Hammond prepares for industry 4.0 with IP68 1554 and 1555 enclosures

Two sealed enclosure families from Hammond Electronics have been extended with six new size options. The company has added 36 new configurations to its popular industry 4.0 1554 and 1555 sealed enclosure families.

The enclosures are available in ABS or polycarbonate with styled, opaque, clear or smoked lids. The six new sizes are 105 x 105 x 60mm and 90 x 140 x 60mm, 140 x 140 x 60mm, 90 x 180 x 60mm,  180 x 180 x 60mm and 180 x 180 x 90mm. This give a total of 150 sizes and lid options available as standard.

The company has also announced that the polycarbonate versions now have cUL and UL 508A listing and are tested to IP68 (NEMA Type 4, 4X, 6, 6P, 12 and 13). Sealing is via a tongue and groove construction and a one-piece UL listed silicone gasket.

All versions have a RAL7035 grey base. The polycarbonate range is available with a plain or styled opaque lid, a clear lid or a smoked lid. The ABS units have a plain or styled opaque grey lid which is secured with self-captivated M4 stainless steel machine screws, located outside the sealed area and threaded into integral stainless-steel bushings to preserve the sealing integrity after repetitive assembly and disassembly.

Internal features vary with size. M3 threaded brass inserts and/or standoffs for PCB or inner panel mounting and vertical PCB guides are provided in all but the smallest B size. DIN rail mounting tabs are moulded into most sizes.

The polycarbonate versions are UV stabilised for outdoor use. The grey material has a UL94-5VA flammability rating, the clear and smoked lids are rated UL94V-0. The ABS versions are rated UL94-HB.

Hammond specialises in manufacturing small plastic, die-cast and metal enclosures for use in the electronics, electrical and allied industries.

http://www.hammondmfg.com

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Smart mobility: Ukrainian city of Vinnitsa selects CIPURSE™ for transit ticketing

The city of Vinnitsa, Ukraine, is implementing a new, state-of-the art system for automated fare collection based on the CIPURSE™ open security standard. Infineon Technologies AG has been selected as sole supplier of the security chips to be embedded into 200,000 transportation cards for the city’s trams and busses. The cards will be issued from summer 2019 onwards.

The project is led by the municipal company Vinnitsa Card Service. Infineon is providing the CIPURSE security chips to be embedded into the cards. The hardware equipment for the terminals is being sourced from Mikroelektronika from the Czech Republic while Symbol Systems from Ukraine is responsible for software integration.

In a next step, the city of Vinnitsa will introduce social cards which combine transport ticketing with payment functionality. As part of the Ukrainian government’s roadmap towards a digital economy and society, similar projects have already been implemented in Ukraine. Local banks in the city of Zhitomir, for example, are issuing multi-application cards with CIPURSE-based security chips from Infineon.

Seamless and convenient solutions for public transportation

Population growth and continued urbanization are placing a growing strain on the environment. Public transportation is one of the key livability factors in a modern, smart city, extending beyond the obvious bus and train options to include services such as car-sharing and bike rentals. At the UITP Global Public Transport Summit in Stockholm, 9-12 June 2019, Infineon will be exhibiting transit ticketing solutions for seamless and convenient mobility

CIPURSE is an internationally supported, non-proprietary security standard for transport ticketing and access solutions. The specifications are managed by the OSPT Alliance. The truly open standard is highly flexible, supporting cards and tickets while also providing guidance for multi-purpose solutions. It is also supported in smartphones and therefore offers a convenient alternative to contactless tickets. Furthermore, providing future-proof security architectures based on Advanced Encryption Standard (AES) 128-bit key length, CIPURSE eliminates the fraud problems that tend to compromise existing proprietary systems.

More information is available at www.infineon.com/cipurse

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Siemens integrates the u-blox ZED-F9K module into its V2X test fleet

The ZED-F9K turnkey solution minimizes the effort required to achieve decimeter-level positioning accuracy in automotive applications.

