Renesas extends Bluetooth 5.0 security to RA 32-bit microcontrollers

Bluetooth 5.0 connectivity has been extended to the RA family of 32-bit microcontrollers by Renesas Electronics, with the introduction of the RA4W1, with an Arm Cortex-M core.

In addition to the 8MHz, 32-bit Arm Cortex-M4 core, it has an integrated Bluetooth 5.0 low energy radio and is delivered in a 56-pin QFN package. The RA4W1 microcontroller and Flexible Software Package (FSP) enables engineers to immediately begin development with Arm ecosystem software and hardware building blocks, says Renesas. FSP features FreeRTOS and middleware for device-to-cloud development. Renesas also points out that options can be replaced and expanded with any other RTOS or middleware.

The RA4W1 microcontroller allows embedded designers to develop safe and secure IoT endpoint devices for industry 4.0, building automation, metering, healthcare, consumer wearable and home appliance applications. It is intended for engineers developing IoT edge devices for wireless sensor networks, IoT hubs, an add-on to gateways and an aggregator to IoT cloud applications.

Sakae Ito, vice president of IoT Platform Business Division at Renesas, said that customers can use the on-chip features, such as Renesas’ Secure Crypto Engine. This feature supports customers with symmetric encryption and decryption, hash functions, true random number generation (TRNG), and advanced key handling with key generation and microcontroller-unique key wrapping for strong key management for IoT security. It also has what is claimed to be best-in-class output power consumption and sensitivity for secure, longer range applications.

The Arm Cortex M4 core and Bluetooth 5.0 core are housed in a 7.0 x 7.0mm 56-pin QFN. The single-chip RA4W1 48MHz microcontroller features 512 kbyte flash memory, 96 kbyte SRAM and connectivity such as USB, CAN and Renesas’ HMI capacitive touch technology.

Bluetooth 5.0 support includes 2 Mbits per second data throughput, all advertising extension functions with maximum advertising length (1,650 byte), periodic advertisements and channel selection algorithm #2 for applications requiring large amounts of traffic. The RA4W1 also offers low peak power consumption at 3.3mA during receiving and 4.5mA (at 0dBm) while transmitting. Renesas claims its sensitivity of -105dBm in 125 kbits per second mode is an industry best and is achieved without additional loss from external components.

Renesas provides several API functions that conform to all standard profiles, including a heart rate profile (HRP), an environment sensing profile (ESP) and an automation I/O profile (AIOP), to allow users to quickly start and speed up prototype development and evaluation.

Renesas’ Smart Configurator GUI generates Bluetooth code and microcontroller peripheral function driver code as well as pin settings for the e2 Studio integrated development environment (IDE). The Renesas QE tool for Bluetooth LE generates programs for custom profiles and embeds them in user application programs to support application program development. The Bluetooth Trial Tool Suite GUI allows users to perform initial wireless characteristics evaluations and Bluetooth functional verification. Users can typically have the RA4W1 evaluation board up and running with the downloadable smartphone applications demo in less than 30 minutes, says Renesas.

Integrating a high-precision, low-speed on-chip oscillator, an RF oscillator adjustment circuit and on-chip matching circuit for easy antenna connection reduces both bills of materials costs and circuit board area.

http://www.renesas.com

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PMICs halve current to boost efficiency, says Silicon Labs

Energy-friendly power management ICs (PMICs) from Silicon Labs, the EFP01 family are companion chips for EFR32 wireless devices and EFM32 microcontrollers. They enable developers to choose the optimal battery type and chemistries for their applications. Target applications include IoT sensors, asset tags, smart meters, home and building automation, security, and health and wellness products. The PMICs also enable developers to control a product’s power supply over multiple output rails and voltages.

Developers often use PMICs to meet the low-power requirements of IoT designs, but choosing the right one can be challenging. The EFP01 PMICs “provide a turnkey power management companion solution for our wireless SoC and MCU families, combined with Simplicity Studio tools, reference designs, sample applications and ‘PMIC-aware’ wireless stacks for easy development,” said Matt Saunders, vice president of IoT marketing and applications at Silicon Labs.

“If you want the easiest to configure, lowest power wireless solution, Silicon Labs’ EFP01 PMIC with Wireless Gecko is the best choice,” he continued. “The EFP01 is optimised for our IoT connectivity platforms, eliminating the need to incorporate multiple vendor reference designs into a schematic or layout.”

EFP01 PMICs include low-voltage DC/DC converters and regulators and a flexible mechanism to manage the power rails in a system design.

The EFP01 PMIC family features include flexible I/O voltage, a wide input voltage range (0.8 to 5.5V) to support an array of batteries. They also have wide output voltages to support a variety of peripherals, microcontrollers and radios.

The PMICs enable buck and boost voltage conversion as well as combined boost and buck (boost bootstrap) supporting low-voltage, high-current rails for IoT products requiring coin cell batteries and higher transmit power (up to +20 dBm).

They also feature multiple output power rails which allows an IoT product to be powered by one low-cost PMIC. This uses less board real estate and simplifies software/hardware design, says Silicon Labs.

The EFP01 offers quiescent current as low as 150 nA to reduce sleep current and enhance battery life.  It also supports coulomb counting which offers vital information for battery life estimation and preventive maintenance.

