Mouser now shipping Nordic’s Thingy:91 X prototyping platform for wireless IoT applications

Mouser is now shipping the new Thingy:91 X Prototyping Platform from Nordic Semiconductor. The Thingy:91 X is an easy-to-use, battery-operated prototyping platform for cellular Internet of Things (IoT) proof-of-concept (PoC) demos and initial cellular IoT device development for logistics, asset tracking, smart city, predictive maintenance, industrial and wearable applications.

The Nordic Semiconductor Thingy:91 X is designed to address the needs of emerging low-power cellular IoT applications utilising Nordic’s nRF9151 cellular IoT system-in-package (SiP) with an integrated Arm Cortex-M33 CPU and Arm TrustZone and CryptoCell security technology, which supports LTE-M, NB-IoT, GNSS, and NR+ certified for global operation. The Thingy:91 X platform comes preloaded with an asset-tracking application and a comprehensive set of sensors that monitor environmental conditions and movement, enhancing its utility in various IoT applications. The Thingy:91 X includes multiple digital and analog interfaces and peripherals for many design possibilities, including expansion options through a debug board connector and an expansion board connector compatible with Qwiic, STEMMA QT, and Grove systems.

The Thingy:91 X Prototyping Platform comes with all necessary modem firmware, RTOS, application software examples, and hardware reference designs to implement a full cellular IoT design. The Thingy:91 X features two user-programmable buttons for user input, with user-programmable RGB LEDs for output, along with a Nano/4FF SIM card slot, supporting (e)SIM, and bundled Onomondo and Wireless Logic SIM cards preloaded with data to connect to nRF Cloud out-of-the-box. The package also includes a 1350mAh rechargeable Li-Po battery to facilitate prototype field testing.

https://eu.mouser.com

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Infineon launches support for Apple Find My network accessories in ModusToolbox

Infineon has announced the availability of its Apple Find My network accessory support for the AIROC CYW20829, PSOC 63 Bluetooth microcontroller (MCU), AIROC CYW5591x Wi-Fi/BT connected MCU and AIROC CYW5551x within its ModusToolbox. The feature enables customers to easily build Find My network capable Bluetooth Low Energy (Bluetooth LE) devices that maximize battery performance.

The Apple Find My network — made up of over a billion Apple devices — provides an easy, secure way to locate compatible personal items using the Find My app on iPhone, iPad, Mac, or using the Find Items app on Apple Watch. The Find My network accessory program enables third-party companies to build finding capabilities into their products, letting users access Apple’s Find My app to locate and keep track of important items, even when they’re not nearby. The Find My network is anonymous and uses advanced encryption, meaning that no one else – not even Apple, Infineon, or Find My Network accessory manufacturers, can view a device’s location or information.

Infineon Technologies has added Apple Find My network functionality to its CYW20829, PSOC 63 Bluetooth MCU, CYW5591x Wi-Fi/BT connected MCU and CYW5551x via ModusToolbox. This enables customers who certify through the Apple Find My network accessory program to add Find My functionality to Bluetooth-enabled end-products, such as an e-bike, power tool, fitness tracker, key fob, smart watch, voice recorders, smart glasses, camera, etc.

“Apple Find My opens up a completely new feature for all Bluetooth IoT devices – the ability to locate them with your iPhone, iPad, Mac, or Apple Watch. We are excited to be part of this program with our Bluetooth and Wi-Fi connected MCUs,” said Shantanu Bhalerao, VP of Wireless Product Line at Infineon.

The CYW20829 MCU has a high-level of integration leading to a reduced bill-of-material (BOM) cost. It integrates a powerful 96 MHz Arm® Cortex®-M33 MCU and a secondary Arm Cortex-M33 dedicated for the Bluetooth controller. CYW20829 comes with 256 KB of application SRAM, an XIP capable Quad SPI interface to allow a flexible selection of external Flash, and a diverse range of peripherals, including CAN FD, PDM, I2S, ADC, timers.

The PSOC 63 MCU with AIROC Bluetooth Low Energy (LE) has dual-core 150-MHz Arm Cortex-M4 and 100-MHz Arm Cortex-M0+ processors, offering industry’s highest compute capability, optimised for AI/ML Edge applications. It integrates programmable analog front ends, industry-leading CAPSENSE touch sensing user interface, and Bluetooth LE radio. The PSOC 63 supports rich configurable MCU peripherals with 84 programmable GPIOs and six overvoltage-tolerant capable pins, making it suitable for a wide range of IoT applications.

