Detection sensor distinguishes earthquake from false alarms

False detection prevention is a built-in function of the BP3901 compact, high accuracy, seismic detection sensor module, from Rohm Semiconductor. The BP3901 can be used for applications requiring reliable earthquake detection, such as automatic doors, unmanned transport vehicles, and smart meters.

Accurately detecting vibration when an earthquake occurs and for stopping operation of equipment prevents secondary disasters following an earthquake and are also used to detect damage conditions and assist with early recovery. Rohm points out that mechanical earthquake detectors can only detect the presence/absence of vibration and cannot distinguish whether the vibration is due to an actual earthquake or to other external factors, which often results in false positives.

The compact BP3901 measures 11.8 x 8.6 x 2.5mm and integrates an original earthquake detection algorithm and a false detection prevention function to make it capable of accurately distinguishing between vibration due to earthquakes or other external factors. It also has an angle correction function (±15 degrees allowable mounting angle) to correct for unintentional tilt of the module.

The BP3901 incorporates a three-axis accelerometer. The earthquake detection algorithm focuses on determining spectrum intensity (SI) values. The algorithm has a high correlation with measured seismic intensity data used for earthquake damage assessment while it also optimises the digital signal processing of acceleration data and calculation parameters/sequence through analysis of measured excitation data. This makes it possible, says Rohm, to accurately measure the seismic level, enabling more precise earthquake detection compared with conventional mechanical sensors.

By conducting detailed analysis of vibration waveforms and integrating a false detection prevention function, Rohm was able to distinguish between waveforms due to external factors’ vibrations and actual seismic events.

Conventional earthquake detectors can encounter problems in detecting earthquakes due to deviations in the internal seismic detection function and inclination that occurs over time. The BP3901 achieves angle correction by combining the characteristics of the built-in accelerometer with new angle compensation operation. This allows it to correct for inclination within the vertical planes by up to ±15 degrees (three times that of conventional products) in response to the gravitational acceleration of the Earth.

The module is designed to stay in standby mode until a seismic event is detected to prolong application operation. Standby current consumption is 3.5 microA, achieved by optimising arithmetic processing, explains Rohm. For example, installing this module in a fan heater exposed to an average of 10 seismic events a month, each with a duration of 180 seconds each time, enables operation for up to five years or more, using just two alkaline AA batteries (in series).

The BP3901 saves calculated seismic data in non-volatile memory when the vibration exceeds a certain level. The last 16 seismic events can be stored in order of earthquake magnitude. Analysing earthquake data collected at various locations will make it possible to predict future earthquakes. Comparison of past earthquake data with damage conditions and equipment deterioration it is also expected to see use in earthquake recovery work and maintenance prioritization.

The BP3901 is sampling now, with OEM quantities in August.

Rohm has said that it will continue to develop algorithms optimised for different vibration detection and expand its sensor module offering.

http://www.rohm.com/eu

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Raspberry Pi 4 computer triples speed, says Farnell

Distributor Farnell has introduced the Raspberry Pi 4 Model B computer, describing it as the most powerful Raspberry Pi to date.

It is three times faster and offers greater memory capacity, with improved interface and connectivity, says Farnell.

The Raspberry Pi 4 Model B Computer offers significant enhancements in processor speed, multimedia performance, memory and connectivity for general desktop computer users, hobbyist and makers and professional developers working with compute-intensive embedded applications such as computer vision and artificial intelligence (AI).

“The Raspberry Pi 4 Model B Computer … delivers a real jump in capabilities and addresses the needs of the growing market for Raspberry Pi,” said Hari Kalyanarama, global head of single board computers at Farnell.

The Raspberry Pi 4 Model B Computer is the first model to use a 28nm SoC, delivering a significant increase in performance and energy efficiency, reports Farnell. It has a quad-core ARM Cortex-A72 64-bit processor clocked at 1.5GHz, which accounts for the three-fold increase in operating speed.

For video and sound there are two micro HDMI ports support dual-display output at resolutions up to 4K. For fast data transfer, there is a SuperSpeed USB 3.0 to deliver transfer rates to mass-storage devices (up to 5Gbits per second). There is true Gigabit Ethernet connectivity to deliver network data rates of up to 1Gbits per second.

Dual-band wireless networking at 2.4 and 5.0GHz delivers data rates in excess of 100Mbits per second. Modular compliance certification allows the board to be designed into end products with what Farnell descrbies as “significantly reduced compliance testing” to accelerate time to market.

Memory options are 1.0, 2.0 and 4Gbyte LPDDR4  and for multimedia applications the Raspberry Pi 4 Computer has H.265 decode (4kp60), H.264 decode (1080p60) and H.264 encode (1080p30), OpenGL ES 3.0 graphics and an image sensor pipeline.

