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Automotive SoC excels in LED flicker mitigation for cameras

Tue, Jan 10, 2023

Omnivision has released its most advanced automotive SoC for surround view systems (SVS) and rear view cameras (RVC). The OX01E20 is pin to pin compatible with 1.3Mpixel designs and brings LED flicker mitigation (LFM) and 140db high dynamic range (HDR) capabilities to the company’s portfolio of automotive single chip image sensor and signal processors.

The OX01E20 is claimed to provides the industry’s best imaging performance for SVS and RVC across a range of challenging lighting conditions. It also has the most compact form factor and lowest power consumption, said Omnivision. In a single 1/4-inch optical format package, the OX01E20 features a three micron image sensor, an advanced image signal processor (ISP) and full-featured distortion correction / perspective correction (DC / PC) and on-screen display (OSD). Designers can achieve a small form factor with “excellent low light performance, ultra-low power, and reduced cost, while also improving reliability by using only one PCB,” said Omnivision.

The HDR and LFM performance applies over the automotive temperature range, added Omnivision.

The OX01E20 is built on Omnivision’s PureCel Plus architecture, which is renowned for its low light sensitivity and provides the industry’s best SNR (signal to noise ratio) performance, claimed the company.

The OX01E20 is ASIL-B safety-compliant. It is sampling now and will be in mass production in June 2023.

Omnivision is a fabless semiconductor organisation that develops advanced digital imaging, analogue and touch and display products for multiple applications and industries, including mobile phones, security and surveillance, automotive, computing, medical, and emerging applications.

http://www.ovt.com

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Renesas releases Wi-Fi development kit supporting new Matter protocol

Mon, Jan 09, 2023

Renesas has released its first development kit that includes support for the new Matter protocol. Renesas also announced that it will offer Matter support on all future Wi-Fi, Bluetooth Low-Energy and IEEE 802.15.4 (Thread) products, including products from Dialog Semiconductor and Celeno Communications, which it recently acquired.

The Matter securely and robustly connects various smart devices with each other across ecosystems, regardless of the manufacturer to address interoperability conflicts for smart home devices. The application layer protocol abstracts the underlying connectivity technologies such as Wi-Fi, Thread and Bluetooth Low Energy. By using a common software stack, device manufacturers who build with Matter will support various smart home ecosystems and voice services. Smart home users will be able to buy any Matter-certified device regardless of their platform of choice.

Renesas is a member of the Connectivity Standards Alliance. “Connectivity is a critical part of our IoT solutions,” commented Sean McGrath, vice president of the connectivity and audio business division in Renesas’ IoT, industrial and infrastructure business unit. He believed that the company’s broad range of Bluetooth and Wi-Fi solutions, and Thread products in development, mean it is “well positioned to take advantage of the Matter standard in a variety of applications working with customers worldwide.”

Renesas has more than a decade of experience in Bluetooth LE and Wi-Fi. With more than 600 million wireless devices shipped, Renesas offers a broad range of connectivity SoCs used in IoT, wearable products and home networking.

The DA16200 Ultra-Low Power Wi-Fi Modules development kit is based on the DA16200 SoC, believed to be the world’s first Wi-Fi SoC to deliver year-plus battery life for always-connected Wi-Fi IoT devices.

DA16200 also supports Renesas Quick Connect IoT through the Ultra Low Power Wi-Fi Pmod board. It is fully integrated into Renesas’ e2 studio for easy system development using Renesas MCU, connectivity and other devices.

Renesas is sampling the DA16200 Development Kit with Matter support to lead customers now and expects to release it broadly by the end Q1 2023.

http://www.renesas.com

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13th Gen Intel Core mobile processor includes “world’s fastest”

Mon, Jan 09, 2023

The 13th Gen Intel Core mobile processor family has been introduced and includes the flagship Intel Core i9-13980HX, claimed to be the first 24-core processor for a laptop and world’s fastest mobile processor.

A total of 32 new 13th Gen Intel Core mobile processors were announced at CES 2023. The Intel Core H-, P- and U-series mobile processors power the latest thin, lightweight laptops and IoT devices.

The 13th Gen Intel Core H-series mobile processors include the first 24-core processor for a laptop. The HX processors support both DDR4 and DDR5 memory, are claimed to have best-in-class connectivity and feature PCIe Gen 5 for mobile gaming applications.

