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Direct Insight creates QNX 7 BSP for Toradex Colibri iMX8X SoC modules

Thu, Jul 22, 2021

Systems integrator and system on module (SoM) reseller, Direct Insight, has created a QNX 7 board support package (BSP) for Toradex’s Colibri iMX8X embedded computing modules. They feature-rich QNX OS with real-time capability combined with the i.MX 8X processors can be used for mission critical applications such as medical devices, navigation, industrial automation, HMIs, avionics, POS, data acquisition and robotics.

Toradex Colibri iMX8X modules feature the NXP i.MX 8X family of embedded SoCs, including the i.MX 8QuadXPlus (i.MX 8QXP) which has four Cortex-A35 cores as the main processor cluster. The SoCs provide full 64-bit Arm v8-A support while maintaining seamless backward compatibility with 32-bit Armv7-A software. The main cores run at up to 1.2GHz.

According to David Pashley, Direct Insight’s managing director: “QNX is perfect for real time, safety critical applications,” he added that the BSP created by Direct Insight provides a great starting point for high availability industrial designs.

The QNX 7 BSP for Toradex’s Colibri iMX8X contains all the basic features required to run the OS on the board, such as drivers for various interfaces including Ethernet, Watchdog timer, I2C, SPI, USB, SD card and UART. A display driver is also planned.

The BSP is free to download as a demo system, and the source code can be licensed on a per-project basis for an affordable fee. Direct Insight also offers enhancements to the BSP, including additional drivers and production-hardening and testing.

Daniel Lang, chief medical officer at Toradex, added: “We design products for applications that demand high reliability, safety and security, such as medical devices. The QNX offering from Direct Insight further strengthens this positioning and allows our customers to use QNX while lowering the project risk and shortening the time-to-market.”

Founded in 1992, UK-based technical systems integrator and reseller of system on module (SoM) and other embedded systems, Direct Insight helps development teams to upgrade to the latest SoC, FPGA and OS technology by choosing the right off-the-shelf hardware, software and tools. It also provides support and services to fill the gaps, allowing customer development teams to focus on differentiating core skills.

Key partners include QNX, Ka-Ro Electronics, the German designer and manufacturer of embedded modules; and Taiwanese single board computer maker, DFI.

http://www.directinsight.co.uk

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Hand-held camera cube reference design brings AI to the edge

Wed, Jul 21, 2021

Artificial intelligence (AI) which was previously limited to expensive machines with large power budgets can now be embedded in space-constrained, power-powered edge devices. Maxim Integrated says its MAXREFDES178# camera cube executes low latency AI vision and hearing inferences on a coin cell power budget with reduced cost and size.

The MAXREFDES178# enables low power IoT devices to implement hearing and vision. It is based on the MAX78000 low power microcontroller with neural network accelerator for audio and video inferences. The system also contains the MAX32666 low power Bluetooth microcontroller and two MAX9867 audio codecs. The system is delivered in a compact form factor to show how AI applications, such as facial identification and keyword recognition, can be embedded in low power, cost sensitive applications such as wearables and IoT devices.

AI applications require intensive computations, which is usually performed in the cloud or in expensive, power-hungry processors: self driving cars is an example. Maxim says that its MAXREFDES178# camera cube demonstrates how AI can operate on a low power budget, enabling applications that are time- and safety-critical to run on even the smallest of batteries. The MAX78000’s AI accelerator slashes the power of AI inferences up to 1,000x for vision and hearing applications, compared to other embedded solutions, reports Maxim. The AI inferences running on the MAXREFDES178# also show dramatic latency improvements, running more than 100x faster than on an embedded microcontroller.

The compact form factor of the camera cube (1.6 x 1.7 x 1.5inch of 41 x 44 x 39mm) allows AI to be implemented in wearables and other space-constrained IoT applications. The MAX78000 is up to 50 per cent smaller than the next-smallest GPU-based processor, says Maxim, and does not require other components like memories or complex power supplies to implement cost-effective AI inferences.

The MAXREFDES178# and the MAX78000 is available now, together with the MAX32666GWPBT+T RF microcontroller and the MAX9867EWV+T stereo codec at Maxim Integrated’s website and authorised distributors.

http://www.maximintegrated.com

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CoreAVI brings cockpit graphics based on Intel 11th Gen Core processors

Wed, Jul 21, 2021

Graphics and computing software for safety critical cockpit displays, mission computing and autonomous vehicle systems are provide by CoreAVI, based on the 11th Gen Intel Core processor.

CoreAVI’s software and hardware building blocks are capable of achieving RTCA DO-178C and DO-254 DAL A, ISO 26262 ASIL D and IEC 61508 SIL 3 safety certifications, says the company. Intel will provide CoreAVI with access to detailed technical data, including Intel Airworthiness Evidence Package, and Functional Safety Essential Design Package for the processor.