Samples and production quantities of EFP01 PMICs in a 3.0 x 3.0mm QFN20 package are available now. Silicon Labs also provides three development boards – the SLWRB4179B radio board and two PMIC evaluation boards. Simplicity Studio offers energy profiler and network analyser tools, wireless stacks and reference designs. It is available free of charge.

http://www.silabs.com

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Digi-Key adds biometric systems with Fingerprint Cards signing

Digi-Key Electronics has signed a global distribution partnership with Fingerprint Cards to offer the Swedish company’s standalone, compact biometric fingerprint sensors.

Fingerprint Cards’ products are found in hundreds of millions of devices and applications, says the company, and are used billions of times every day, for identification and authentication of access or payment systems.

“We are excited about the new partnership with Fingerprint Cards,” said David Stein, vice president, global supplier management at Digi-Key. “Biometric authentication is growing as it continues to be implemented into new applications and devices. Digi-Key now offers customers an easy path to develop secure devices with integrated capacitive fingerprint sensor technology.”

Michel Roig, senior vice president, payments and access at Fingerprints. “Digi-Key will help us reach out and find new potential markets and application areas.”

Fingerprint Cards is a biometrics company, based in Sweden.

Digi-Key Electronics is headquartered in Thief River Falls, Minnesota, USA. It is an authorised global, full-service distributor of electronic components. It offers more than 10.2 million components, with over 2.2 million in stock and available for immediate shipment, from over 1,200 quality name-brand manufacturers.

Its Marketplace Product provides a singular shopping experience for all things related to technology innovation — IoT, industrial automation, test and measurement and more.

http://www.digikey.com

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Sensor hub DSP architecture makes sense of surroundings

Claimed to be the industry’s first high performance sensor hub DSP architecture, SensPro is configurable for parallel processing floating point and integer data types, as well as deep learning training and inferencing.

Ceva has designed it to handle the sensor processing and sensor fusion workloads for contextually-aware devices.

It addresses the need for specialised processors to efficiently handle the proliferation of different types of sensors that are required in smartphones, robotics, automotive, AR/VR headsets, voice assistants, smart home devices and for industrial and medical applications. These camera, radar, lidar, time of flight (ToF) sensors, microphones and inertial measurement units (IMUs) generate data types and bit-rates derived from imaging, sound, RF and motion, which can be used to create a full 3D contextually-aware device, says CEVA.

The SensPro architecture is built from the ground up to maximise performance per Watt for multi-sensor processing use cases. It combines high performance single and half precision floating-point maths required for high dynamic range signal processing, point cloud creation and deep neural network (DNN) training. It also has 8-bit and 16-bit parallel processing capacity for voice, imaging, DNN inference processing and simultaneous localisation and mapping (SLAM). SensPro incorporates the Ceva-BX scalar DSP, which offers a seamless migration path from single sensory system designs to multi-sensor, contextual-aware designs.

Dimitrios Damianos, technology and market analyst of the sensing division at Yole Développement (Yole) commented: “The proliferation of sensors in intelligent systems continues to increase, providing more precise modelling of the environment and context. Sensors are becoming smarter, and the goal is not to get more and more data from them, but higher quality of data especially in cases of environment/surround perception. . . .  where many sensors . . . must work together to make sense of their surroundings”.

Yohann Tschudi, technology & market analyst, computing and software, at Yole continued: “The challenge is to process and fuse different types of data from different types of sensors. Using a mix of scalar and vector processing, floating and fixed point math coupled with an advanced micro-architecture, SensPro offers system and SoC designers a unified processor architecture to address the needs of any contextually-aware multi-sensor device.”

SensPro uses a configurable eight-way VLIW architecture, allowing it to be easily tuned to address a range of applications. Its micro-architecture combines scalar and vector processing units and incorporates an advanced, deep pipeline enabling operating speeds of 1.6GHz at a 7nm process node.

A Ceva-BX2 scalar processor for control code execution has a 4.3 CoreMark/MHz score. It adopts a wide SIMD scalable processor architecture for parallel processing and is configurable for up to 1024 8×8 MACs, 256 16×16 MACs, dedicated 8×2 binary neural networks support, as well as 64 single precision and 128 half precision floating point MACs. This allows it to deliver 3TOPS for 8×8 networks inferencing, 20TOPS for binary neural networks inferencing, and 400GFLOPS for floating point arithmetic. Additionally, a memory architecture provides a bandwidth of 400Gbyte per second, four-way instruction cache, two-way vector data cache, DMA, and queue and buffer managers for offloading the DSP from data transactions.

Ceva also offers software and development tools, including an LLVM C/C++ compiler, Eclipse based integrated development environment (IDE), OpenVX API, software libraries for OpenCL, Ceva deep neural network (CDNN) graph compiler including the CDNN-Invite API for inclusion of custom AI engines, Ceva-CV imaging functions, Ceva-SLAM software development kit and vision libraries, ClearVox noise reduction, WhisPro speech recognition, MotionEngine sensor fusion, and the SenslinQ software framework.

Initially, SensPro DSPs will be available in three configurations:  SP250 (single vector unit with 256 8×8 MACs targeting imaging, vision, and sound centric applications), SP500F (single vector unit with 512 8×8 MACs and 64 single precision floating point MACs targeting SLAM applications) and SP1000 (dual vector units with 1024 8×8 MACs and binary networks support targeting AI applications).

The SensPro architecture and cores will be made available for general licensing from Q3 2020.

https://www.ceva-dsp.com

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