, said Infineon Technologies.

The company said it is the smallest 60GHz radar sensor with AIP available today and is suitable for small devices, for example vital sensing (heart and respiratory rate) and healthcare devices such as baby monitors and sleep trackers. It is also suitable for consumer electronics such as laptops, TVs and cameras, as well as smart home and building devices such as air conditioners, thermostats and smart doorbells. The radar sensor can also be used in industrial applications including robotics and tank level measurement.

The monolithic microwave integrated circuit (MMIC) is based on Infineon’s B11 SiGe BiCMOS technology. It has a wide bandwidth of 5.6GHz and a ramp speed of 400MHz per microsecond to enable high resolution frequency modulated continuous wave (FMCW) operation with sensitive presence and motion detection at up to 15m (50 feet). The sensor also enables precise distance measurement, 1D gesture and vital sign detection, all with sub-mm motion detection capabilities.

The integrated antennas provide a ±60 degree field of view while an integrated state machine enables real time data acquisition without processor interaction. The MMIC also includes a 12-bit ADC with a sampling rate of up to 4Msamples per second).

The MMIC’s built-in broadcast mode allows multiple chips to be synchronised. It also includes on-chip sensors for measuring Tx output power and temperature. A deep sleep mode ensures the sensor’s low power operation, added Infineon.

The Xensiv 60GHz radar BGT60UTR11AIP sensor can be ordered now and will begin shipping in Q4 2023. The Demo BGT60UTR11AIP and the radar development kit (RDK) are both available for download from the Infineon Developer Center (IDC).

https://www.infineon.com

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Drive stack expands Lattice Semiconductor’s software portfolio

Mon, Jul 24, 2023

A software stack to accelerate automotive application development is available from Lattice Semiconductor. According to the company, it enables infotainment connectivity and processing, flexible ADAS (advanced driver assistance systems), sensor bridging and processing and low power zonal bridging applications for driver, cabin, and vehicle monitoring.

“The automotive industry is rapidly evolving and cars are getting smarter than ever with new technological advancements, notably with zonal architectures requiring varied sensors and displays across vehicle models. Now more than ever, manufacturers need solutions that enable them to innovate while maintaining flexibility for future updates,” said Bob O’Donnell, president and chief analyst, TECHnalysis Research.

“Combining comprehensive software solutions from the start in [an] application design process is critical for time-to-market acceleration,” said Esam Elashmawi, chief strategy and marketing officer at Lattice Semiconductor. This is the company’s sixth software application-specific solution stack to deliver advanced automotive application features based on its low power FPGAs.

The initial release of Lattice Drive offers advanced display connectivity and processing and enables multi-resolution scaling and supports display sizes up to 4K and supports DisplayPort up to HBR 3 at 8.1Gbits per second per lane. It also provides image/video enhancement with a scalable full array local dimming and multiple display connectivity. The stack allows for bridging multiple displays, providing up to 1.5X faster DisplayPort interface than competitive devices in similar class.

It also offers efficient data processing and enables the ability to process or co-process data to offload the CPU with up to 75 per cent lower power than competitive devices in a similar class

The Lattice Drive solution stack provides comprehensive application-specific solutions that combine reference platforms and designs, demos, IP building blocks, and FPGA design tools to accelerate customer application development and time-to-market.

This is the latest stack in the Lattice solution stacks portfolio which includes Lattice sensAI (for AI applications), Lattice mVision (for embedded vision) Lattice Automate (for factory automation) and Lattice Sentry with platform firmware resiliency root of trust and Lattice ORAN for 5G ORAN deployment.

Lattice Semiconductor specialises is low power programmable devices. It works with customers working in networks, from the edge to the cloud, as well as in communications, computing, industrial, automotive and consumer markets.

http://www.latticesemi.com

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Silicon Labs unveils Amazon Sidewalk optimised SoCs

u-blox and Orbcomm create terrestrial and satellite IoT comms

Radar sensor is smallest 60GHz with antennas in package, says Infineon

Drive stack expands Lattice Semiconductor’s software portfolio

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