Renesas’ SmartBond DA1470x SoCs are integrated for wireless connectivity

Renesas Electronics has announced the SmartBond DA1470x family of Bluetooth low energy (LE) integrated SoCs for wireless connectivity. 

Renesas claimed the DA1470x family to be the only device in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a graphics processing unit (GPU) and Bluetooth LE connectivity all into a single chip. 

This combined functionality provides smart IoT devices with advanced sensor and graphical capabilities and seamless, low power, always-on audio processing. The SoCs are suitable for wearables, such as smart watches and fitness trackers, glucose monitor readers and other consumer medical and healthcare devices, home appliances with displays, industrial automation and security systems, and Bluetooth consoles such as e-bikes and gaming equipment.

“The DA1470x family … enables developers to push the boundaries of connected consumer and industrial applications and future-proof their IoT products to fit the needs of multiple applications, while optimising their bill of materials,” commented Sean McGrath, vice president of the connectivity and audio business division in Renesas’ IoT, Industrial and Infrastructure business unit.

The high level of integration results in “significant cost savings” on the bill of materials (BoM), enabling cost-effective system solutions, according to the company. It also reduces component count on the PCB, enabling smaller form factor designs and freeing up space for additional components or larger batteries. With fewer components on the PCB, the reliability of the system improves, it claimed, delivering a further reduction in the total cost of goods sold (COGS) of the end product. 

The wireless SoCs feature a multi core system – with an Arm Cortex-M33 processor as the main application core and Cortex -M0+ as the sensor node controller.

An integrated 2D GPU and display controller supports DPI, JDI parallel, DBI and single  / dual / quad serial peripheral interfaces (SPIs) and there is a configurable Mac supporting Bluetooth LE 5.2 and proprietary 2.4GHz protocols. 

An integrated 720mA JEITA-compliant USB charger supports rechargeable Li-ion / Li-Po batteries, while an integrated low quiescent current SIMO DC/DC converter of the PMU supplies internal system and external components.

Low power hardware VAD enables seamless and always-on audio processing. 

The DA1470x family consists of four new devices, all of which are in mass production and available now. 

The DA14706 has already been used in the Xiaomi Mi band 7 wearable activity tracker with a 1.62-inch, 192×490 Amoled display, 120 sports modes and a 15-day battery life for typical use.

The DA1470x family will be demonstrated at Embedded World (21-23 June) in Nuremberg, Germany, at Booth Hall 1-234.

A provider of microcontrollers, Renesas combines its expertise in embedded processing, analogue, power and connectivity to deliver complete semiconductor solutions. These combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications.

http://www.renesas.com 

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Integrated listener for NFC wireless charging cuts board footprint by more than half

Panthronics has released early samples of what it claimed to be the industry’s first fully integrated NFC wireless charging listener device, the PTX30W.

The single chip PTX30W integrates an efficient rectifier, NFC tag, battery charger and power management as well as protocol handling. The NFC tag supports bidirectional data communication in NFC Type A mode. This enables the transfer of data between the charging cradle and the device under charge, such as the battery’s state of charge or fault indicators, as well as enabling firmware upgrades of both devices.

The PTX30W will work in tandem with an NFC poller such as the Panthronics PTX130W in a charging cradle. It harvests power wirelessly without the need for a microcontroller in the listener device. 

It replaces four discrete components with a single chip and occupies less than half the board footprint, to save space  in products such as medical sensors, fitness trackers, smart watches, earbuds, hearing aids, smart glasses, smart rings and styluses, said Panthronics. 

The PTX30W runs an NFC forum-derived wireless charging protocol that supports power negotiation. This means that the PTX30W will simplify product development, said the company, as it can operate in standalone wireless charging mode with no need for an external microcontroller to run NFC wireless charging operations. 

When paired with the Panthronics PTX130W, the NFC poller with the industry’s highest power output, the PTX30W can harvest up to 1W of power for fast charging of lithium-ion batteries, the company claimed. 

Mark Dickson, chief marketing officer of Panthronics, said: “NFC wireless charging … operates via a small antenna and supports wireless communication as well as power transfer. Now with the development of the integrated PTX30W, Panthronics is offering device manufacturers a roadmap to even more space savings as well as a simpler system design for faster time-to-market.”

The PTX30W is sampling now to alpha customers. Customer samples will be generally available on the full release of the product later in 2022. Panthronics is presenting the PTX30W prototype demonstration kit at Embedded World (21-23 June) in Nuremberg, Germany, in Hall 1-139.

Founded in 2014, Panthronics is a semiconductor product company headquartered in Graz, Austria. It develops differentiated wireless solutions from the ground up for security and power applications. 

http://www.panthronics.com 

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ToF sensors advances use less energy or double range

Metasurface lens technology is introduced by STMicroelectronics in its second generation, FlightSense multi-zone direct time of flight (ToF) sensor. The VL53L8 uses less energy and can range twice as far as existing products, said the company. 