The CYW5591x, ultra-low power single-chip Wi-Fi/BT connected MCU, 1×1, single/dual/tri-band Wi-Fi 6E, Bluetooth® Low-Energy 5.4, ARM TrustZone, PSA Level 2 certifiable and matter IC, has the low-power MCU delivers secure, reliable connectivity. The device is optimised for IoT including smart home, industrial, and portable devices, and can be used by itself or to offload connectivity from a host processor.

The CYW5551x, 1×1, single/dual/tri-band Wi-Fi 6/6E and Bluetooth/Bluetooth Low-Energy 6.0 Combo IC, has the high-performance, low-power single-chip combo delivers secure, reliable connectivity that goes beyond wireless standards. This optimized, power-efficient design is made for smart home, wearables, and small form-factor applications. It offers a cost-effective balance of advanced Wi-Fi 6/6E and Bluetooth/BLE features with performance and power savings for IoT connectivity needs.

AIROC products leverage a common software framework across Android, Linux, RTOS platforms and are pre-integrated with Infineon’s ModusToolbox software and tools, allowing developers to deliver high-quality, differentiated products to market on-time and on-budget.

https://www.infineon.com/Apple-Find-My

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Live webinar: Exploring Bluetooth LE with Channel Sounding

This webinar will delve into the capabilities of Bluetooth Core 6.0, focusing on the innovative Channel Sounding feature and how it can be explored with the NORA B2 module series powered by the Nordic Semiconductor nRF54L chipset series. Channel Sounding promises accurate and secure distance measurements opening up for new applications.

In partnership with Nordic Semiconductor

Agenda
• Introduction to Bluetooth Channel Sounding: Overview of Bluetooth Core 6.0’s hallmark feature, Channel Sounding, and its significance.
• How Channel Sounding Works: Detailed explanation of the mechanics behind Channel Sounding.
• About the nRF54L Series: Insights into the nRF54L chipsets that support Channel Sounding, provided by Nordic Semiconductor.
• Application and Use Case Examples: Real-world applications, including ‘Find My’ solutions, digital keys, HMI, and proximity interactions.
• Channel Sounding on NORA-B2 Modules: Demonstrations of Channel Sounding on u-blox’s NORA-B2 modules.
• Live Demo: Experience Channel Sounding in action.
• Q&A Session: Engage with our experts and get your questions answered.

Key Presenters
• Paal Kastnes – Technical Product Manager – Nordic Semiconductor
• Sebastien Delaby – Senior Product Manager – u-blox

Highlights
• Bluetooth Core 6.0 Specification: Introduction to Channel Sounding, providing sub-meter accuracy and enhanced security.
• Application Scenarios: Improved tracking solutions, digital key functionalities, enhanced HMI safety, and adaptive proximity interactions.
• NORA-B2 Module Series: Featuring the latest nRF54L series chipsets, these modules offer robust performance and low power consumption.
• Interactive Demonstrations: Witness the practical implementations of Channel Sounding technology.

https://register.gotowebinar.com

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New Bluetooth module from Panasonic Industry

The newly launched small and cost-effective PAN B511-1C Bluetooth module from Panasonic Industry features great performance and great memory while minimising current consumption based on the Nordic nRF54L15 single chip controller.
A dedicated number of GPIOs is positioned at the edge of the module, with the rest of the GPIOs located at the bottom pad. In total, the module provides access to all 32 GPIOs of the chip. Despite its hybrid packaging of castellated holes and LGA, the module remains at the small size of a 2-cent coin. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.
The module also features an embedded microcontroller and ARM Cortex- M33 with a high amount of flash memory of 1.5 MB and a RAM size of 256 kB.
An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms. Furthermore, the PAN B511-1C is ideally suited for Matter applications, as it comes equipped with additional flash memory and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. The module will be available in three distinct spec variants to cater to diverse project needs.
The PAN B511-1C Bluetooth module will be certified for CE RED, FCC, ISED and MIC. Samples are already available now and the start of mass production is scheduled for June 2025.

https://industry.panasonic.eu

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