Renesas introduces new AnalogPAK programmable mixed-signal ICs

Renesas has announced new AnalogPAK ICs, including lower power and automotive-qualified devices along with the industry’s first programmable 14-bit SAR ADC (Successive-Approximation Register Analog-Digital Converter).

AnalogPAK devices are part of Renesas’ GreenPAK Family of Programmable Mixed-Signal Matrix products: cost-effective, NVM programmable devices which enable innovators to integrate many system functions while minimising component count, board space, and power consumption. GreenPAK and AnalogPAK ICs deliver functional replacement of mixed-signal standard products and stand-alone discrete circuits. They also provide reliable hardware supervisory functions for SoCs and microcontrollers. GreenPAK and AnalogPAK devices provide benefits for virtually any application, including consumer electronics, computing, white goods, industrial, communications, and automotive. Using Go Configure Software Hub and the GreenPAK Development Kit, designers can create and program a custom circuit in minutes.

Renesas’ new SLG47011 AnalogPAK device delivers a new level of performance for configurable analog integrated circuits. It includes a rich set of digital and analog features including programable multichannel 14-bit SAR ADC with Programmable Gain Amplifier (PGA). The SLG47011 also has flexible, user-defined power saving modes for all macrocells that enable designers to switch off some blocks in sleep mode and therefore reduce power consumption to the µA level.

The SLG47011 can be used to extend the performance of, or to offload an MCUs. It can also be used in conjunction with an MCU to replace a complex analog front-end (AFE). Key functions supported by the SLG47011 include measurement, data processing, logic control and data output.

In addition to the SLG47011, Renesas is introducing two other AnalogPAK devices, the cost-optimised SLG47001/3, and the automotive-qualified SLG47004-A.

SLG47001/3 AnalogPAK Devices
The SLG47001 and SLG47003 enable the implementation of precise measurement systems with a low price point and a very compact package to address applications such as gas sensors, power meters, measurement equipment, servers, wearables, industrial robots, industrial and smart home sensor modules.
• Two ultra-low offset op-amps – 9 µV (max.)
• Two 10-bit digital rheostats
• Six-channel sampling comparator
• Analog switch
• Voltage reference
• 59-bytes pattern generator
• 2k/10k/25MHz oscillators
• Fully configurable blocks: LUTs, flip-flops, shift registers, timers, counters, delays

SLG47004-A AnalogPAK Device
The SLG47004-A delivers the functionality of the SLG47004 devices with the addition of automotive qualification Grade 1 for applications such as infotainment, navigation, chassis and body electronics, automotive display clusters and more. The new devices support a temperature range of -40°C to 125°C.

Device Availability
All of the new AnalogPAK devices are available today from Renesas and its authorised distributors, along with customised development kits. The SLG47011 comes in a 2.0 x 2.0 mm 16-pin STQFN package. The SLG47001 is packaged in a 2.0 mm x 3.0 mm 20-pin STQFN, while the SLG47003 comes in a 3.0 mm x 3.0 mm 24-pin STQFN. The SLG47004-A is available in a 4.0 mm x 4.0 mm 24-pin TQFN.

More information on all the new offerings is available at https://www.renesas.com/analogpak.

 

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Renesas brings the high performance of Arm Cortex-M85 processor to cost-sensitive applications

Renesas has introduced the RA8E1 and RA8E2 microcontroller (MCU). Introduced in 2023, the RA8 Series MCUs are the first to implement the Arm Cortex-M85 processor, enabling them to deliver market-leading 6.39 Coremark/MHz1 performance. The new RA8E1 and RA8E2 MCUs offer the same performance but with a streamlined feature set that reduces costs, making them excellent candidates for high-volume applications such as industrial and home automation, office equipment, healthcare, and consumer products.

The RA8E1 and RA8E2 MCUs deploy Arm Helium technology, Arm’s M-Profile Vector Extension that provides up to a 4X performance boost for digital signal processor (DSP) and machine learning (ML) implementations versus MCUs based on the Arm Cortex-M7 processor. This performance uplift enables applications in the fast-growing field of AIoT where high performance is crucial to execute AI models.

RA8 Series devices integrate low power features and multiple low power modes to improve power efficiency, even while providing industry-leading performance. A combination of low power modes, independent power domains, lower voltage range, fast wakeup time and low typical active and standby currents enables lower overall system power and allows customers to lower overall system power consumption and meet regulatory requirements. The new Arm Cortex-M85 core also performs various DSP/ML tasks at much lower power.

RA8 Series MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of existing designs to the new RA8 Series devices.

