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Cellular-to-cloud dev kits connect to Microsoft Azure cloud services

Tue, Apr 11, 2023

Development kits that are Azure-certified are available from Renesas Electronics, powered by the company’s 32-bit microcontrollers. Renesas offers two versions of the kits, the CK-RA6M5 and CK-RX65N.

The kits also include the RYZ014A Cat-M1 Pmod, six on-board sensors, and a set of peripherals, including a USB FS connector, USB-to-UART serial converter, two Pmod connectors and a battery connector. For additional layers of security, Renesas collaborated with Crypto Quantique to implement a software-based IoT cryptography platform that securely connects IoT devices to server-hosted applications on-premises or in the cloud. Hardware-based security, such as the Renesas Secure Crypto Engine 9 (SCE9) and Trusted Secure IP (TSIP) driver has been incorporated on the RA6M5 and RX65N MCUs respectively.

Both development kits enable users to connect and manage wireless IoT devices via the cloud and IoT device developers to exploit features and services available through the cloud computing platform.

Both cloud development kits incorporate Renesas’ LTE CAT-M1 module, which wirelessly connects MCUs to cloud services without a gateway. The kits have Microsoft’s new Embedded Wireless Framework, which provides a simplified link to the Azure cloud platform. It lets any network adapter connect securely to the cloud, providing greater flexibility and better lifecycle management of cloud-based products, said Renesas. As a result the kits can be used in asset tracking, building automation, medical data management, voice command and industrial control applications.

Both the CK-RA6M5 and CK-RX65N kits have been certified by Microsoft Azure and are therefore validated to connect with Azure IoT hub and can be securely provisioned through the device provisioning service. According to Renesas, both can be integrated using pre-defined device models which eliminates the need to manually configure hardware.

The CK-RA6M5 and CK-RX65N cloud kits allow users to collect data from onboard sensors, upload them to the cloud for AI / machine learning processing and tools, and download the model back to the end point. Simplified development software available includes Reality AI tools and Edge Impulse Studio. Reality AI Tools provide a true endpoint AI for a range of applications, including anomaly detection and voice recognition. The Edge Impulse Studio integrated cloud environment enables end-to-end AI / ML development using the kits’ accelerometer for asset and package tracking use cases.

Both the CK-RA6M5 and CK-RX65N are available today.

http://www.renesas.com

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Energy harvesting PMIC contributes to low power IoT

Tue, Apr 11, 2023

Adding to its range of power ICs, Nexperia has introduced the NEH2000BY power management IC (PMIC) for low power embedded applications, including the IoT.

The NEH2000BY PMIC recharges a battery or storage capacitor using energy harvested from ambient sources, such as light (which can be harvested using a photovoltaic cell). The PMIC will enable the development of electronic devices that are self-powered, smaller, and environmentally friendly, said Nexperia and exploit energy harvesting to help mitigate the environmental impact of the billions of batteries produced and discarded each year.

The PMIC makes it much easier to design energy harvesting solutions which can be up to 20x smaller than other competing offerings and do not require manual optimization for individual applications, claimed the company. It is designed without inductors, which simplifies PCB design and “significantly” reduces BoM and board size. The assembly area is just 12mm².

To achieve the highest conversion efficiency, energy harvesting must be able to adapt as the ambient energy source fluctuates. To this end, the NEH2000BY performs maximum power point tracking (MPPT), an adaptive algorithm to optimise how it transfers harvested energy, achieving optimum average conversion efficiency by up to 80 per cent. The MPPT algorithm combines speed with accuracy, allows the PMIC to adapt to environmental changes in less than one second: significantly faster than any other currently available solution, said Nexperia. By maximising the amount of energy harvested over the course of a day, the PMIC can broaden the number of applicable use cases, while the self-optimisation functionality and the ability to operate autonomously without pre-programming make it simpler to design products using ambient energy.

Nexperia’s energy harvesting technology enables economical energy harvesting from various ambient sources in applications consuming up to several mW of power, including wireless IoT nodes, wearable smart tags and electronic shelf labels.

Dan Jensen, general manager business group analogue and logic ICs at Nexperia commented: “The NEH2000BY . . . will allow the adoption of energy harvesting in a larger range of use cases. By eliminating the requirement to change batteries in these applications, NEH2000BY will significantly reduce the amount of hazardous waste produced, with enormous environmental benefits.”

