ICs & Semiconductors Archives - Page 30 of 227

THine introduces camera kit for NVIDIA Jetson Orin NX/Nano

Tue, Apr 23, 2024

THine Solutions have announced the new THEIA-CAM 13MP PDAF camera, THSCJ101, for the NVIDIA Jetson Orin NX and Jetson Orin Nano platforms. Along with its pre-optimised ISP firmware and Linux driver, Jetson users are now able to easily integrate advanced imaging capabilities into their systems.

The THSCJ101 kit is a camera reference design kit for embedded camera applications that are using the NVIDIA Jetson Orin NX or the Jetson Orin Nano platform. The THSCJ101 kit is based on THine’s THP7312-P ISP and Sony’s IMX258 13MP CMOS PDAF image sensor.

THine’s optimised ISP firmware provides ultra-quick autofocus using Phase Detection Autofocus (PDAF) technology and best-in-class image quality. The kit hardware includes all items required to interface with Jetson Orin carrier boards with a 22-pin MIPI CSI-2 input connector, including a camera board in an acrylic case and a flat flexible cable.

The Video4Linux2 (V4L2) driver for the THSCJ101 is also available to control various video functions. The performance of each kit is repeatable for use in high volume production due to our production process to characterise the image parameters of each image sensor and to calibrate the image signal processing to compensate for variation from sensor to sensor.
All technical information including the reference circuit schematics, ISP firmware, and V4L2 Driver are available to customers.

Also, for customers that require unique image performance features, THine can provide a GUI based software development tool that customises the ISP firmware and/or the image sensor selection. As a result, the THSCJ101 can accelerate NVIDIA Jetson Orin NX/Nano platform users’ time-to-market without expensive integration cost or additional effort for developing embedded camera systems.

THEIA-CAM is designed for embedded vision systems. Using and optimising THine’s own ISP, THine offers Best-in-Class image quality and high production quality suitable for any project phase from proof of concept to high volume production. THEIA-CAM supports various operating systems including Windows, macOS, Android, and Linux, and various platforms including Raspberry Pi, Jetson Orin, i.MX 8M families, and MediaTek Genio series. THEIA-CAM addresses wide-ranging camera applications including but not limited to AI + IoT devices, AR glasses, barcode reading devices, biometric devices, bodycams, document scanners, machine vision systems, medical scopes, microscopes, surveillance cameras, vision assistance glasses, and webcams. THSCU101, the first Kit in the family, is a 13MP PDAF USB video class (UVC) Camera

https://www.thinesolutions.com

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New Qualcomm-built advanced video processor by Teledyne FLIR powers AI at the Edge

Thu, Apr 18, 2024

Teledyne FLIR has announced the Teledyne FLIR AVP, an advanced video processor designed to power Teledyne FLIR’s Prism AI and computational imaging at the edge.

The AVP incorporates the latest Qualcomm QCS8550, the most advanced mobile processor chip from the leader in mobile, automotive, and robotics system-on-chip (SoC) technology. The AVP provides best-in-class artificial intelligence (AI) performance within a small, lightweight, and low-power module for thermal and visible camera integration into unmanned aerial vehicles, robots, small gimbals, handheld devices, and fixed-mounted security systems.

AVP runs the Teledyne FLIR Prism AI and ISP software libraries and interfaces with the Boson and Neutrino thermal infrared imaging camera modules and a wide range of popular visible cameras. Trained on the world’s largest thermal image data lake of more than 5 million annotations, Prism AI is a powerful perception software designed to detect, classify, and track targets or objects for automotive autonomy, automotive automatic emergency braking, airborne camera payloads, counter-drone systems, ground intelligence, surveillance and reconnaissance (ISR), and perimeter security. Prism ISP is a comprehensive set of image processing algorithms that include super resolution, image fusion, atmospheric turbulence removal, electronic stabilisation, local-contrast enhancement, and noise reduction.

“The new AVP is the most powerful and SWaP-optimised processor on the market today, running AI workloads up to five times faster than competitive offerings,” said Dan Walker, vice president of product management, Teledyne FLIR. “The combination of powerful edge computing and our Prism digital solutions ushers in a new era of electro-optical system capabilities while simplifying development and reducing integration risk.”

The AVP is designed to empower integrators to build powerful, edge-intelligent products. It is supported by several tools to simplify and streamline development including a Qualcomm RB5 development kit. Software and board-support packages are also available to enable developers to design and fabricate custom interface boards that meet each product’s specific form, fit, function, and input-output (IO) requirements.

https://www.flir.com/avp.

