600V GaN FET supports applications up to 10kW

Claimed to double power density in industrial and telecomms applications, the LMG341x family of high-voltage GaN FETs has been announced by Texas Instruments.

The 600V GaN FETs of 50 and 70-mOhm power stages support applications from sub 100W to 10kW. The FETs enable designers to create smaller, more efficient and higher-performing designs compared to silicon FETs in AC/DC power supplies, robotics, renewable energy, grid infrastructure, telecomms and personal electronics applications.

The LMG341x family devices provide an alternative to traditional cascade and standalone GaN FETs by integrating functional and protection features to simplify design, says TI. This enable greater system reliability and optimisation of the performance of high-voltage power supplies. With integrated current limiting of up to 100 nanoseconds and over-temperature detection, the devices protect against unintended shoot-through events and prevent thermal runaway. System interface signals enable a self-monitoring capability.

TI’s integrated GaN power stage doubles power density and reduces losses by 80 per cent compared to silicon MOSFETs, explains TI. Each device is capable of fast, 1MHz switching frequencies and slew rates of up to 100V/nanoseconds.

The family of GaN FETs is backed by 20 million hours of device reliability testing, including accelerated and in-application hard switch testing.

The LMG3410R050, LMG3410R070 and LMG3411R070are available now in 8.0 x 8.0mm split-pad, quad flat no-lead (QFN) packaging.

Visitors to the Texas Instruments stand C4-131 at electronica (13 – 16 November at Messe Munchen, Germany) will see a 10kW cloud-enabled grid link demonstration, jointly developed by TI and Siemens. The demonstration uses TI’s LMG3410R050 600V GaN FET with integrated driver and protection, enabling engineers to achieve 99 per cent efficiency and up to 30 per cent reduction in power component size compared to a traditional silicon design.

Texas Instruments is a semiconductor design and manufacturing company that develops analogue integrated circuits (ICs) and embedded processors.

http://www.TI.com

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AC/DC converter in tablet configuration enables high density racks

A three-phase, AC/DC converter module, the RFM, from Vicor, is capable of delivering 10kW of regulated 48V DC in a power tablet configuration measuring 9.4 x 5.9 x 0.6-inches (240 x 150 x 15mm).

The RFM provides a power-factor-corrected, regulated, and isolated DC output with integrated filtering and built-in fault protection for redundant operation. It can be configured to accept worldwide three-phase AC mains from 200 to 480V AC.

The low-profile power tablet design aids power density and thermal management, says Vicor. For example, four RFMs in parallel, including input-disconnect circuitry, rectification and hold-up energy storage at 48V, can supply 40kW of power within 1U of rack space.

The RFM power tablet package provides thermal management for advanced cooling, including liquid cooling, of high-power server racks for demanding high performance computing (HPC) and artificial intelligence (AI) inference and learning applications.

Vicor explains that 48V (including 54V DC) distribution is the emerging standard in high-power racks using smaller-gauge wiring. It achieves substantially lower distribution losses, than legacy 12V DC distribution. In combination with Vicor 48V Power-on-Package (PoP) and 48V Direct-to-PoL solutions, the RFM enables dense and efficient end-to-end power system solutions, from three-phase AC to sub-1.0V AI processors at the point-of-load, confirms Vicor.

The 10kW power tablet RFM is the first in a new series of single and three-phase AC/DC modules featuring power outputs from 150 to 15kW.

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http://www.vicorpower.com

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Low-power microcontrollers secure the IoT

Building on Arm TrustZone hardware-based cyber protection for resource-constrained connected devices, the STM32L5 microcontroller has an Arm Cortex-M33 core.

The Cortex-M33 boosts protection for small devices by integrating Arm’s TrustZone hardware-based security, explains ST. The STM32L5-series microcontrollers add further enhancements including software isolation, secure boot, key storage, and hardware cryptographic accelerators. They also provide rich functionality, says the company, and long run-times powered by coin cells or energy harvesting.

They consume as little as 33nA in shutdown mode and achieving 402 ULPMark-CP in the EEMBC ULPBench. The microcontrollers also integrate low power techniques such as adaptive voltage scaling, real-time acceleration, power gating, and multiple reduced-power operating modes.

Integrated digital and analogue peripherals, and consumer and industrial interfaces such as CAN FD, USB Type-C, and USB Power Delivery, the STM32L5 microcontrollers can be used for products such as industrial sensors or controls, home-automation devices, smart meters, fitness trackers, smart watches, medical pumps or meters.

