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Force rebalance MEMS accelerometer reduces weight in navigation systems

Fri, Oct 15, 2021

Designed for challenging environments, the Tronics AXO315 force-rebalance digital MEMS accelerometer withstands severe temperature and vibration conditions experience in industrial, land, rail, navy, oil and gas and construction applications, says TDK.

The one-axis, closed looped digital MEMS sensor has a ±14g range. The in-plane linear accelerometer achieves a one-year composite repeatability of 1mg, and a 600ppm composite scale factor repeatability over temperatures ranging from -55 to +105 degrees C and under 4g vibrations.

In addition to vibration rejection, it exhibits superior Allan variance characteristics, says TDK, with a basis instability of 4.0 microg, a velocity random walk of 0.006m per second per sq root h and a very low noise of 15 microg/ sq root Hz, for high resolution and low error.

Its performance is equivalent to the incumbent analogue quartz accelerometers and mechanical inclinometers, but at a fraction of their size, weight, and price, says TDK, resulting in a reduction in size, weight and cost of materials in servo inclinometers and dynamic inclinometers in industrial motion control units, as well as inertial measurement units (IMUs) and inertial navigation systems (INS) for GNSS-aided positioning, navigation of manned and unmanned ground vehicles and trains.

The AXO315 features a force-rebalance architecture, a 24-bit digital SPI in an SMD package. It is also claimed to outperform all commercially available MEMS sensors components and offers easier integration compared to analogue sensors.

It is supplied in lightweight 1.4g hermetic SMD J-lead ceramic package (12 x 12 x 5.0mm), enabling low-cost assembly and reliability on PCB, even in fast-changing temperature conditions.

The sensor can be evaluated with an Arduino-based evaluation kit that is specifically designed to provide developers with improved testing functionalities such as output reading and recording, recalibration and digital self-tests.

Both sensor and evaluation kit are available from Digi-Key, Mouser and Farnell and its affiliates Newark and Element 14.

https://www.tronics.tdk.com

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Renesas bases RA2E2 microcontroller family on Arm Cortex-M23 core

Thu, Oct 14, 2021

For small and energy-sensitive IoT, wearable, medical, industrial automation, consumer and home appliance applications, Renesas offers the RA2E2 microcontroller group. It is based on the Arm Coretex-M23 core and is the latest addition to the 32-bit RA family.

The family of microcontrollers is claimed to offers a combination of low power consumption, a set of peripherals targeted at IoT endpoint applications and space-saving packaging options including a tiny 16-pin WLCSP (wafer level chip scale package) measuring only 1.87 x 1.84mm. The 48MHz RA2E2 family is claimed to offer the industry’s lowest operating power in their class, consuming only 81microA/MHz in active mode with software standby current of only 200nA with fast wake up. They also support a wide temperature range of Ta = -40/+125 degrees C for harsh IoT operating environments. The RA2E2 microcontrollers support an I3C bus interface and integrate cost-saving peripheral functions, including an on-chip oscillator with precision of +/- one per cent, power on reset, low voltage detector, EEPROM and a temperature sensor.

The RA2E2 Group includes nine devices, spanning from 16- to 24-pin packages, and from 16 to 64kbyte of flash memory and 8kbyte of SRAM. The devices also include 2kbyte of data flash memory, which is atypical in low-pin count devices, says Renesas. They are also claimed to be the only microcontrollers in their class to offer an I3C bus interface, delivering high-speed communications of 4.6Mbits per second while significantly reducing power consumption. Security features include a cryptography accelerator (AES256/128), a true random number generator (TRNG) and memory protection units.

The RA2E2 group is available today. Renesas is also offering the EK-RA2E2 evaluation kit.