The FlightSense ToF ranging sensor for smartphone camera management and augmented reality / virtual reality  (AR / VR) offers up to four metres in range in all zones indoors, while reducing the power consumption by half compared to the previous-generation device, operating in common conditions. 

The ToF sensor’s metasurface lens technology and power-efficient architecture reduces battery loading, extends camera autofocus ranging and enhances scene-understanding features, explained Eric Aussedat, executive vice president and general manager of the imaging sub-group within ST’s Analog, MEMS and Sensors group.

What is claimed to be the world’s first optical metasurface technology was developed in partnership with Metalenz. It enables optical systems to collect more light, provide multiple functions in a single layer and deliver new forms of sensing in smartphones and other devices, in the form factor of a single, compact package, added ST.

This second-generation ranging sensor incorporates an efficient optically diffractive metasurface lens technology, manufactured at the company’s 300mm fab in Crolles, France. The VCSEL driver is three times more capable than the previous generation with an efficient VCSEL, enabling the VL53L8 to deliver twice the ranging performance of earlier VL53L5 or reduce power consumption by 50 per cent, when operating in comparable conditions. It delivers this performance while maintaining the same field of view and discrete output-ranging zones (4×4 at 60 frames per second or 8×8 at 15 frames per second).

The module embeds a high output 940nm VCSEL light source, an SoC sensor with an embedded VCSEL driver, the receiving array of SPADs (single photon avalanche diodes) and a low power, 32-bit microcontroller core. 

The VL53L8 adopts a metasurface lens technology in both the transmit and receive apertures and delivers 16 or 64 discrete ranging zones with stable and accurate ranging, said ST.

The sensor is housed in a single reflowable component that offers 1.2V and 1.8V I/O compatibility for ease of system integration. It is also claimed to significantly reduce the host processor loading over the demands of the first-generation sensor.

Like all other FlightSense ToF proximity sensors, the VL53L8 retains an IEC 60825-1 Class 1 certification and is fully eye-safe for consumer products with an advanced lens detach detection system. 

The VL53L8 can be used in smartphones and tablets in both user-facing, like object tracking and gesture recognition, and world-facing applications, such as laser-autofocus, camera selection, touch-to-focus, and flash dimming. It is also suitable for accessories in personal electronics equipment (e.g. smart speakers and AR / VR and mixed reality (MR). The VL53L8 will deliver even greater benefit to these features in low-light conditions, said ST. It can also support indoor/outdoor detection and smart-focus bracketing, as well as consumer lidar, where depth mapping is required. 

The VL53L8 is entering mass production now for select customers. 

http://www.st.com

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Sensor tracks motion and orientation for IoT and metaverse

Sensor fusion for motion tracking, heading and orientation detection is provided by the FSP201 low power sensor hub microcontroller released by Ceva. It is designed for use in consumer robotics and smart devices which use motion tracking and orientation such as 3D audio headsets or XR (extended reality, or augmented, virtual and mixed reality) glasses. They can also be used in six-axis motion use cases across the IoT and the metaverse.

The FSP201 is based on Ceva’s proprietary MotionEngine sensor processing software and a low-power 32bit Arm Cortex M23 microcontroller. Manufacturers can choose from a pre-qualified list of external six-axis IMU (inertial measurement units) sensors (i.e. accelerometer plus gyroscope). These are from different sensor suppliers, thereby ensuring supply chain flexibility. The sensor options can be used to provide correction smoothing actions and auto-centring for example. The former corrects orientation drift slowly and transparently allowing head and body tracking by the user for an immersive XR or 3D audio experience, the latter dynamically recentres the soundstage in 3D audio applications based on a user’s gaze to maintain immersion in dynamic conditions and eliminate drift. Other options are sensors with tilt independent heading, which allows for proper heading output even when a robot’s driving surface is uneven, enabling rapid adjustment to obstacles or changes in flooring types and ones with inclination detection to provide three degrees of freedom robot orientation to detect surface issues that could cause the robot to become stuck or damaged.

Proprietary algorithms are able to monitor changes in sensor performance and temperature during live operation for dynamic calibration. Several low-cost MEMS sensors from leading suppliers are pre-qualified and have drivers pre-integrated to accelerate development and ensure supply chain flexibility, added Ceva.

The FSP201 is designed to be versatile, using I2C and UART interfaces for chip connectivity and can be placed directly on the target product’s main circuit board or designed into a separate module. It is also code-compatible with the BNO08X series of nine-axis sensor system in package (SiP) products. 

The FSP201 and evaluation tools are available for immediate sampling via designated distributors. 

https://www.ceva-dsp.com

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