PDM microphone claims to have industry’s widest dynamic range
A pulse density modulation (PDM) microphone by Invensense is claimed to have the widest dynamic range in the industry at the lowest power.
The T5818 is a 66dB signal to noise (SNR) / 135dB acoustic overload point (AOP) digital microphone. It has a dynamic range of 107dB at 590microA which allows for “excellent” acoustic performance in environments that shift from very quiet to very loud, such as far field voice pickup barge-in for smart speaker applications, explains TDK.
The T5818 microphone operates at 590 microA in high quality mode (HQM) and decreases power consumption to 215 microA in low power mode (LPM). The microphone captures high-quality audio inputs, used in artificial intelligence (AI) engines and cloud-based applications that require a PDM microphone interface. Current analogue output wide dynamic range microphones require expensive ADCs to take advantage of full acoustic capabilities but the T5818 provides this ADC conversion while maintaining excellent dynamic range with the benefits of a PDM low latency bitstream, claims TDK. This makes the T5818 suitable for a range of applications, from mobile phones to active noise control (ANC) headsets. It can be used in microphone arrays, smartphones, tablets, cameras, Bluetooth headsets, notebook PCs and security and surveillance equipment.
The T5818 is supplied in a surface mount package that measures 5.0 x 2.65 x 0.98mm.
T5818 is currently in mass production.
InvenSense is a TDK Group company, providing micro electrical mechanical systems (MEMS) sensors for consumer electronics and industrial areas with integrated motion, sound and ultrasonic products. InvenSense’s solutions combine MEMS sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesise and calibrate the output of sensors for maximum performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in mobile, wearables, smart home, industrial, automotive and IoT products. InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation in 2017. In February of 2018, Chirp Microsystems joined the InvenSense family through its acquisition by TDK. InvenSense is headquartered in San Jose, California, USA and has offices worldwide.