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Insight SiP launches miniature Wi-Fi 6 combo module with integrated antennas

Mon, Apr 15, 2024

Insight SiP has launched its ISP5261 Wi-Fi 6 module at Embedded World 2024. This module acts as a fully functioning Bluetooth LE and Wi-Fi radio node, capable of a long autonomous operation on battery power. It can form the core of an autonomous IOT device requiring Bluetooth LE and Wi-Fi connectivity.

This device offers integration and miniaturisation of RF technologies, using System in Package technology. The device also benefits from Insight SiP’s proprietary “Antenna-in-Package” techniques.

The module is based on NXP Semiconductors RW612 single-chip Wi-Fi/Bluetooth LE/802.15.4 Wireless MCU System on Chip (SoC). The module integrates a 32-bit ARM Cortex-M33 CPU running at 260 MHz, additional 4 MB of QSPI flash memory, 1.2 MB SRAM as well as analog and digital peripherals. Its powerful processor and ample memory permit this module to be used as the core of a sophisticated IOT application.

Despite the small size of 12 x 12 x 1.8 mm, the module integrates decoupling capacitors, 40 MHz crystal for Wi-Fi and Bluetooth LE and 32.768 kHz crystal for low power timing, DC-DC converters, RF matching circuits and a dual-band (2.4 and 5 GHz) antenna. This module thus offers class leading performance and miniaturisation.

Low power consumption and advanced power management enable battery lifetimes up to several months on AA batteries. Wi-Fi communication is compliant with the Wi-Fi Alliance specifications for Wi-Fi 6 including the following protocols: IEEE 802.11ax/ac/n/a/g/b/e/i/k/v/w.

Bluetooth LE connectivity is compliant with Bluetooth 5.4, enabling Long Range communication. ISP5261 Bluetooth LE section can be used either in peripheral or central roles and can handle up to 16 simultaneous central/peripheral connections. Also supported are the Matter and Thread protocols, allowing easy internet access and support for SmartHome applications.

Security Features are prominent in the module, with an ARM TrustZone processor, and NXP Edgelock hardware security module, supporting Root of Trust, secure communication and update verification.

https://www.insightsip.com

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Rohm develops a new Op Amp that minimises current consumption

Thu, Apr 11, 2024

Rohm has developed a linear operational amplifier (op amp) – LMR1901YG-M – featuring the lowest* current consumption in the industry. This makes it ideal for amplifying sensor signals used to detect and measure temperature, flow rate, gas concentration, and other parameters in applications powered by internal sources (i.e. batteries).

In recent years, advanced control has been in increasing demand for various applications in consumer and industrial electronics. Therefore, there is an increasing need for accurate sensing of parameters relevant to the application – such as, temperature, humidity, vibration, pressure, and flow rate. Op amps whose main function is to amplify sensor signals for subsequent detection and/or analog-to-digital conversion, is a crucial component in the signal chain – greatly affecting both accuracy and power consumption. Rohm is developing op amps that satisfy the dual need for high accuracy and low current consumption. By further refining the circuit design based on original Nano Energy technology.

The LMR1901YG-M leverages original ultra-low power technology that thoroughly suppresses current increase caused by temperature and voltage changes to reduce current consumption to just 160nA (Typ.) – approximately 38% lower than that of general low power op amps. This not only extends the life of applications powered by internal batteries like electronic shelf labels, but also contributes to longer operating times for smartphones and other devices equipped with rechargeable batteries. At the same time, this low current consumption does not change over the temperature range of -40°C to +105°C – allowing stable low-power operation, even in environments where external temperatures fluctuate, including fire alarms and environmental sensors.

Other performance enhancements include 45% reduction of input offset voltage to just 0.55mV (Max. Ta=25°C) over general low-current op amps while a maximum input offset voltage temperature drift of 7V/°C is guaranteed. This enables high accuracy amplification of sensor signals. Capable of operating from 1.7V to 5.5V supply voltage and offering rail-to-rail input/output, LMR1901YG-M is suitable for a wide variety of applications in the industrial equipment and consumer markets. Rohm’s new op amp also complies with the automotive reliability standard AEC-Q100 – ensuring stable operation even under harsh conditions such as vehicle cabins without compromising functionality.

In addition to various technical documents necessary for circuit design and SPICE models for simulation (available free of charge on Rohm’s website), the LMR1901YG-M can be used with Rohm Solution Simulator to speed up time to market.

https://www.rohm.com

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THine introduces camera kit for NVIDIA Jetson Orin NX/Nano

New Qualcomm-built advanced video processor by Teledyne FLIR powers AI at the Edge

Insight SiP launches miniature Wi-Fi 6 combo module with integrated antennas

Rohm develops a new Op Amp that minimises current consumption

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