Cadence unveils Millennium Platform the industry’s first accelerated digital twin  

Cadence has announced the Cadence Millennium Enterprise Multi-physics Platform, the industry’s first hardware/software (HW/SW) accelerated digital twin solution for multiphysics system design and analysis. Targeted at one of the biggest opportunities for greater performance and efficiency, the first-generation Cadence Millennium M1 accelerates high-fidelity computational fluid dynamics (CFD) simulations. Available in the cloud or on premises, this turnkey solution includes graphics processing units (GPUs) from leading providers, extremely fast interconnections and an enhanced Cadence high-fidelity CFD software stack optimised for GPU acceleration and generative AI. Millennium M1 instances can be fused into a unified cluster, enabling customers to achieve an unprecedented same-day turnaround time and near-linear scalability when simulating complex mechanical systems.

Designing mechanical systems for new levels of performance and efficiency has become a key priority in the automotive, aerospace and defence (A&D), energy and turbo-machinery industries. To optimise performance and reduce greenhouse gases, automotive designers are focused on improving fuel efficiency, reducing drag and noise, and extending electric vehicle range. Increasing efficiency, reducing carbon emissions and reducing maintenance frequency are top of mind for A&D and turbo-machinery design engineers. Advances in multi-physics simulation technology are critical to achieving these goals. Performance, accuracy, capacity and accelerated computing are all essential to enabling digital twin simulations that explore more design innovations, providing confidence that they will function as intended before undertaking prototype development and testing.

The Millennium Platform addresses these needs. Highlights and benefits include:
* Performance: Combines best-in-class GPU-resident CFD solvers with dedicated GPU hardware to provide supercomputer-equivalent throughput per GPU of up to 1000 CPU cores
* Efficiency: Reduces turnaround time from weeks to hours with 20X better energy efficiency compared to its CPU equivalent
* Accuracy: Leverages Cadence Fidelity CFD solvers to provide unmatched accuracy to address complex simulation challenges
* High-Performance Computing: Built with an extensible architecture and massively scalable Fidelity solvers to provide near-linear scalability on multiple GPU nodes
* AI Digital Twin: Rapid generation of high-quality multi-physics data enables generative AI to create fast and reliable digital twin visualisations of the optimal system design solution
* Turnkey Solution: The industry’s first solution that couples GPU compute with modern and scalable CFD solvers, providing an optimised environment for accelerated CFD and multidisciplinary design and optimisation
* Flexibility: Available with GPUs from leading vendors, in the cloud with minimum 8 GPU configurations, or on premises with a minimum 32 GPU configuration—providing a flexible and scalable solution to fit each customer’s deployment needs

“Throughout our 35-year history, Cadence has been focused on increasing performance with no loss of accuracy for the most challenging computational applications. Algorithmic throughput remains a key priority, and we’re now leveraging generative AI to harvest knowledge gained from massive quantities of design and simulation data,” said Ben Gu, corporate vice president of R&D for multi-physics systems analysis at Cadence. “Our revolutionary Millennium platform is a giant leap forward, delivering unprecedented acceleration and scalability of digital twin and AI applications. CFD is poised to benefit greatly from performance and efficiency gains, and the tremendous power of the Millennium M1 is disrupting industries that must explore more design innovations and bring them to market faster.”

https://www.cadence.com

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NeoMesh click boards speed development of ultra-low power, massively scalable IoT and Cloud-based sensor networks

Mikro Elektronika today announced three new NeoMesh Click boards that are ideal for wireless mesh networking. The Click boards eliminate the need for engineers to create any development PCB hardware themselves, enabling them to initiate Proof-of-Concept testing of the NeoMesh network protocol stack in a real application quickly and at minimal cost.

The Click Boards feature NeoCortec’s compact, low-power NC1000 and NC2400 network modules which address a broad range of applications based on IoT and Cloud-based sensor networks, including smart building and smart workplace, metering, security, agriculture, transportation, industry 4.0, medical and food distribution. Three versions of NeoMesh Click are available, one for each of the communication modules which operate at 868MHz, 915MHz and 2.4 GHz. Average power consumption is as low as 20uA.

Explains Thomas Steen Halkier, CEO of NeoCortec: “The NeoMesh protocol is a natural choice when building battery-powered, highly scalable and reliable wireless sensor networks. Now, developers have access to a large selection of MCU, sensor and other boards which can simply ‘Click’ together to form a prototype device.”

