Wireless communications company Rayson Technology has released a multiprotocol module based on Nordic Semiconductor’s nRF5340 System-on-Chip (SoC). The SoC is designed for advanced Bluetooth LE audio applications, as well as sophisticated metering, wearable, smart home, industrial, and medical use cases. Measuring just 16.5 by 13.0 by 2.5 mm, the ‘BTM-N340X’ module supports LE Audio and its Low Complexity Communication Codec (LC3), which together enable higher quality, lower power wireless audio streaming compared with existing Classic Bluetooth audio solutions.
The module employs the nRF5340 SoC’s dual Arm Cortex-M33 processors – providing a high performance application processor capable of DSP and Floating Point (FP) alongside a fully programmable, ultra low power network processor. The application core manages the LC3 codec, while the Bluetooth LE protocol is supervised by the network processor.
“The BTM-N340X module has been designed for a wide range of applications, aiming in particular to provide enhanced audio experiences via Bluetooth LE Audio,” says Bob Wu, CTO at Rayson Technology. “It enables one device to stream audio to multiple pairs of wireless headphones, and can facilitate audio broadcasts through public address systems, such as in airports and museums. This module is also compatible with smart speakers and home audio systems.”
The module’s ultra-low power consumption is made possible due to the nRF5340’s power-optimised multiprotocol radio, which offers a TX current of 3.4 mA (0 dBm TX power, 3 V, DC/DC) and RX current of 2.7 mA (3 V, DC/DC). The sleep current is as low as 0.9 µA. Additionally, because the cores can operate independently, developers have the flexibility to optimise performance for power consumption, throughput, and low latency response.
Two flexible antenna options are available for the module—a pre-certified U.F.L Connector and a PCB pin out—depending on the product application. The module is designed to operate within a temperature range of -40 to +85°C.
“The dual processors made the nRF5340 SoC an excellent choice for this module’s LE Audio applications,” says Wu. “The large memory capacity, radio sensitivity, and low power consumption were also major drawcards. In addition to the excellent technical capabilities of the chip, the high level of support from Nordic was a key factor when making our selection.”
