Embedded security using Microchip’s PIC32CK 32-bit MCUs with hardware security module

New legislation takes effect in 2024, mandating stricter requirements on cybersecurity on everything from consumer IoT devices to critical infrastructure. Meeting these new security compliance requirements from a product and supply chain perspective can be complex, costly and time-consuming. To provide developers with an embedded security solution that allows them to design applications that comply with these requirements, Microchip has announced the new family of PIC32CK 32-bit microcontrollers (MCUs) with an integrated Hardware Security Module (HSM) subsystem and Arm Cortex-M33 core featuring TrustZone technology to help isolate and secure the device.

The PIC32CK SG is the first 32-bit device on the market that combines the strong security of an HSM with TrustZone technology, a hardware-based secure privilege environment. Microchip’s latest innovation for mid-range MCUs provides designers with a cost-effective embedded security solution for their products that meets the latest cybersecurity mandates. The inclusion of an HSM provides a high level of security for authentication, secure debug, secure boot and secure updates, while TrustZone technology provides an additional level of protection for key software functions. The HSM can accelerate a wide range of symmetric and asymmetric cryptography standards, true random number generation and secure key management.

The PIC32CK MCUs from Microchip are designed to support ISO 26262 functional safety and ISO/SAE 21434 cybersecurity standards. For increased flexibility and cost efficiency, the PIC32CK MCU family offers a wide range of options to tune the level of security, memory and connectivity bandwidth based on the end application’s requirements. Options include up to 2 MB dual-panel Flash and 512 KB SRAM, with various connectivity options like 10/100 Ethernet, CAN FD and USB.

For product supply chains that require additional security and safety protection such as in industrial designs, medical devices, home appliances and consumer IoT devices, the PIC32CK will be supported with Microchip’s Trust Platform Design Suite for provisioning as a service. This platform enables the secure factory provisioning of keys, certificates and IP without the need to reveal these secrets within the supply chain.

The 32-bit PIC32CK MCU family is supported by Microchip’s software platforms including MPLAB® Harmony v3 and Trust Platform Design Suite. The PIC32CK family is also supported by the PIC32CK SG and PIC32CK GC Curiosity Ultra Development Boards including the EV33A17A and EV44P93A.

https://www.microchip.com.

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maXTouch touchscreen controller family from Microchip expands with additional security

As we see an increased number of electric vehicles (EVs) on the road, the necessary charging infrastructure must expand to meet the increased demand. Adding credit card payment options to EV chargers is becoming a standard practice in many countries—and is a mandate in the European Union—and chargers need to meet Payment Card Industry (PCI) security standards. To help EV charger designers protect their payment architectures, Microchip has launched the MXT2952TD 2.0 family of secure touchscreen controllers.

Typical touch-enabled human machine interface (HMI) and radio frequency identification (RFID) combination-based payment systems are vulnerable to hacking attacks via malicious software updates or man-in-the-middle attacks when a user enters their personal identification number (PIN) on the touchscreen. Physical mesh barriers and sensors are often used around these integrated circuits (ICs) for protection from hacking. Constant reflashing of software and device resets are used to help safeguard software integrity. The MXT2952TD 2.0 family is designed to encrypt touch data and cryptographically authenticate software updates to minimise risk and meet PCI certification compliance standards. When the RFID reader IC and the touchscreen controller are on different printed circuit boards (PCBs), it is especially difficult and expensive to build physical barriers for hack protection. Embedded firmware on the MXT2952TD 2.0 provides a more easily implemented solution for EV charger manufacturers to remain compliant with security regulations and avoid the cost of adding a second, expensive touchscreen payment module to the charger.

The outdoor nature of EV charger HMIs demand they withstand harsh weather conditions, function accurately in the presence of moisture and are resistant to vandalism. MXT2952TD 2.0 touch controller-based touchscreens remain effective when designed with IK10 standard 6 mm-thick glass, anti-reflective, anti-glare and anti-fingerprint coatings and IR filter/UV filter layers. Microchip’s proprietary differential touch sensing delivers exceptional noise immunity for superior touch performance even when used with thick gloves.

“The maXTouch 2952TD 2.0 family provides EV charger designers with a cost-effective, secure design architecture for implementing credit card payments with PIN entry on their touchscreens,” said Patrick Johnson, senior corporate vice present overseeing Microchip’s human machine interface division. “Combined with the rugged, outdoor HMI touchscreen technology that Microchip’s maXTouch portfolio is known for, the new addition to the 2952TD family of touchscreen controllers offers our customers secure designs and the exceptional touch performance necessary for outdoor applications.”

In addition to EV chargers, the MXT2952TD 2.0 family is well-suited for most unattended outdoor payment terminals such as parking meters, bus ticketing meters and other types of point-of-sale (POS) systems. The 2952TD 2.0 is specifically optimised for 20” screen sizes and its sister part, the MXT1664TD, is available for 15.6” screen sizes.