CoreAVI’s support for Intel’s Core CPU includes its COTS-D hardware IP modules, VkCore SC Vulkan-based graphics and compute driver, VkCoreGL SC1/SC2 OpenGL SC, VkCoreVX SC OpenVX SC 1.3 and ComputeCore libraries. These provide a safety critical framework to support integrated GPU compute, vision systems and safe artificial intelligence (AI) deployments, continues CoreAVI. They have been purpose-built to enable customers to reduce the time to market as well as reducing associated costs and risk while increasing return on investment (ROI).

The 11th Gen Intel Core processor incorporates Intel Iris Xe Graphics. The integrated GPU delivers about three times the graphics performance of the previous generation Core processor for edge computing. According to CoreAVI, the Intel Core processor, with up to four CPU cores, four displays up to 8K, and extended temperature ratings, offers scalable power, enhanced security, and the high performance gains for the advanced parallel processing required in today’s safety critical avionics applications.

“We are excited to announce this partnership with Intel to bring to market a true safety critical compute and graphics platform based on Intel’s latest Core processor,” said Dan Joncas, chief sales and marketing officer at CoreAVI. “This partnership ensures that our customers are able to harness the full performance of Intel’s latest generation of graphics and compute processing capabilities coupled with rigorous safety certification that spans multiple markets and applications.”

“Avionics applications continue to demand the highest levels of performance and safety capabilities that are being met more frequently with multi-core processors,“ said Tony Franklin, general manager of federal and aerospace IoT markets at Intel. “With our 11th Gen Core processor, we provide compelling compute performance together with the Intel Airworthiness Evidence Package, which provides safety artefacts to enable and simplify the certification of safety critical avionics systems.”

CoreAVI specialises in architecting and delivering safety critical graphics and compute software drivers and libraries, embedded SoC and discrete graphics processor components, and certifiable platform hardware IP. CoreAVI’s comprehensive software suite enables development and deployment of complete safety critical solutions for automotive, industrial and aerospace applications requiring certification to the highest integrity levels coupled with full lifecycle support. Its portfolio supports both graphics and compute applications including safe autonomy, machine vision and AI in the automotive, unmanned vehicle and industrial IoT markets, as well as commercial and military avionics systems.

http://www.coreavi.com

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Three RF power transistors series target ISM satellite, avionics and radar

Tue, Jul 20, 2021

Three series expand STMicroelectronics’ STPower family of LDMOS transistors, addressing RF power amplifier applications in commercial and industrial projects.

The high efficiency, low thermal resistance devices combine a short conduction-channel length with a high breakdown voltage for cost-effective, low power consumption but high reliability operation, says ST.

The IDCH and IDDE series are 28V / 32V common-source N-channel enhancement-mode, lateral, field-effect RF power transistors.

The IDCH devices provide output power from 8.0 to 300W and are specifically designed for applications up to 4GHz, including 2.45GHz industrial, scientific, and medical (ISM), wireless infrastructure, satellite communications, and avionics and radar equipment. The LDMOS devices are suitable for all types of modulation formats.

The IDDE series consists of 10 to 700W devices for broadband commercial, industrial, and scientific applications at frequencies up to 1.5GHz. The devices can withstand a load voltage standing wave ratio (VSWR) of 10:1, through all phases. The IDDE LDMOS transistors are suitable for all typical modulation formats, and for most classes of RF power amplifier operation including Class A, Class AB, and Class C. The high efficiency minimises the energy needed to deliver the required output power, resulting in lower operating costs and reduced heat dissipation to simplify thermal management and to enable more compact systems.

In the IDEV series, devices are based on a 50V common-source, N-channel-enhancement-mode, lateral field-effect, RF power transistor technology. The transistors have output power from 15 up to 2.2kW and are designed for ISM applications at frequencies up to 250MHz, including driving high power CO2 lasers, plasma generators, MRI systems, broadcast FM radio transmitters in the 88 to 108MHz range, and avionics and radar applications up to 1.5GHz. They are suitable for all typical modulation formats and for power amplifier operation in Class A, Class AB, and Class C.

The rugged IDEV series is capable of up to 2.2kW continuous wave (CW) output power, from HF (3.0 to 30MHz) frequencies up to 250MHz. The single ceramic package reduces the number of RF power transistors needed in high power applications, such as broadcast transmitters, says ST. Power efficiency greater than 82 per cent minimises system power demand and ensures high reliability with simple thermal management.

There STPower RF LDMOS devices are available in industry standard packages.

http://www.st.com

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Direct Insight creates QNX 7 BSP for Toradex Colibri iMX8X SoC modules

Hand-held camera cube reference design brings AI to the edge

CoreAVI brings cockpit graphics based on Intel 11th Gen Core processors

Three RF power transistors series target ISM satellite, avionics and radar

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