There is a 40-pin general purpose I/O header with full backward compatibility and additional multiplexed UART, I2C and SPI peripherals. There is also a Micro SD card slot for loading operating system and data storage and Power over Ethernet (PoE) support, using a separate HAT accessory.

According to Raspberry Pi Trading Chief Executive Eben Upton, AI and machine learning (ML) data can be processed right on the board, reducing the need to send data to the cloud and addressing real-world concerns about privacy. The Raspberry Pi 4 Model B can be used as a desktop computer, with a powerful processor, multimedia acceleration and dual-display support.

The Raspberry Pi 4 Model B Computer is the first model to use a 28nm SoC, delivering a significant increase in performance and energy efficiency.

The Raspberry Pi 4 Model B Computer will remain in production until at least January 2026.  Also available alongside the Raspberry Pi 4 Computer is a new case and a range of accessories including power supplies and micro HDMI cables.

The Raspberry Pi 4 Computer is available now from Farnell across EMEA and CPC in the UK, and Newark in North America.

http://www.element14.com

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X-Fab explores diode design with 180nm process technology

Sensitive single photon avalanche diode (SPAD) and avalanche photodiode (APD) devices from X-Fab Silicon Foundries are based on its modular 180nm process technology.

They can be implemented in applications where there are extremely low light conditions, needing augmented sensitivity, as well as tight timing resolutions.

The APD has a strong linear gain figure and is scalable from 10 to several hundred micrometer dimensions. The proprietary X-Fab quenching circuit used in the SPAD results in a dead time of less than 15 nanoseconds, says the company, supporting high bandwidth. The low dark count rate (up to 100 counts/s/micron²) reduces its susceptibility to thermal noise. The high photon detection probability (PDP) of the SPAD ensures that a much higher proportion of incident photons trigger an avalanche which is maintained across wavelengths.

The APD and SPAD can be used in proximity sensing, lidar, time of flight (ToF), medical imaging (CT and PET) and scientific research. They are AEC-Q100- compliant for automotive systems.

The low breakdown voltage of less than 20V allows them to be integrated easily onto customer dies and combined with other modules in the XH018 process.

Designers can integrated them into devices using models for optical and electrical simulation, and a specific application note.

A quenching reference circuit that demonstrates the capabilities of the SPAD is also available, together with a function block format.

X-Fab is an analogue/mixed-signal and MEMS foundry group manufacturing silicon wafers for many applications, including automotive, industrial, consumer and medical, X-Fab’s modular CMOS and SOI processes range in geometries from 1.0 to 0.13 micron. The company also offers special SiC and MEMS long-lifetime processes.

The mixed-signal ICs, sensors and MEMS are manufactured at six production facilities in Germany, France, Malaysia and the United States.

Visitors to Sensors Expo at the McEnery Convention Center, San Jose (25 to 27 June) can see these and other products at the X-Fab booth (546).

http://www.xfab.com

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Angle sensors from Infineon are accurate at low magnetic fields

Sensors based on anisotropic magnetoresistive (AMR) technology will be unveiled by Infineon Technologies at this week’s Sensor+Test show in Nuremberg, Germany.

The Xensiv TLE5109A16 family of AMR-based angle sensors are used in the measurement of angles where high functional safety levels are demanded, for example the industrial and automotive sectors.

They can be used for position measurement in brushless DC motors for pumps, wipers or brakes, position measurements of valves, flaps or pedals and steering angle measurement.

The Xensiv TLE5109A16 angle sensors are designed for 180 degree angle measurement but are also applicable for 360 degree measurement in motors with an even number of pole pairs. They are suitable for a range of magnetic fields, from 10 to 500mT.

Accuracy 0.1 degree angle error which is a benefit, especially at low magnetic fields between 10 and 20mT, where usually the angle error significantly increases, says Infineon. The Xensiv TLE5109A16 products outperform current angle sensors with angle errors as low as 0.2 degrees, says the company. As a result, customers can use less powerful, i.e. cheaper, magnets.

Xensiv TLE5109A16 angle sensors are available as single and dual die versions, the latter is suitable for ASIL D level safety applications. Infineon offers them with two supply voltage options: 3.3 and 5.0V. The sensors have a short start-up time of 40 to 70 micro seconds and are suitable for high-speed applications with more than 30,000 rotations per minute.

The AMR-based TLE5109A16 family will be added to Infineon’s GMR-based TLE5009A16 and TLE5309D products. Identical pin-configuration and interfaces of all Xensiv TLE5x09 sensors inside a TDSO-16 package enable customers to switch from one to another product or product version very quickly and at low design-in efforts.

Infineon will show the Xensiv TLE5109A16 angle sensors and other sensors for smart vehicles, the smart home, smart industry and robotics as well as health and fitness applications at Sensor+Test 2019 (25 to 27 June 2019) Hall 1, booth 429.

http://www.infineon.com/sensortest

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