FPGA provides customised solutions for data0centric business

FPGAs that will provide customised solutions for data-centric challenges in embedded, network and data centre sectors have been released by Intel. The Agilex FPGAs deliver customised connectivity and acceleration and performance and power improvements for diverse workloads, says Dan McNamara, Intel senior vice president, Programmable Solutions Group.

The Agilex FPGA is believed to be the first FPGA to support Compute Express Link, a cache and memory coherent interconnect to future Intel Xeon Scalable processors. The FPGA’s second generation HyperFlex architecture provides up to 40 per cent higher performance, or up to 40 per cent lower total power compared with Intel Stratix 10 FPGAs, notes Intel.

It is also believed to be the only FPGA supporting hardened BFLOAT16 and up to 40TFLOPS of DSP performance (FP16) and it has Gen 5 PCIe for higher bandwidth that PCIe Gen 4.

The Agilex FPGA supports data transfer rates of up to 112Gbits per second and has advanced memory support with DDR5, HBM and Intel Optane DC persistent memory support.

The Agilex FPGA fabric is built on Intel’s 10nm process with heterogeneous 3D SiP technology. This provides the capability to integrate analogue, memory, custom computing, custom I/O, and Intel eASIC device tiles into a single package with the FPGA fabric. Intel delivers a custom logic continuum with reusable IPs through a migration path from FPGA to structured ASIC. One application program interface (API) provides a software-friendly heterogeneous programming environment, enabling software developers to access acceleration via the use of FPGAs, maintains Intel.

The FPGAs have been developed to support customers in aggregating and processing increasing amounts of data traffic for emerging, data driven industries like edge computing, networking and the cloud. Intel Agilex FPGAs can be used in edge analytics for low-latency processing, virtualised network functions to improve performance, or data centre acceleration for greater efficiency, says Intel. They are built to deliver customised solutions for applications from the edge to the cloud.

The Agilex FPGAs have the flexibility to meet the hardware system challenges presented by advances in artificial intelligence (AI) analytics at the edge, network and the cloud, explains Intel.

http://www.intel.com

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FPGA provides customised solutions for data0centric business

FPGAs that will provide customised solutions for data-centric challenges in embedded, network and data centre sectors have been released by Intel. The Agilex FPGAs deliver customised connectivity and acceleration and performance and power improvements for diverse workloads, says Dan McNamara, Intel senior vice president, Programmable Solutions Group.

The Agilex FPGA is believed to be the first FPGA to support Compute Express Link, a cache and memory coherent interconnect to future Intel Xeon Scalable processors. The FPGA’s second generation HyperFlex architecture provides up to 40 per cent higher performance, or up to 40 per cent lower total power compared with Intel Stratix 10 FPGAs, notes Intel.

It is also believed to be the only FPGA supporting hardened BFLOAT16 and up to 40TFLOPS of DSP performance (FP16) and it has Gen 5 PCIe for higher bandwidth that PCIe Gen 4.

The Agilex FPGA supports data transfer rates of up to 112Gbits per second and has advanced memory support with DDR5, HBM and Intel Optane DC persistent memory support.

The Agilex FPGA fabric is built on Intel’s 10nm process with heterogeneous 3D SiP technology. This provides the capability to integrate analogue, memory, custom computing, custom I/O, and Intel eASIC device tiles into a single package with the FPGA fabric. Intel delivers a custom logic continuum with reusable IPs through a migration path from FPGA to structured ASIC. One application program interface (API) provides a software-friendly heterogeneous programming environment, enabling software developers to access acceleration via the use of FPGAs, maintains Intel.

The FPGAs have been developed to support customers in aggregating and processing increasing amounts of data traffic for emerging, data driven industries like edge computing, networking and the cloud. Intel Agilex FPGAs can be used in edge analytics for low-latency processing, virtualised network functions to improve performance, or data centre acceleration for greater efficiency, says Intel. They are built to deliver customised solutions for applications from the edge to the cloud.