The Renesas RA family includes over 160 parts ranging from 48 to 200MHz. They have a wide range of communications and security options, including Arm TrustZone technology. All RA devices are supported by the Renesas Flexible Software Program (FSP) that includes drivers and middleware to ease the implementation of communications and security. The FSP’s graphical user interface (GUI) simplifies and accelerates the development process, says Renesas. It enables flexible use of legacy code as well as easy compatibility and scalability with other RA devices. Designers using FSP also have access to the Arm ecosystem and tools as well as Renesas’ partner network.

http://www.renesas.com

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Dual-core module supports Bluetooth 5.1’s angle of arrival

Wed, Oct 13, 2021

An RF module with dual-core processor uses Bluetooth technology in what is claimed to be the smallest package on the market. Insight SiP says the ISP2053-AX RF module supports sophisticated applications and removes the need for an additional host processor.

For advanced Bluetooth applications, it has a dual-core Arm processor, Bluetooth Low Energy 5.2 Long Range connectivity, the capability to support Bluetooth Low Energy Audio, and security features via Arm Trustzone. With extended temperature capability up to 105 degrees C, it can support every kind of advanced Bluetooth based solution including angle of arrival and low latency/streaming, says Insight SiP.

The standard 8.0 x 8.0 x 1.0mm package has an integrated RF matching and integrated antenna. There is also 32MHz and 32kHz crystals and DC/DC support for each processor, meaning it is a fully functioning Bluetooth node only requiring a power supply to operate.

This module is based on the nRF5340 Nordic Semiconductor SoC. The next generation architecture has a 2.4GHz transceiver, a 64MHz M33 network core with 256kbyte flash and 64kbyte RAM and a 128MHz M33 application core with 1Mbyte flash and 512kbyte RAM. The two cores can be operated independently to optimise performance for power consumption, throughput, and real time response.

Peripheral connections available to both cores include USB, QSPI, SPI and UART. As well as supporting Bluetooth Low Energy, the module can run Zigbee, Thread and other 802.15.4 based protocols, concurrently with Bluetooth Low Energy. Protocols stacks and applications run on the real time Zephyr operating system which provides a suite of drivers and services.

For security in the IoT, the ISP2053 has Arm Trustzone capability. This allows secure key storage, advanced encryption and root of trust verification, enabling devices to be securely authenticated, updated and data exchange protected end to end.

The ISP2053 RF module is designed to run on a coin cell battery if required. According to Insight SiP, the module’s low power consumption and advanced power management system enable the battery to “last up to several years”.

Initial samples are available now. Full production of the modules will start in 2022. Certification is pending.

Development kits together with sample software will be made available.

http://www.insightsip.com

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TDK offers miniaturised, highly sensitive MEMS pressure sensor element

Fri, Oct 08, 2021

Designed to measure a range of 0 to 100 mbar, TDK Corporation’s C35 type pressure sensor element combines high sensitivity with low dimensions of 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

The pressure sensor element with ordering code B58601E35 works according to the piezoresistive principle via a Wheatstone bridge and is certified for an operating voltage of up to 10 V.

Offering a high sensitivity of 110 mV/V/bar, C35 is suitable for applications with high demands of sensitivity, accuracy and long-term stability of 0.1% FSON.

Furthermore, C35 is designed for a wide temperature range from -40 degrees C to +150 degrees C and is suitable for pressure measurements of non-aggressive gases and liquids. The main uses are in applications that require high reliability and extremely precise pressure measurement, such as medical engineering and the industrial and automotive sectors.

TDK Corporation is a leader in electronic solutions for the smart society based in Tokyo, Japan. It was established in 1935 to market ferrite, a key material in electronic and magnetic products.

The company’s portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The range of products also includes sensors and sensor systems such as temperature and pressure, magnetic and MEMS sensors.

In addition, TDK provides power supplies and energy devices and magnetic heads. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda.

TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.

In fiscal 2021, TDK posted total sales of $13.3 billion and employed about 129,000 people worldwide.

For more information go to

https://www.tdk-electronics.tdk.com/en/pressure_sensor_elements

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Force rebalance MEMS accelerometer reduces weight in navigation systems

Renesas bases RA2E2 microcontroller family on Arm Cortex-M23 core

Dual-core module supports Bluetooth 5.1’s angle of arrival

TDK offers miniaturised, highly sensitive MEMS pressure sensor element

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