Intel introduces two x86 core architectures at Intel Architecture Day 2021

Intel has introduced two x86 core architectures – the Efficient-core and Performance-core microarchitectures.

The Efficient-core microarchitecture, previously code-named Gracemont, is designed for throughput efficiency, enabling scalable multi-threaded performance for multi-tasking. It is, says Intel, the company’s most efficient x86 microarchitecture for multi-core workloads with a workload that can increase with the number of cores.

It also delivers a wide frequency range. The microarchitecture allows Efficient-core to run at low voltage to reduce overall power consumption, while creating the power headroom to operate at higher frequencies. As a result, the microarchitecture can ramp up performance for more demanding workloads.

Efficient-core include a variety of advances to optimise workloads while conserving processing power and to improve instruction per cycle (IPC) rates. For example, it has a 5,000 entry branch target cache for more accurate branch prediction and a 64kbyte instruction cache to keep useful instructions close without expending memory subsystem power.

It also includes Intel’s first on-demand instruction length decoder that generates pre-decode information and Intel’s clustered out-of-order decoder to decode up to six instructions per cycle while maintaining energy efficiency. Other features include a wide back end with five-wide allocation and eight-wide retire, 256 entry out-of-order window and 17 execution ports.

Technology advanced include Intel Control-flow Enforcement Technology and Intel Virtualization Technology Redirection Protection. There Efficient-core microarchitecture also has the AVX ISA and new extensions to support integer artificial intelligence (AI) operations.

Intel says that the Efficient-core achieves 40 per cent more performance at the same power, compared with the Skylake CPU core, in single-thread performance. Alternatively, it can deliver the same performance while consuming 40 per cent less power. For throughput performance, four Efficient-cores offer 80 per cent more performance while still consuming less power than two Skylake cores running four threads or the same throughput performance while consuming 80 per cent less power.

The second microarchitecture to be launched Intel Architecture Day is Performance-core (previously code-named Golden Cove). This microarchitecture is the highest performing CPU core built by Intel and is designed for speed with low latency and single-threaded application performance. It has been introduced to address the fact that workloads are growing in terms of code footprint, demand more execution capabilities and have growing data sets and data bandwidth requirements. Performance-core microarchitecture is intended to provide “a significant boost in general purpose performance and better support for large code footprint applications,” said the company.

The Performance-core features a wider, deeper and smarter architecture than earlier microarchitectures with six decoders, eight-wide micro-op cache, six allocation and 12 execution ports. It also has bigger physical register files and deeper re-order buffer with 512 entry.

Other advances are improved branch prediction accuracy, reduced effective L1 latency and full write predictive bandwidth optimisations in L2.

Other features which help it to lower latency and advance single-threaded application performance are a Geomean improvement of around 19 per cent across a range of workloads over current 11th Gen Intel Core processor architecture (Cypress Cove) at ISO frequency.

There is also more parallelism and an increase in execution parallelism. For deep learning inference and training, there are Intel Advance Matrix Extension to accelerate AI. There is also dedicated hardware and new instruction set architecture to perform matrix multiplication operations “significantly faster”. The reduced latency is accompanied by increased support for large data and large code footprint applications.

http://www.Intel.com

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Chip scale atomic clock (CSAC) is designed for mission-critical military projects

Precise timing is required for advanced military platforms, ocean-bottom survey systems and remote sensing applications, says Microchip, as it introduces the SA65 chip scale atomic clock (CSAC).

The CSACs are used to ensure stable and accurate timing even when global navigation satellite systems (GNSS) time signals are unavailable. Microchip’s SA65 CSAC is environmentally rugged and has double the frequency stability over a wider area of the earlier SA.45s CSAC. It also has faster warm up at cold temperatures. The SA65 has an operating temperature range of -40 to 80 degrees C and a storage temperature range of -55 to 105 degrees C. The warm-up time of two minutes at -40 degrees C is 33 per cent faster than that of the SA.45s.

The SA65 CSAC is intended to be portable for military applications such as assured position, navigation and timing (A-PNT) and command, control, communications, computers, cyber, intelligence, surveillance and reconnaissance (C5ISR), which require precise frequencies generated by a low size, weight and power (SWaP) atomic clock.

The CSAC also has improvements such as fast warm-up to frequency after cold start, temperature stability over a wide operating range, and frequency accuracy and stability, all of which extend operation while GNSS is denied help, says Microchip.

Claimed to be the world’s lowest-power commercial atomic clock, the CSAC provides precise timing for portable and battery-powered applications requiring continuous operation and holdover in GNSS-denied environments. The SA65 is form-, fit- and function-compatible with the SA.45s, which minimises risk and redesign costs when upgrading to improve performance and environmental insensitivity.