The NEH2000BY is available in a 16-lead, 3.0 x 3.0mm QFN package and operates between -40 and +85 degrees C.

http://www.nexperia.com

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Multi-protocol wireless module opens up less congested RF spectrum

Tue, Mar 28, 2023

Using a CYW55573 SoC by Infineon Technologies, Murata’s LBEE5XV2EA supports 2.4GHz and 5GHz operation and can also transmit and receive data in the 6GHz frequency band. As a result, users will not be limited to overcrowded areas of the RF spectrum but will be able to access to frequencies that are much less congested.

The LBEE5XV2EA also has Bluetooth 5.3 functionality built in, which includes LE (low energy) Audio, for enhanced audio quality with a low power budget.

The module incorporates 20 / 40 / 80MHz channels, with 1024-QAM modulation and a 2×2 MIMO antenna arrangement. This combination allows increased levels of data throughput, up to 1.2Gbits per second, said Murata.

The module is suitable for audio / video streaming, video conference systems as well as virtual reality (VR) and augmented reality (AR) equipment.

The module uses Murata’s own high performance components which result in a “significantly smaller” form factor, said the company. Dimensions are just 12.5 x 9.4 x 1.2mm.

It is certified to FCC / IC and TELEC and has passed conductive tests for CE, make the standards compliance process straightforward, confirmed the company.

Murata manufactures electronic components, modules and devices. Its range includes ceramic capacitors, resistors / thermistors, inductors / chokes, timing devices, buzzers, sensors and EMI suppression filters. The company is a ceramic capacitor manufacturer and also manufactures Bluetooth and Wi-Fi modules, board-mount DC/DC converters and both standard and custom AC/DC power supplies.

Established in 1944, Murata is headquartered in Japan and has European offices in Finland, France, Germany, Hungary, Italy, the Netherlands, Spain, Switzerland and the UK.

http://www.murata.com

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Infineon makes Secora Pay available in 28nm

Mon, Mar 27, 2023

Payment cards will have the capability to be offered in new, innovative designs, said Infineon, as it introduces its Secora Pay card payment technology is available on 28nm chip technology.

The Secora Pay platform allows manufacturers to efficiently produce robust dual interface cards for payment and multi-application use cases, explained Infineon Technologies.

The introduction of 28nm chip technology is believed to be the first 28nm technology card payment technology with embedded non-volatile memory. It is intended to side step the semiconductor shortages experienced in mature technology nodes.

The product family uses a security controller with certified software integrated into coil on module (CoM) chip modules. The devices use standardised inlays for easy and fast card production which are compatible with Secora Pay products on 65nm, 40nm and 28nm technology. One inlay sheet fits the existing and new Secora Pay products.

The CoM system offers maximum flexibility in card design, said Infineon. It uses inductive coupling technology with copper wired card antennas. It is therefore perfectly suited for future market trends such as environmentally friendly cards made of recycled and ocean-bound plastic or wood, as well as high-performance dual-interface metal or LED cards.

Secora Pay products support the highest throughput in card production with minimal resources for manufacturing highly robust dual-interface cards, said Infineon. New services based on Secora Pay’s NFC tag enable further use cases such as initial card activation as well as authentication for online banking and for loyalty programmes.

“In recent years, touchless payment experience with dual-interface payment cards has become a global standard, among others also driven by the Covid-19 pandemic,” said Tolgahan Yildiz, head of payment solutions at Infineon’s connected secure systems division.

The Secora Pay portfolio us engineered to enable manufacturing and issuance of high quality dual-interface payment cards for high transaction performance with reliable security for trusted seamless payments, he added.

The global dual-interface payment card market is expected to grow at a compound annual growth rate of six percent from 2022 to 2027, starting from an estimated 2.6 billion units in 2022.

The 28nm technology products offer a simple onboarding process or migration path for card manufacturers, claimed Infineon. They are backwards-compatible with existing Secora Pay products in terms of card production, antenna design, personalisation and product certification for contactless and personalised performance, enabling contactless transactions within 155 milliseconds.

Product versions supporting the latest Visa and Mastercard applications are available now with extremely long approval life time. Certified applets for American Express, Discover and others will follow later this year, confirmed Infineon.

http://www.infineon.com

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Cellular-to-cloud dev kits connect to Microsoft Azure cloud services

Energy harvesting PMIC contributes to low power IoT

Multi-protocol wireless module opens up less congested RF spectrum

Infineon makes Secora Pay available in 28nm

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