Standard maXTouch family development tools are available including maXTouch Studio Integrated Development Environment (IDE) and maXTouch Analyser, a production end-of-line test/inspection tool.

Microchip also has a number of factory-trained global touch sensor module partners to help support custom touch sensor and/or touchscreen display designs.

https://www.microchip.com.

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THine introduces camera kit for NVIDIA Jetson Orin NX/Nano

THine Solutions have announced the new THEIA-CAM 13MP PDAF camera, THSCJ101, for the NVIDIA Jetson Orin NX and Jetson Orin Nano platforms. Along with its pre-optimised ISP firmware and Linux driver, Jetson users are now able to easily integrate advanced imaging capabilities into their systems.

The THSCJ101 kit is a camera reference design kit for embedded camera applications that are using the NVIDIA Jetson Orin NX or the Jetson Orin Nano platform. The THSCJ101 kit is based on THine’s THP7312-P ISP and Sony’s IMX258 13MP CMOS PDAF image sensor.

THine’s optimised ISP firmware provides ultra-quick autofocus using Phase Detection Autofocus (PDAF) technology and best-in-class image quality. The kit hardware includes all items required to interface with Jetson Orin carrier boards with a 22-pin MIPI CSI-2 input connector, including a camera board in an acrylic case and a flat flexible cable.

The Video4Linux2 (V4L2) driver for the THSCJ101 is also available to control various video functions. The performance of each kit is repeatable for use in high volume production due to our production process to characterise the image parameters of each image sensor and to calibrate the image signal processing to compensate for variation from sensor to sensor.
All technical information including the reference circuit schematics, ISP firmware, and V4L2 Driver are available to customers.

Also, for customers that require unique image performance features, THine can provide a GUI based software development tool that customises the ISP firmware and/or the image sensor selection. As a result, the THSCJ101 can accelerate NVIDIA Jetson Orin NX/Nano platform users’ time-to-market without expensive integration cost or additional effort for developing embedded camera systems.

THEIA-CAM is designed for embedded vision systems. Using and optimising THine’s own ISP, THine offers Best-in-Class image quality and high production quality suitable for any project phase from proof of concept to high volume production. THEIA-CAM supports various operating systems including Windows, macOS, Android, and Linux, and various platforms including Raspberry Pi, Jetson Orin, i.MX 8M families, and MediaTek Genio series. THEIA-CAM addresses wide-ranging camera applications including but not limited to AI + IoT devices, AR glasses, barcode reading devices, biometric devices, bodycams, document scanners, machine vision systems, medical scopes, microscopes, surveillance cameras, vision assistance glasses, and webcams. THSCU101, the first Kit in the family, is a 13MP PDAF USB video class (UVC) Camera

https://www.thinesolutions.com

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New Qualcomm-built advanced video processor by Teledyne FLIR powers AI at the Edge

Teledyne FLIR has announced the Teledyne FLIR AVP, an advanced video processor designed to power Teledyne FLIR’s Prism AI and computational imaging at the edge.

The AVP incorporates the latest Qualcomm QCS8550, the most advanced mobile processor chip from the leader in mobile, automotive, and robotics system-on-chip (SoC) technology. The AVP provides best-in-class artificial intelligence (AI) performance within a small, lightweight, and low-power module for thermal and visible camera integration into unmanned aerial vehicles, robots, small gimbals, handheld devices, and fixed-mounted security systems.

AVP runs the Teledyne FLIR Prism AI and ISP software libraries and interfaces with the Boson and Neutrino thermal infrared imaging camera modules and a wide range of popular visible cameras. Trained on the world’s largest thermal image data lake of more than 5 million annotations, Prism AI is a powerful perception software designed to detect, classify, and track targets or objects for automotive autonomy, automotive automatic emergency braking, airborne camera payloads, counter-drone systems, ground intelligence, surveillance and reconnaissance (ISR), and perimeter security. Prism ISP is a comprehensive set of image processing algorithms that include super resolution, image fusion, atmospheric turbulence removal, electronic stabilisation, local-contrast enhancement, and noise reduction.

“The new AVP is the most powerful and SWaP-optimised processor on the market today, running AI workloads up to five times faster than competitive offerings,” said Dan Walker, vice president of product management, Teledyne FLIR. “The combination of powerful edge computing and our Prism digital solutions ushers in a new era of electro-optical system capabilities while simplifying development and reducing integration risk.”

The AVP is designed to empower integrators to build powerful, edge-intelligent products. It is supported by several tools to simplify and streamline development including a Qualcomm RB5 development kit. Software and board-support packages are also available to enable developers to design and fabricate custom interface boards that meet each product’s specific form, fit, function, and input-output (IO) requirements.

https://www.flir.com/avp.

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