The HX family offers up to 5.6GHz turbo frequency, believed to be the highest clock speed available for the laptop market, delivering up to 11 per cent faster single-thread performance and 49 per cent faster multi-task performance over the previous generation.

It also features processors with up to 24 cores (eight Performance-cores, 16 Efficient-cores), 32 threads and enhanced Intel Thread Director. Memory support is up to 128Gbyte for DDR5 (up to 5,600MHz) and DDR4 (up to 3,200MHz).

The Intel Killer Wi-Fi 6E (Gig+) provides up to six times faster internet speeds with no legacy Wi-Fi channel interference. The processor family also features Bluetooth LE Audio and Bluetooth 5.2 supporting up to two times faster speeds and multiple device connections with lower power consumption.

Thunderbolt 4 support delivers transfer speeds up to 40Gbits per second and PC connectivity to multiple 4K monitors and accessories.

Leveraging work with discrete graphics, the processors improve the integrated graphics experience based on improved driver stack and key learnings, said Intel.

The HX and HK processors all have overclocking capabilities.

The Intel Core P-series and U-series mobile processors offer up to 14 cores (six Performance-cores, eight Efficient-cores) and enhanced Intel Thread Director.

There are new Intel Iris Xe Graphics features including endurance gaming, XeSS Super Sampling and Intel Arc Control.

There is also broad memory support for DDR5 and DDR4 and LP variants and integrated Intel Wi-Fi 6E (Gig+) and new wireless features like Intel Connectivity Performance Suite, Intel Wi-Fi Proximity Sensing and Intel Bluetooth LE Audio.

There are up to four Thunderbolt 4 ports for the fast, simple and reliable dock, display or accessory cabling.

For the first time, select designs based on 13th Gen Intel Core processors will feature the Intel Movidius vision processing unit (VPU). AI-heavy tasks required can be offloaded to the VPU, freeing up the CPU and GPU for other workloads or multi-tasking.

Target applications are retail, education, healthcare, aerospace, industrial and smart cities, where the new processors provide better workload consolidation with more cores and threads, enabling applications to run on a single device for IoT edge computing, said Intel.

For the IoT edge, 13th Gen Intel Core processors deliver extended temperature operation and higher performing CPUs, with more graphics capabilities and AI performance, said Intel.

http://www.intel.com

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NXP packages automotive radar in single chip

Mon, Jan 09, 2023

Claimed to be an industry-first, a family of 28nm RFCMOS radar one-chip ICs has been introduced by NXP for advanced driver assistance systems (ADAS) and autonomous driving systems.

The SAF85xx family combines NXP’s radar sensing and processing technologies into a single device. They integrate four high-performance transmitters, four receivers, a multi-core radar processor with hardware accelerator, Gigabit Ethernet communication interface and memory into a single device. NXP said, the ICs offer Tier one companies and OEMs flexibility in addressing short, medium and long range radar applications for challenging NCAP safety requirements.

The SAF85xx family targets the Automotive Safety Integrity Level B (ASIL B) requirements, according to the ISO 26262 functional safety standard and the automotive cybersecurity standard ISO/SAE 21434 to meet the requirements of the automotive industry for safety and security.

The family of automotive radar SoCs is comprised of radar transceivers integrated with multi-core radar processors which are built on NXP’s S32R radar compute platform. The SAF85xx offers twice the RF performance and accelerates radar signal processing by up to 40 per cent, compared to NXP’s previous generation.

The one-chip family enables 4D sensing for corner and front radar, for ADAS applications such as automated emergency braking, adaptive cruise control, blind-spot monitoring, cross-traffic alert and automated parking.

The single chip radar ICs enable “the reliable long range detection of objects and separation of small objects next to larger ones, like a fast-moving motorcycle next to cars and trucks on a busy multi-lane highway,” said Torsten Lehmann, executive vice president, NXP Semiconductors. “Its small form factor allows our customers to build radar sensor modules that are up to 30 per cent smaller,” he added, which is expected to expand the potential of radar safety.

The SAF85xx one-chip family is sampling now for alpha customers.

http://www.nxp.com

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Automotive SoC excels in LED flicker mitigation for cameras

Renesas releases Wi-Fi development kit supporting new Matter protocol

13th Gen Intel Core mobile processor includes “world’s fastest”

NXP packages automotive radar in single chip

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