The Agilex FPGAs have the flexibility to meet the hardware system challenges presented by advances in artificial intelligence (AI) analytics at the edge, network and the cloud, explains Intel.

http://www.intel.com

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Platform protects comms between smart factory and the cloud

At the Hannover Fair next week, Infineon Technologies will present what it claims is the world’s first Trusted Platform Module (TPM) specifically for industrial applications. The Optiga TPM SLM 9670 protects the integrity and identity of industrial PCs, servers, industrial controllers or edge gateways, explains Infineon. It controls access to sensitive data in key positions in a connected, automated factory as well as at the interface to the cloud.

The TPM protects sensitive data in connected devices and lowers the risk of data and production losses due to cyber attacks. It also shortens time to market and reduces costs, claims Infineon. Using Infineon’s audited and certified TPMs, manufacturers of industrial devices can achieve higher security levels of the IEC 62443 standard and accelerate their certification processes. Infineon says they can also cut costs for maintenance of the devices through secured remote software updates.

The Optiga TPM SLM 9670 meets the TPM 2.0 standard of the Trusted Computing Group and is certified by an independent test lab in accordance with Common Criteria. Service life is 20 years firmware can be updated on the chip to meet long-term security risks that may be encountered in an industrial environment. The Optiga TPM SLM 9670 has an extended temperature range of -40 to +105 degrees C and is qualified according to the industrial JEDEC JESD47 standard.

The Optiga TPM SLM 9670 is manufactured at Infineon’s security-certified facilities in Germany and will be available in large volumes from the second half of 2019.

Infineon offers application-specific solutions for business PCs and routers, connected vehicles, or cloud applications. The Optiga TPM SLM 9670 will be presented for the first time at this year’s Hannover Messe (1 to 4 April). Infineon will run a demonstrator for energy-efficient and secured smart factories at the stand of Amazon Web Services (Hall 6, Stand F46).

http://www.infineon.com

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Infineon claims industry’s first true 1000A voltage regulator for AI

Adding to its high current system chipset portfolio, Infineon claims to offer the industry’s first 16-phase digital PWM multiphase controller.

The XDPE132G5C extends the existing portfolio which enables currents of 500 to 1000A and above for next generation CPUs, GPUs, FPGA and ASICs used in artificial intelligence (AI) and 5G datacomms applications.

It has been introduced as CPU current requirements increase to enable next-generation AI and networking workloads, DC/DC voltage regulators to deliver more than 500A to the load. The XDPE132G5C has a true 16-phase digital PWM engine and an improved advanced transient algorithm to address these high phase count requirements, says Infineon. The true active current sharing between phases enables a reliable, compact and cost-saving design, with no need for extra logic doubler ICs.

The XDPE132G5C offers fine V out setting in 0.625mV increments to meet the demands of ASICs and FPGAs of V out control in less than 1mV steps, seen in communication systems today. The XDPE132G5C also supports auto-restart for communications with options to reduce remote site maintenance following power or system glitches.

The XDPE132G5C is packaged in a 7.0 x 7.0mm 56-pin QFN to accommodate 16 phases. It employs a full digital and programmable load line and is PMBus 1.3/AVS-compliant.

Infineon advises that it can be paired with TDA21475, the thermally efficient integrated current sense power stage, to efficiently deliver over 1000A.

The 70A-rated TDA21475 power stage is housed in a 5.0 x 6.0mm package. It provides efficiency of more than 95 per cent. The exposed top significantly reduces the R th(j-top) from 19 degrees C/W in the over-moulded package to 1.6 degrees C/W. This removes heat from the top of the package, for voltage regulator power density and optimal phase count and footprint. The TDA21475 also offers smart over-current and over-voltage protection and delivers temperature and current information to the XDPE132G5C controller.

The company also offers the IR35223 true 10-phase PWM digital controller. This controller provides a cost-effective option for voltage regulation up to 500 A. The IR35223 is housed in a 6.0 x 6.0mm, 48-pin QFN package and provides advanced transient performance and telemetry features including PMBus 1.3/AVS bus compliance.

http://www.infineon.com/next-gen-processors

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