ICs & Semiconductors

Seven surface mount devices in the space saving D2PAK package have been added to Qorvo’s (formerly UnitedSiC) portfolio. The 750V SiC FETs are supplied in the surface mount D2PAK-7L package and are intended for onboard chargers, soft-switched DC/DC converters, battery charging (fast DC and industrial) and IT / server power supplies. According to Qorvo, they are suitable for high power applications that require maximum efficiency, low conduction losses and excellent cost effectiveness in a thermally enhanced package.

The Gen 4 UJ4/SC FETs are claimed to have the industry’s lowest RDS(on) of 9 mOhm at 650/750V. The 750V SiC FETs that make up the Gen 4 UJ4C/SC series are rated at 9.0, 11, 18, 23, 33, 44 and 60mOhm. According to Qorvo, this selection means that engineers have the flexibility to choose the device that can enable optimum cost/efficiency balance while maintaining generous design margins and circuit robustness. 

The latest additions use the cascode SiC FET technology introduced by UnitedSiC whereby a normally-on SiC JFET is co-packaged with a Si MOSFET to produce a normally-off SiC FET for low conduction losses in a small die.

Anup Bhalla, chief engineer at Qorvo, said, “The D2PAK-7L package reduces inductance from compact internal connection loops which ─ along with the included Kelvin source connection ─ results in low switching loss, enabling higher frequency operation and improved system power density. These devices also feature silver-sinter die attach, resulting in very low thermal resistance for maximum heat extraction on standard PCBs as well as IMS [insulated metal substrates] with liquid cooling.”

The 750V Gen 4 SiC FETs are available now in the D2PAK-7L package.

Qorvo provides radio frequency (RF) products, combining technology, systems-level expertise and global manufacturing to address complex technical challenges. Qorvo serves diverse market segments, including advanced wireless devices, wired and wireless networks and defence radar and communications. It also operates in the 5G networks, cloud computing, the IoT space and other emerging applications.

http://www.qorvo.com  

Robust ESD (electrostatic discharge) protection diodes have been added to Nexperia’s portfolio of low clamping and low capacitance ESD protection diodes. This portfolio is designed to protect high speed data lines such as USB 3.2, HDMI 2.0, LVDS, automotive A/V monitors, displays and cameras. It also aims to address the upcoming high speed video links and the OPEN Alliance MGbit Ethernet applications. 

The PESD5V0C1BLS-Q and PESD5V0C1ULS-Q are both two-pin single line devices supplied in compact DFN1006BD-2 packages. This is intended to optimise routing. The other new additions are the PESD5V0C2UM and PESD5V0C2UM-Q which are available as three-pin devices for both differential lines. They are supplied in a DFN1006-3 package which has side wettable flanks to enable automated optical inspection (AOI). 

All variants come in leadless packages to improve electrical performance and signal integrity.

ESD voltage clamping diodes protect data interfaces in automotive subsystems but developers have to be careful that they do not degrade data signal integrity or negatively impact the electromagnetic compatibility (EMC) performance of the systems. Nexperia claimed these diodes offer best-in-class signal integrity performance with capacitance as low as 0.3pF. 

These AEC-Q101 automotive-qualified devices exhibit deep snapback behaviour combined with a low resistance of 0.27 Ohm, for system level robustness and clamping performance in high speed data interfaces, said Nexperia.

Nexperia produces semiconductors: diodes, bipolar transistors, ESD protection devices, MOSFETs, GaN FETs and analogue and logic ICs. 

Headquartered in Nijmegen, the Netherlands, Nexperia meets the stringent standards set by the automotive industry. The company has employees across Asia, Europe and the USA. 

Nexperia is a subsidiary of Wingtech Technology and has an extensive IP portfolio and is certified to IATF 16949, ISO 9001, ISO 14001 and ISO 45001.

http://www.nexperia.com

The AP72250 synchronous boost converter has been designed by Diodes for step-up conversion in consumer and industrial applications where small form factors are a priority. Target applications include battery-powered devices, USB power supply units, power banks, supercapacitor charging equipment and metering systems.

The AP72250 supports a 900kHz switching frequency with a 20 microA quiescent current (IQ). It covers a wide input voltage range between 0.6 and 5.5V, with a minimum 1.0V input start up. The output range is 1.7 to 5.5V. The device integrates  a 20 mOhm high side power MOSFET and a 26 mOhm low side power MOSFET.

Different operating modes can be selected and can be programmed according to users’ needs. Operating mode options are pulse frequency modulation (PFM), ultra-sonic mode (USM) and forced pulse width modulation (FPWM) mode. Engineers can therefore adjust operation under either heavy or light load conditions to maximise efficiency. According to Diodes, even when in light load situations, up to 89 per cent efficiency can be attained. The USM mode ensures that switching in the audible frequency range is prevented.

The AP72250 is claimed to deliver a seamless transition between boost and pass-through operation (in applications where this is required). The peak current mode control scheme allows it to handle a variety of input-to-output ratios. As a result, fewer external components are needed to support it than required by competing devices, said Diodes.

Under-voltage lockout, thermal shutdown, peak current limit, negative current limit, and output short circuit protection functions are also included.

The AP72250 is supplied in a WLCSP-12 package (measuring 1.75 x 1.35 x 0.45mm) and is available now.

Diodes provides semiconductors for companies in the consumer electronics, computing, communications, industrial, and automotive markets. Its portfolio includes discrete, analogue and mixed-signal products and packaging technology to meet customers’ needs. There are 32 sites worldwide, including engineering, testing, manufacturing, and customer service.

http://www.diodes.com

The NAC1080 is a programmable 32-bit Arm Cortex-M0 microcontroller (MCU) with embedded near field communication (NFC). The single chip from Infineon has an integrated H-bridge and is intended to support engineers in the development of smart actuators, such as passive locks.

Using the NFC interface, the NAC1080 MCU enables devices to be controlled directly by smartphones. Advanced local and cloud functions can be extended within the mobile app offered by regional marketing partners. This reduces the bill of material and supports miniaturised product design, advised Infineon. NAC1080 supports various operation modes and can be powered either in passive mode by the NFC field with the energy harvested from the mobile phone, or through a battery supply in active mode. 

NAC1080 also provides an integrated AES128 accelerator and a true random number generator to enable data encryption/de-encryption in a low power environment.

The NAC1080 can also be used as an emergency back up power supply. Typical active lock systems depend on battery power but using the NAC1080, if the battery is discharged, the NFC interface IC for electronic devices can power the door lock. It should be noted that because electric power is transmitted via NFC, this use case may take longer than it does in passive mode, Infineon pointed out.

The company is already working with IH Tech and FIoT-Open Lab to offer complete smart NFC locks based on the NAC1080 combining IC products, application development, IoT device testing, certification and standardisation. This collaboration enables the three companies to support local customers to accelerate the system development cycle and foster the ecosystem development together.

IH Technology is a subsidiary of Contel Technology based in Hong Kong. It provides ICs and services to support customers on mass production level designs. This includes NFC antenna, circuit hardware, application software and APPs in handheld devices for both embedded module or stand-alone system. 

FIoT-Open Lab is based in Fuzhou China, enabling new “Smart+” technologies, especially for IoT, big data and artificial intelligence. It offers full suite expertise in technology development, total solution from chip design/packaging to end-application, IoT devices testing certification and setting industry standards. 

http://www.infineon.com