Thalwil, Switzerland – June 7, 2019 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies for the automotive, industrial, and consumer markets, is announcing that Siemens has integrated the u‑blox ZED-F9K (https://www.u-blox.com/en/product/zed-f9k-module) high precision dead reckoning module into its Toyota Prius V2X (vehicle-to-everything) test fleet. Siemens carried out live demonstrations of the technology at the ITS European Congress 2019 (https://2019.itsineurope.com/) in Eindhoven, the Netherlands.

As the only available source of absolute position, satellite-based positioning plays a crucial role in advanced driver automation systems and driverless vehicles. The same is true in V2X communication, in which vehicles continuously share their location and other information with other traffic participants – cars and pedestrians – as well as surrounding infrastructure,  improving road safety and reducing traffic congestion.

V2X test vehicles typically determine their position using high-end, expensive GNSS (Global Navigation Satellite Systems) receivers. While these provide highly accurate position information, they fail to realistically represent the hardware that will be deployed in vehicles produced for the mass market. By opting to use the ZED-F9K turnkey solution for high precision dead reckoning, Siemens was able to align the performance of their test fleet with real world conditions while also reducing the cost and the engineering effort required to develop their vehicles.

“We’ve had a very positive experience with u-blox’s ZED-F9K high precision dead reckoning solution. The product delivered strongly from the initial design-in to the data and performance in our first tests,” says Igor Passchier, Engineering fellow, Connected and Automated Driving at Siemens PLM Software. “It underscores the reputation of u‑blox as a trusted innovator in GNSS technology.”

“Our collaboration with Siemens shows the extent to which the ZED-F9K turnkey solution saves OEMs time, cost, and engineering effort while providing decimeter-level positioning performance,” says Alex Ngi, Product Strategy for Dead Reckoning, Product Center Positioning, u-blox. “For us, it has also been a welcome opportunity to contribute to solving the challenges in the autonomous driving ecosystem.”

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RX72M microcontrollers with EtherCAT support industrial applications

Renesas Electronics offers the RX72M group of RX microcontrollers featuring an EtherCAT slave controller for industrial Ethernet communication. The single-chip microcontroller has large memory capacities for compact industrial robots, programmable logic controllers, remote I/O, and industrial gateways that require control and communication functions such as compact industrial robots, programmable logic controllers, remote I/O, and industrial gateways.

The RX72M group achieves a 1396 CoreMark score at 240MHz as measured by EEMBC benchmarks and it is capable of application processing and EtherCAT communication. It combines a motor-control microcontroller with on-chip EtherCAT slave functions to reduce the circuit board area by approximately 50 per cent, compared with earlier devices and support miniaturisation in industrial equipment design.

The RX72M is the first RX MCU group to include an EtherCAT slave controller featuring the RX family’s highest SRAM capacity of 1Mbyte of SRAM and 4Mbyte of flash memory. It is also the first embedded double precision floating point unit (FPU) in an RX microcontroller.

The large-capacity SRAM allows the microcontrollers to run multiple memory-intensive middleware systems, such as TCP/IP, web servers, and file systems, at high speed without the use of external memory. It also supports future functional expansions, such as OPC United Architecture with no additional memory required. The on-board flash memory operates as two 2Mbyte banks, which enables stable operation of the end equipment, such as executing a program in one flash memory while simultaneously conducting background rewrites in the other flash memory.

Dedicated trigonometric function (sin, cos, arctan and hypot fucntions) accelerators and a register bank save function support precision motor control implementation. Encryption module and memory protection function in hardware to protect application systems from being copied without authorisation and support authentication.

Package options include 176-pin LQFP and 176-pin BGA configurations as well as the first 224-pin BGA package for RX microcontrollers for size-constrained designs.

Samples of the RX72M Group of MCUs are available now. Renesas will begin mass production orders starting September 2019.

https://www.renesas.com

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