Optiga Connect 5G authenticates mobile consumer devices

Infineon has extended its embedded SIM (eSIM) portfolio, adding the Optiga Connect eSIM for mobile consumer devices. It supports all GSMA standards from 3G to 5G and securely authenticates the device to the chosen subscribed carrier network of choice. It has a small imprint, making it suitable for smartphones, tablets and wearable devices (smart watches or fitness trackers).

Based on Infineon’s SLC37 security chip, the new Optiga Connect meets the GSMA’s security requirements and is tested according to Common Criteria CC EAL4+ high. The SLC37 secures sensitive keys and data against fraudulent use. The Optiga Connect eSIM complies with the latest 5G specifications from the GSMA (SIMAlliance Profile Interoperability 2.3 Spec) and the 3GPP. It supports the profiles of major mobile network providers with Remote SIM Provisioning capabilities and offers up to 1.2Mbyte of free user memory for network operator profiles, data and additional applications. The package measures just 2.9 x 2.5 x 0.4mm for the restricted PCB space of many new consumer applications.

ABI Research predicts that global shipments of eSIM enabled smartphones will reach over 225 million in 2020 and it expects a minimum of 500 million eSIM-capable smartphones to ship gloabally in 2024.

The Optiga Connect eSIM consumer chip be available from March 2020.

http://www.infineon.com

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STM32L4+ microcontrollers bring Cortex-M4 performance to smart devices

Two microcontrollers from STMicroelectronics, the STM32L4P5 and STM32L4Q5 microcontrollers bring the performance of the Arm Cortex-M4 core to cost-sensitive and power-conscious smart connected devices, says the company. Target applications include utility meters, industrial and medical sensors, fitness trackers, and smart home products.

The STM32L4+ microcontrollers have memory density down to 512kbyte flash and 320kbyte SRAM. They are available in a choice of package options: 10 x 10mm, 64-pin and 7.0 x 7.0mm, 48-pin versions designed to meet applications limited by size constraints such as wearable form factors.

They have independent power connections for circuitry such as USB and analogue peripherals, independent clock domains, and octal and quad serial peripheral interfaces (SPIs) for external memory expansion. They also feature a 5Msample/s smart ADC that can operate at full speed to minimise acquisition time, or at reduced speed with lower current.

The STM32L4+ microcontrollers exploit ST’s low-power microcontroller technologies and feature seven main low-power modes, enabling designers to creatively manage power consumption and wake-up times to minimise energy demand. The microcontrollers also support FlexPowerControl, which ensures energy-efficient handling of processing loads, as well as batch acquisition mode for energy-efficient data capture while the CPU is stopped.

To preserve system reliability and safety in industrial and medical applications, the STM32L4+ microcontrollers have flash error-correcting code (ECC) support and hardware parity checking for SRAM.

Cyber-protection features include a true random number generator and IP protection through limited access to code stored in internal memory. STM32L4Q5 devices feature additional cryptographic accelerators that support AES, RSA, DH and ECC acceleration.

The STM32 development ecosystem now includes the Nucleo-L4P5ZG Nucleo-144 board and STM32L4P5G-DK Discovery kit, each containing an STM32L4P5 microcontroller.

In the STM32Cube ecosystem, the STM32L4P5 and STM32L4Q5 are supported by the STM32CubeL4 microcontroller package, which contains hardware abstraction layer and low-layer (HAL/LL) peripheral drivers, middleware components and examples projects, and by the STM32CubeMX initialisation-code generator and configurator, which has a power consumption calculator.

ST reports EEMBC benchmark scores of 409 CoreMark and 285 ULPMark-CP for performance and energy efficiency.

Samples are available immediately and full production is ramping up, says ST.

https://www.st.com

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Flat connectors withstand higher operating temperatures

Flat flexible cable/flat printed circuit (FFC/FPC) connectors from Hirose Electric can withstand higher operating temperatures than standard FFC/FPC connectors. The FH67 series withstand temperatures ranging from -55 to +125 degrees C. This heat resistance capability enables the connector to be used in harsh automotive environments.

The FH67 0.5mm pitch connectors are characterised by a single action lock and a vertical connection design. 

The robust FFC/FPC connectors’ one-action lock allows an FFC/FPC to be inserted into the connector without opening the actuator. This can be done with one hand or by automated machinery, says Hirose, saving valuable assembly time and reducing the rates of mating failure. Removing the connector is also easy and can be done by one hand or by robot.

The FH67 series is reliable with an independent two-point spring contact design, which includes a wiping element that reduces contact failure due to dust intrusion.

The ground contacts allow a shielded FFC to be used which prevents EMI. The FH67 series has a height of just 5.2mm, making it suitable for space-constrained design for use in automotive equipment, smart home devices, medical equipment and other portable devices.

Hirose Electric is a Japanese manufacturer of high-quality connectors. It was established in 1937 and uses advanced engineering services, customer service and worldwide manufacturing capabilities to provide technically advanced connector products for many industries including industrial, automotive, consumer, testing, broadcasting, and telecommunications.

Hirose established European offices over 30 years ago to compete internationally in Europe. In 2010, the European offices were merged together to form Hirose Electric Europe. The European headquarters is based in Amsterdam, The Netherlands. Other European branches are located in Germany, UK, France and Italy.

http://www.hirose.com/eu

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Skyworks to support Wi-Fi 6E

Working with the Wi-Fi Alliance, Skyworks Solutions is developing future-proof connectivity and supporting the Alliance’s next-generation wireless technologies.

Skyworks addresses all existing Wi-Fi standards and is working within the Wi-Fi Alliance to develop its Wi-Fi 6E products that operate in the 5.925 to 7.125GHz frequency range.

Demand for high data applications such as streaming media/TV/audio, social media and smart home devices, has led to calls to open up additional frequency bands to complement the existing 2.4 and 5GHz bands. This new spectrum is expected to be made available by regulators around the world and it represents an opportunity to deliver the benefits of Wi-Fi 6 coupled with increased bandwidth available in the new 6GHz band.

“The 6GHz band addresses the growing need for Wi-Fi spectrum capacity to ensure users continue to experience reliable and seamless connectivity,” said Kevin Robinson, senior vice president of Marketing, at the Wi-Fi Alliance. “We are glad to see Wi-Fi Alliance members working closely in Wi-Fi Alliance to ensure that new products meet high standards for interoperability and security.”

Dave Stasey, vice president and general manager of diversified analogue solutions for Skyworks, added: “We look forward to . . .  providing the highest performance solutions for our OEM customers which deliver maximum Wi-Fi range and speeds.”

Skyworks’ powerful modules facilitate Wi-Fi functionality with best-in-class linearity and performance in the smallest footprint available, explains the company. By incorporating the required functionality to deliver maximum performance, products reduce time to market in this sensitive arena. They contain a logarithmic power detector to support wide dynamic ranges, low power consumption and improved thermal management.

Skyworks Solutions specialises in analogue semiconductors for a wireless networking revolution. Its semiconductors connect people, places and things within the aerospace, automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets.

Skyworks has engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America.

http://www.skyworksinc.com

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