Click boards follow mikroBUS a modular prototyping add-on board standard invented by MIKROE, enabling design engineers to change peripherals easily, cutting months off development time. Any Click board can be connected to the microcontroller or microprocessor on a main board. Many leading microcontroller companies including Microchip, NXP, Infineon, Dialog, STM, Analog Devices, Renesas and Toshiba now include the mikroBUS socket on their development boards.

https://www.neocortec.com

 

 

 

 

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Infineon presents hybrid Time of Flight technology for next-generation smart robots

In collaboration with device manufacturer OMS and pmdtechnologies, an expert in Time of Flight (ToF) technology, Infineon has developed a new high-resolution camera solution that enables enhanced depth sensing and 3D scene understanding for next-generation smart consumer robots. The new hybrid Time of Flight (hToF) solution combines two depth sensing concepts and helps significantly reduce maintenance effort and costs for smart robots.

Infineon’s REAL3 flexible ToF imager technology enables the combination of established high-resolution iToF flood illumination and dToF long-range spot illumination in a single hybrid Time of Flight camera. For many years now, this high-resolution technology has been used to see the smallest objects in the path of the robot and navigate around them. Adding precise long-range spot data now also allows creation of an accurate 3D map of the surrounding area for intelligent path planning experiences even in challenging light conditions of bright sunlight or darkness that empower the next-generation robot vacuum cleaner.

The new solution reduces the height of robot vacuum cleaners by 20-30 percent, fully replacing the top-mounted LDS (Laser Distance Scanner) making it possible to clean even under furniture with low clearance. Measuring only 31x16x8 mm, the hybrid ToF camera requires much less space for improved mapping and obstacle avoidance functionality. Making multiple sensors redundant, hybrid ToF reduces system costs as well as operation costs, since there are no moving parts that wear out over time.

The solution serves customers with a simplified and user-friendly approach to implementation. The compact hybrid ToF solution is versatile and robust and aligns well with the evolving needs of mobile consumer robot devices in various industries such as robot vacuum cleaners, commercial robots, air-purifiers and size measurement.

https://www.infineon.com

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Renesas brings industry-leading performance of RA8 series MCUs to motor control applications

Renesas has introduced the RA8T1 microcontroller (MCU) group based on the Arm® Cortex®-M85 processor. RA8T1 devices address real-time control of motors, power supplies and other products commonly used in industrial and building automation, as well as smart homes.

The RA8T1 group is the third in Renesas’ RA8 Series, all of which deliver breakthrough performance of 6.39 CoreMark/MHz1. All RA8 MCUs take advantage of the high performance of the Arm Cortex-M85 processor and Arm’s Helium technology that provides up to a 4X performance boost for digital signal processor (DSP) and machine learning (ML) implementations over the Cortex-M7 core. This added performance in RA8T1 devices can be used for AI functions that can predict maintenance requirements for motors, reducing costly downtime.

The new RA8T1 devices include advanced PWM timing features such as 3-phase complementary output, 0% and 100% duty output capability, a double-buffer compare match register, and five phase counting modes. Analog capabilities of the new MCUs include 12-bit ADCs, 12-bit DACs and high-speed comparators used in voltage and current measurement and over-current protection. RA8T1 MCUs also offer multiple communications functions, including SCI, SPI, I2C/I3C, CAN/CAN-FD, Ethernet, and USB-FS. The new group also provides port output shutdown capability when an anomaly is detected, an important safety feature in motor control. These capabilities combined with the advanced timers and Renesas’ power management expertise, enable customers to build comprehensive, low-power motor control solutions.

All RA8 devices also offer advanced security including Arm TrustZone® technology, Renesas Security IP (RSIP-E51A), Secure Boot with first stage bootloader in immutable storage, and Pointer Authentication and Branch Target Identification (PACBTI) security extension.

The new RA8T1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of existing designs to the new RA8 Series devices.

The RA8T1 Group MCUs are available now, along with the FSP software. The new MCUs are supported in Renesas’ Flexible Motor Control development kit that enables easy evaluation of motor control using permanent magnet synchronous motors (brushless DC motors), and the Renesas Motor Workbench development tool. This development kit offers a common design platform with numerous Renesas motor control MCUs from the RA and RX families, enabling migration of IP across numerous devices.

https://www.renesas.com/RA8T1

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