Key Features of the RA8E1 MCUs
• Core: 360 MHz Arm Cortex-M85 with Helium and TrustZone
• Memory: 1MB Flash, 544 KB SRAM (including 32KB TCM w/ ECC, 512KB user SRAM with parity protection), 1KB standby SRAM, 32KB I/D caches

• Peripherals: Ethernet, XSPI (Octal SPI), SPI, I2C, USBFS, CAN-FD, SSI, ADC 12bit, DAC 12bit, HSCOMP, temperature sensor, 8-bit CEU, GPT, LP-GPT, WDT, RTC
• Packages: 100/144 LQFP

Key Features of the RA8E2 MCUs
• Core: 480 MHz Arm Cortex-M85 with Helium and TrustZone
• Memory: 1MB Flash, 672 KB SRAM (including 32KB TCM w/ ECC, 512KB user SRAM with parity protection+128 KB additional user SRAM), 1KB standby SRAM, 32KB I/D caches

• Peripherals: 16-bit external memory I/F, XSPI (Octal SPI), SPI, I2C, USBFS, CAN-FD, SSI, ADC 12bit, DAC 12bit, HSCOMP, temperature sensor, GLCDC,2DRW, GPT, LP-GPT, WDT, RTC
• Packages: BGA 224

Availability
The RA8E1 and RA8E2 Group MCUs are available now, along with the FSP software. Renesas is also shipping a Fast Prototyping Board for the RA8E1 and will offer an RA8E2 Evaluation Kit including a TFT Display in early Q1 2025.

https://www.renesas.com

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Mouser is now shipping the new MCX W series MCUs from NXP Semiconductors

The MCX W series are compact, secure, wireless MCUs designed to enable interoperable, scalable and innovative designs for the next generation of smart and secure connected devices in edge, IoT, smart home, building automation and controls, and smart energy applications.

The NXP Semiconductors MCX W series is based on the Arm Cortex-M33 core, offering a unified range of pin-compatible multiprotocol wireless MCUs for Matter, Thread, Bluetooth Low Energy and Zigbee. The MCX W series includes the industry’s first wireless MCU to support the new Bluetooth Channel Sounding standard, which improves the accuracy and security of distance measurement compared to traditional Bluetooth technology for a wide range of applications, such as secure access, asset tracking and indoor wayfinding. With NXP’s Trimension portfolio of ultra-wideband (UWB) secure radar and fine-ranging products, The MCX W series enhances a broad range of market segments and applications in ambient computing. The MCX W series supports both standalone or hosted architectures and is pin- and software-compatible, allowing developers to easily migrate to the part that best fits their use case. The MCX W series is supported by the MCUXpresso Developer Experience.

Also available is the NXP FRDM-MCXW71 development board. The FRDM-MCXW71 is a compact and scalable multiprotocol board for rapid prototyping and easy evaluation of the MCXW71 wireless MCU, with wireless support for Bluetooth LE, Zigbee, Thread, and Matter. This board includes an onboard MCU-Link debugger, industry-standard headers for easy access to the MCU’s I/Os, an accelerometer, a light sensor, and external SPI flash memory.

https://eu.mouser.com

 

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Renesas introduces new RX261/RX260 group of MCUs

Renesas has introduced the RX261 and RX260 microcontroller (MCU) Groups. The new 64 MHz MCUs deliver power efficiency of only 69μA/MHz during active operation and 1μA in standby mode. They also enable designers to easily implement water-resistant capacitive touch sensors and deliver robust security. This combination of performance and features position the RX261/RX260 Group MCUs for applications such as home appliances, building and factory automation, and many others including smart locks, e-bikes and mobile thermal printers.

The RX261/RX260 Group MCUs are based on Renesas’ RXv3 CPU core, enabling 355CoreMark at 64MHz. This score is 2.5 times higher than competing 64-MHz class MCUs. Compared to other 64-MHz class MCUs, the RX261/RX260 also delivers 25 percent lower active current and 87 percent lower standby current. This outstanding power efficiency minimises current consumption during intermittent operation. These low power features help customers meet strict energy regulations for home appliances and extend the operating time of battery-powered applications.

Renesas’ third-generation capacitive touch IP (CTSU2SL) delivers high noise immunity and water resistance, allowing users to implement touch sensors in kitchen appliances and outdoor equipment such as smart locks. The automatic judgement function reduces current consumption during intermittent operation by enabling touch detections even in standby state. The QE for Capacitive Touch tuning tool, design guides, and sample programs ease the implementation of touch sensors in multiple applications.

Today, many consumer and industrial systems offer wireless connectivity features such as Bluetooth and/or Wi-Fi to enable smartphone controls or to download new firmware from cloud servers. By implementing security features with the Renesas Secure IP (RSIP-E11A) and flash protection functions, users can protect their applications from unauthorised use such as data falsification and eavesdropping by attackers. Sample programs help users to implement secure boot and secure firmware update functions quickly and easily.

The RX261 Group MCUs provide a wide range of features, including a Full Speed USB function controller with a high-speed on-chip oscillator (HOCO) that eliminates the need for external crystals to generate an accurate USB clock. A CAN FD module is also included to enable fast and reliable communication. Unlike some other MCUs, the RX261/RX260 Group MCUs include 8 KB data flash enabling customers to eliminate the need for an external EEPROM.

https://www.renesas.com/RX261 

https://www.renesas.com/RX260

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