The TrustZone IP integrated in the STM32L5 series microcontrollers implements trusted-computing principles for authenticating devices connected to a network. There is the freedom to include or exclude each I/O, peripheral, or area of flash or SRAM from TrustZone protection, allowing sensitive workloads to be fully isolated for maximum security. ST has engineered TrustZone to ensure support for secure boot, special read-out and write protection for integrated SRAM and flash, and cryptographic acceleration including AES 128/256-bit key hardware acceleration, private key acceleration (PKA), and AES-128 On-The-Fly Decryption (OTFDEC) to protect external code or data. Active tamper detection and support for secure firmware install are also included.

In addition to the flexible power-saving operating modes and ST’s low-power technologies, the STM32L5 series also features a switched-mode step-down regulator that improves low-power performance when the VDD voltage is high enough and can be powered up or down on-the-fly.

The microcontrollers achieve up to 165 DMIPS/427 CoreMark using the ST ART Accelerator at 110MHz. The ST ART Accelerator now supports both internal flash and external memory with an 8kbyte instruction cache for greater efficiency in case the software runs out of external memory.

512kbyte dual-bank flash allows read-while-write operation to aid device management and ensures a high level of safety by supporting error correction code (ECC) with diagnostics. There is also a 256kbyte-SRAM and features to support high-speed external memory including single, dual, quad, or octal SPI and Hyperbus Flash or SRAM, and an interface for SRAM, PSRAM, NOR, NAND or FRAM.

The STM32L5 series also introduces new digital peripherals including USB Full Speed with dedicated supply allowing customers to keep USB communication even when the system is powered at 1.8V. There is also a UCPD controller compliant with USB Type-C Rev. 1.2 and USB Power Delivery Rev. 3.0 specifications.

Analog features include an ADC, two power-gated DACs, two low-power comparators, and two operational amplifiers with external or internal follower routing and programmable-gain amplifier (PGA) capability.

The STM32L5 series is available in standard temperature grade for consumer and commercial applications, or high-temperature grade specified from -40 to +125 degree C.

STM32L5-series microcontrollers are sampling now and scheduled to begin production in Q2 2019.

http://www.st.com/stm32l5

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Integrated open image signal processor adds to R-Car SoC applications

An integrated open image signal processor (ISP) from Renesas Electronics can be integrated on the company’s R-Car V3M and R-Car V3H SoCs to speed the development of automotive smart camera applications.

According to Renesas, integrating the ISP on the R-Car V3x SoCs and leveraging MM Solutions’ Automotive Camera Development Kit (AutoCDK), enables automotive Tier 1s to simplify the sensor calibration and tuning process for camera applications, including front camera and surround view to reduce the time to market.

The open ISP solution supports a range of development needs, from low-level-programming ISP capabilities via the open interface to the AutoCDK for users to jumpstart development using the MM Solutions’ tools.

Autonomous vehicles will be required to sense their environments, with smart cameras in front and surround view systems used to detect traffic signs, lanes, pedestrians, vehicles, and other obstacles in real time.

High performance computer vision requires highly reliable, highly configurable ISPs that support high dynamic ranges in challenging driving situations as well as low-noise performance and imagery perception close to that of a human eye’s level – or beyond, explains Renesas. Drivers will want to see a realistic visual representation of the surrounding of the car, where the ISP plays an important role for image adjustment.

In collaboration with MM Solutions, Renesas has developed an open ISP solution that helps users tune and control their sensors to support both human vision and machine vision. Integrating the ISP vision processing software onto the R-Car V3x SoCs provides a camera-neutral approach, offering camera manufacturers and Tier 1s the flexibility to work with ECUs and sensors of choice.

Jean-Francois Chouteau, vice president of the Automotive Solution Business Unit, Renesas Electronics, said: “Developing the software solution as part of the Renesas autonomy platform allows customers to take advantage of robust off-the-shelf middleware as well as privileged access to the image quality expertise of our partner MM Solutions.”

“Turnkey ISP solutions that support multiple platforms are essential to achieving excellent camera quality while meeting increasingly shorter time-to-market challenges for front camera, surround view, and other automotive camera applications,” added Ivan Poibrenski, managing director of MM Solutions.

“Achieving high dynamic range and LED flicker mitigation simultaneously is the key challenge for ADAS camera systems,” said Tsutomu Haruta, deputy senior general manager, Sony Semiconductor Solutions. “The combination of Renesas’ ISP solution and Sony’s image sensors enables our automotive customers to . . . realise a superior image quality.”

Mass production of the Renesas R-Car V3M and R-Car V3H SoCs is scheduled to begin Q2 2019 and Q3 2019, respectively. The AutoCDK from MM Solutions will be available in November 2018.

 Renesas will demonstrate the Open ISP using the Renesas R-Car V3M, MM Solutions’ AutoCDK, and Sony’s IMX390 image sensor in booth 6 at AutoSens 2018, September 17-20, 2018, Brussels, Belgium.

http://www.renesas.com

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