Dual-core module supports Bluetooth 5.1’s angle of arrival

An RF module with dual-core processor uses Bluetooth technology in what is claimed to be the smallest package on the market. Insight SiP says the ISP2053-AX RF module supports sophisticated applications and removes the need for an additional host processor.

For advanced Bluetooth applications, it has a dual-core Arm processor, Bluetooth Low Energy 5.2 Long Range connectivity, the capability to support Bluetooth Low Energy Audio, and security features via Arm Trustzone. With extended temperature capability up to 105 degrees C, it can support every kind of advanced Bluetooth based solution including angle of arrival and low latency/streaming, says Insight SiP.

The standard 8.0 x 8.0 x 1.0mm package has an integrated RF matching and integrated antenna. There is also 32MHz and 32kHz crystals and DC/DC support for each processor, meaning it is a fully functioning Bluetooth node only requiring a power supply to operate.

This module is based on the nRF5340 Nordic Semiconductor SoC. The next generation architecture has a 2.4GHz transceiver, a 64MHz M33 network core with 256kbyte flash and 64kbyte RAM and a 128MHz M33 application core with 1Mbyte flash and 512kbyte RAM. The two cores can be operated independently to optimise performance for power consumption, throughput, and real time response.

Peripheral connections available to both cores include USB, QSPI, SPI and UART. As well as supporting Bluetooth Low Energy, the module can run Zigbee, Thread and other 802.15.4 based protocols, concurrently with Bluetooth Low Energy. Protocols stacks and applications run on the real time Zephyr operating system which provides a suite of drivers and services.

For security in the IoT, the ISP2053 has Arm Trustzone capability. This allows secure key storage, advanced encryption and root of trust verification, enabling devices to be securely authenticated, updated and data exchange protected end to end.

The ISP2053 RF module is designed to run on a coin cell battery if required. According to Insight SiP, the module’s low power consumption and advanced power management system enable the battery to “last up to several years”.

Initial samples are available now. Full production of the modules will start in 2022. Certification is pending.

Development kits together with sample software will be made available.

http://www.insightsip.com

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TDK offers miniaturised, highly sensitive MEMS pressure sensor element

Designed to measure a range of 0 to 100 mbar, TDK Corporation’s C35 type pressure sensor element combines high sensitivity with low dimensions of 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

The pressure sensor element with ordering code B58601E35 works according to the piezoresistive principle via a Wheatstone bridge and is certified for an operating voltage of up to 10 V.

Offering a high sensitivity of 110 mV/V/bar, C35 is suitable for applications with high demands of sensitivity, accuracy and long-term stability of 0.1% FSON.

Furthermore, C35 is designed for a wide temperature range from -40 degrees C to +150 degrees C and is suitable for pressure measurements of non-aggressive gases and liquids. The main uses are in applications that require high reliability and extremely precise pressure measurement, such as medical engineering and the industrial and automotive sectors.

TDK Corporation is a leader in electronic solutions for the smart society based in Tokyo, Japan. It was established in 1935 to market ferrite, a key material in electronic and magnetic products.

The company’s portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The range of products also includes sensors and sensor systems such as temperature and pressure, magnetic and MEMS sensors.

In addition, TDK provides power supplies and energy devices and magnetic heads. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda.

TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.

In fiscal 2021, TDK posted total sales of $13.3 billion and employed about 129,000 people worldwide.

For more information go to

https://www.tdk-electronics.tdk.com/en/pressure_sensor_elements

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Intel expands neuromorphic research chip – introducing Loihi 2

Now with one million neurons, the second generation research chip from Intel, Loihi 2, uses a pre-production Intel 4 process. There is also now a software framework for developing neuro-inspired applications.

The second-generation chip improves the speed, programmability, and capacity of neuromorphic processing, comments Mike Davies, director of Intel’s Neuromorphic Computing Lab. Loihi 2 broaden the processing technology’s use in power and latency constrained intelligent computing applications. “We are open sourcing Lava to address the need for software convergence, benchmarking, and cross-platform collaboration in the field, and to accelerate our progress toward commercial viability,” adds Davies.