The CSAC family of atomic clocks is supported by Developer Kit 990-00123-000, as well as associated software, a user guide and technical support.

Microchip Technology provides smart, connected and secure embedded control solutions and development tools. The company’s solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defence, communications and computing markets. It is headquartered in Chandler, Arizona, USA.

http://www.microchip.com

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PMIC complements RZ/G2L and V2L processors for AI

A power management integrated circuit (PMIC) optimised to complement Renesas’ RZ / V2L and RZ / G2L microprocessors, the RAA215300 has nine channels, a built-in charger and a real-time clock. Integrating the PMIC reduces design complexity and accelerates time-to-market, says Renesas.

The RAA215300 includes six buck regulators, three LDOs and a coin cell / supercap charger. It supports DDR4, DDR4L, DDR3 and DDR3L memory with dedicated VREF, VTT and VPP rails. It enables four-layer PCBs to reduce costs and the high level of integration also increases system reliability as fewer system components are needed on the board, said Renesas.

It has a built-in power sequencer and support for external DC/DC regulator on/off controls. It supports multiple DDR memories, multiple processors and SoCs, added Renesas. It also features spectrum spread to reduce EMI for RF applications.

Operating temperature range is -40 to +105 degrees C, suitable for industrial applications.

The RAA215300 pairs with the RZ / G2L, RZ / V2L and other Renesas devices, such as power controllers, a USB Power Delivery controller and a clock, for a scalable SMARC system on module with AI design as part of Renesas’ Winning Combinations collection of complementary analogue, power, timing devices and embedded processing to simplify the design process.

Sample shipments of the RAA215300 are available now, and mass production is scheduled to begin in Q1 2022.

https://www.renesas.com 

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Baseless power modules improve aircraft electrical system efficiency, says Microchip

Developed with the Clean Sky consortium, Microchip’s BL1, BL2 and BL3 families are qualified to stringent aerospace standards for AC/DC and DC/AC power conversion

To enable next-generation aircraft electrical systems – including electrical systems that replace today’s pneumatics and hydraulics powering everything from on-board alternators to actuators and auxiliary power units (APUs) – and reduce aircraft emissions, require new power conversion technology, explained Microchip.

It has developed the baseless power modules with Clean Sky, a joint European Commission (EC) and industry consortium, and says the BL1, BL2 and BL3 are the first aerospace-qualified baseless power modules which enable higher efficiency, lighter and more compact power conversion and motor drive systems.

The BL1, BL2 and BL3 family of baseless power modules provides greater efficiency in AC/DC and DC/AC power conversion and generation through the integration of Microchip’s silicon carbide (SiC) power semiconductor technology. They are 40 per cent lighter than other modules due to the modified substrate, reports Microchip. The design also produces an approximate 10 per cent cost savings over standard power modules that incorporate metal baseplates. Microchip’s BL1, BL2, and BL3 devices meet all mechanical and environmental compliance guidelines in RTCA DO-160G, the “Environmental Conditions and Test Procedures for Airborne Equipment,” Version G (August 2010).

The modules are available in low profile, low inductance packaging with power and signal connectors that designers can solder directly on PCBs, helping to speed development and increase reliability. According to Microchip, modules in the family have the same height which enables them to be paralleled or connected in a three-phase bridge and other topologies to achieve higher-performing power converters and inverters.

The family incorporates SiC MOSFETs and Schottky barrier diodes to maximise system efficiency. In packages delivering 100W to more than 10kW of power, the BL1, BL2, and BL3 family is available in topology options including phase leg, full bridge, asymmetric bridge, boost, buck and dual common source. The high-reliability power modules are available in voltage ranges from 600 to 1,200V in SiC MOSFETs and IGBTs to 1,600V for rectifier diodes.

Microchip’s power module technology as well as its ISO 9000- and AS9100-certified fabrication facilities provide high-quality units through flexible manufacturing alternatives.

Microchip’s baseless power modules complement its aerospace portfolio of motor drive controllers, storage ICs, FPGAs, microcontrollers, microprocessors, timing products, semiconductors and point of load (PoL) regulators for aerospace and defence applications. Microchip also provides a full portfolio of SiC technology for aerospace, automotive and industrial applications.

Microchip’s BL1, BL2 and BL3 baseless power modules are available as 75 and 145A SiC MOSFET, 50A as IGBT, and 90A as rectifier diode outputs.

http://www.microchip.com

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