Neuromorphic computing draws insights from neuroscience to create chips that function more like the biological brain. Researchers hope that it will deliver orders of magnitude improvements in energy efficiency, speed of computation and efficiency of learning across edge applications including vision, voice and gesture recognition to search retrieval, robotics, and constrained optimisation problems. To this end, Intel and partners have demonstrated robotic arms, neuromorphic skins and olfactory sensing projects.

Advances in Loihi 2 allow the architecture to support new classes of neuro-inspired algorithms and applications and provide processing that is 10 times faster than its predecessor. It also exhibits up to 15 times greater resource density (up to one million neurons per chip), and improved energy efficiency.

Fabricated with a pre-production version of the Intel 4 process, the use of extreme ultraviolet (EUV) lithography has simplified the layout design rules compared to past process technologies for rapid development of Loihi 2, says Intel.

The Lava software is an open, modular, and extensible framework, for researchers and application developers to build on each other’s progress and converge on a common set of tools, methods, and libraries. Lava runs seamlessly on heterogeneous architectures across conventional and neuromorphic processors, and is interoperable with a variety of AI, neuromorphic and robotics frameworks.

Developers can begin building neuromorphic applications without access to specialized neuromorphic hardware and can contribute to the Lava code base, including porting it to run on other platforms.

Loihi 2’s greater programmability will allow a wider class of difficult optimisation problems to be supported, including real-time optimisation, planning, and decision-making from edge to data centre systems.

Loihi 2 also improves support for advanced learning methods, including variations of backpropagation, the algorithm of deep learning.

Fully programmable neuron models and generalised spike messaging in Loihi 2 suggest reductions of over 60 times fewer ops per inference compared to standard deep networks running on the original Loihi without loss in accuracy. It incorporates faster, more flexible, and more standard I/O interfaces, including Ethernet interfaces, glueless integration with a wider range of event-based vision sensors, and larger meshed networks of Loihi 2 chips.

http://www.intel.com

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Wireless charging transmitter coil driver is in QFN3x3 package

The first in a family of coil drivers from Alpha and Omega Semiconductor (AOS) that are supplied in a thermally enhanced QFN3x3 package are suitable for wireless charging transmitter circuits in a variety of space constrained applications.

The AOZ32033AQI is an integrated half-bridge gate driver capable of driving high-side and low-side N-channel MOSFETs. The coil driver offers 30V, 11 mOhm in a QFN3x3 package. It features slew rate control (SRC) to adjust sink / source current and provide a trade-off between efficiency and EMI optimisation in the design of wireless charging transmitter (TX) circuits, explains AOS.

The coil driver is intended for use in wireless charging TX circuits used in cordless power tools, vacuum cleaners, drones, and other consumers’ electronic equipment which use full-bridge topology with a resonant tank circuit for power conversion efficiency.

The integrated package offers a part count reduction of up to 40 per cent compared to traditional approaches, says AOS. The AOZ32033AQI enables PCB space savings and higher performance in wireless transmitter circuits with high wattage of up to 30W. To ensure the design is robust, the coil driver has multiple protection functions such as high side and low side under-voltage lockout and over-temperature protection. The coil driver can be used for a wide range of input voltages from 4.0 to 28V.

“Wireless charging is offered at increasingly higher power levels as the benefits of eliminating physical connectors and cables are being realised by more end applications,” says said Colin Huang, power IC marketing manager at AOS. This, the first member announced of the company’s coil driver product family, will provide an efficient, power-dense, and cost-effective solution for wireless charging TX circuits, he continues. “The integrated approach offers protection features not possible by using a discrete approach while reducing engineering design cycles and complexities,” he says.

The AOZ32033AQI is immediately available in production quantities with a lead-time of 12 weeks.

Alpha and Omega Semiconductor (AOS) is a designer, developer, and global supplier of a broad range of power semiconductors, including a wide portfolio of  power MOSFET, IGBT, IPM, TVS, HVIC, SiC/GaN, power IC, and digital power products. AOS has developed extensive IP and technical knowledge to introduce innovative products to address the increasingly complex power requirements of advanced electronics.

AOS’s portfolio of products targets high-volume applications, including portable computers, flat-panel TVs, LED lighting, smartphones, battery packs, consumer and industrial motor controls, automotive electronics, and power supplies for TVs, computers, servers, and telecommunications equipment.

http://www.aosmd.com

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