ICs & Semiconductors

SiC based modules increase range, with faster charging for EVs

Thu, Sep 29, 2022

Automotive silicon-carbide (SiC) -based power modules, the AMP32 series, have been developed by onsemi for on-board chargers. The modules, claimed the company, enable faster charging and increased range for all types of electrical vehicles.

The three APM32 SiC-based power modules feature transfer moulded technology and are intended for use in on-board charging and high voltage (HV) DC/DC conversion in all types of electric vehicles (xEV). The modules are specifically designed for high-power 11 to 22kW on-board chargers.

Each module exhibits low conduction and switching losses, said onsemi, “best in class thermal resistance” and high voltage isolation to deal with 800V bus voltage. The enhanced efficiency and lower heat generation allow one OBC to charge the EV faster and increase its operating range, claimed the company.

The modules allow designers to meet charging efficiency and space goals, said onsemi. “By adopting the pre-configured modular format, designers are able to configure their designs faster, with significantly lower time to market and design risk,” said Fabio Necco, vice president and general manager, automotive power solutions at onsemi.

Each APM32 module is serialised for full traceability. The modules can operate with junction temperatures (Tj) up to 175°C, for reliable operation even in challenging, space-constrained automotive applications.

Two modules, the NVXK2TR40WXT and NVXK2TR80WDT, are configured in H-bridge topology with a breakdown (V(BR)DSS) capability of 1200V, ensuring suitability for high voltage battery stacks. They are designed to be used in the OBC and HV DC/DC conversion stages. The third module, the NVXK2KR80WDT, is configured in Vienna rectifier topology and used in the power factor correction (PFC) stage of the OBC. 

All three modules are housed in a compact dual inline package (DIP), which is claimed to ensure low module resistance. The top cool and isolated features meet stringent automotive industry standards, the creepage and clearance distances meet IEC 60664-1 and IEC 60950-1. Additionally, the modules are qualified to AEC-Q101 and AQG 324.

The company also announced that it will introduce a six-pack and full-bridge modules. 

http://www.onsemi.com

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Multi-pixel driver supports CAN FD Light for automotive lighting

Thu, Sep 29, 2022

Linear current regulators from STMicroelectronics provide dynamic automotive lighting control using the CAN FD Light protocol. The driver is intended for use with OLED lamps for bright, homogeneous and high contrast lighting from a small surface area.

The L99LDLH32 has 32 regulated current sources, independently programmable from 1.0 to 15mA. The regulator can drive individual pixels in external and interior lighting applications. Global dimming is also provided, with eight-bit resolution. The driver is powered at the vehicle battery voltage and produces outputs of up to 35V to cover a wide emitter forward voltage spread.

The integrated CAN FD Light protocol handler and transceiver simplify connection to the vehicle’s communication infrastructure and controlling domain ECU (electronic control unit). CAN FD Light’s synchronised commander / responder communication is engineered for controlling simple devices such as lights and sensors. According to ST, this saves costly external components such as timing crystals. 

The data bandwidth of 1Mbit per second enables designers to create complex animated light patterns and permits smoothly modulated transitions and dimming.

On-chip memory cells allow programming of parameters, such as current level and PWM dimming for standalone operation, to provide a failsafe mode in the event of the communication bus or controller malfunction. 

The L99LDLH32’s features for functional safety include a fault-status pin, voltage and temperature monitors, a programmable timeout watchdog, short-circuit and open-load detection. In addition, frequency dithering minimises electromagnetic emissions.

Consequently, target applications include safety critical lighting such as taillights, stoplights, and turn indicators. 

The driver is monolithically integrated using ST’s BCD9sL process. It is AEC-Q100 qualified and packaged in a 7.0 x 7.0mm QFN48 device with wettable flanks and an exposed thermal pad to aid dissipation

http://www.st.com

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32-bit MCU offers functional safety, cybersecurity and AutoSAR compatibility

Fri, Sep 16, 2022

To support developers’ work to automate and connect end applications, Microchip has introduced the PIC32CM JH microcontroller. The 512kbyte flash, 5.0V, Dual CAN FD device delivers features typically only available on more expensive, higher performance devices, said Microchip. 

Automation and connectivity rely on industry standards related to functional safety and cybersecurity protection to ensure products operate safely and securely. To provide manufacturers with an MCU equipped with components that meet ISO 26262 functional safety and ISO/SAE 21434 cybersecurity engineering standards, the PIC32CM JH is the industry’s first MCU-based on the Arm Cortex-M0+ architecture with AutoSAR support, memory built-in self test (MBIST) and secure boot.

The PIC32CM JH is compatible with AutoSAR, an open software architecture, providing suppliers with the ability to change to lower-level hardware while keeping the original application code for ease of migration. AutoSAR-ready is designed to streamline the development process and reduce overall costs. When using AutoSAR, Microchip offers ASIL B microcontroller abstraction layers (MCALs) for functional safety applications, providing the lower-level hardware interface to the MCU. 

Automotive industry OEMs require both functional safety and cybersecurity protection for many in-vehicle applications including touch buttons and touch wheels, door controls and console controls, and body applications such as advanced driver assistance systems (ADAS). Pairing the PIC32CM JH with one of Microchip’s Trust Anchor TA100 CryptoAutomotive security ICs, complies to ISO/SAE 21434, the new Cybersecurity standard for automotive. The TA100 employs secure hardware-based cryptographic key storage and cryptographic counter measures to eliminate potential back doors linked to software weaknesses. 

Rod Drake vice president of Microchip Technology’s 32-bit MCU business unit, commented: “OEMs and other manufacturers now have the option to use an entry-level Arm Cortex-M0+ based MCU to meet compliance requirements previously only available on higher-end MCUs.”

The secure boot authenticates the code and prevents malicious code from being loaded onto the MCU. Other hardware features on the PIC32CM JH MCU are error correction code (ECC) with fault injection, loopbacks on the communications interfaces, system memory protection unit and MBIST. 

MBIST is the industry standard method of testing embedded memories and can quickly test the integrity of the SRAM to ensure it is functioning properly before the code is run to mitigate failures. To support developers with implementation, the PIC32CM JH has a safety manual, failure modes effects and diagnostic analysis (FMEDA) and diagnostic code targeting to ISO 26262 ASIL B. 

The PIC32CM JH also includes advanced touch with Driven Shield Plus, for noise and water tolerant operation. This feature is necessary for home appliances, industrial and automotive applications requiring touch operation in harsh environments.

Microchip also provides the PIC32CM JH01 Curiosity Pro development kit (Part number EV81X90A) to support the PIC32CM JH MCU.

The PIC32CM JH MCU and EV81X90A are available now.

http://www.microchip.com

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5G front end modules help improve 5G call quality and internet speed

Thu, Sep 15, 2022

Front end modules and pre-drivers developed by NXP are claimed to improve 5G network coverage and quality. The BTS7202 RX front end modules and BTS6403 / BTS6305 pre-drivers offer high output power, improved linearity and reduced noise.

The RX front end modules (FEM) and BTS6403 / BTS6305 pre-drivers for 5G MIMO (massive multiple-input multiple-output) going up to 20W per channel. The devices were developed and implemented in NXP’s SiGe (silicon germanium) process. They operate with modest current consumption, said NXP, designed to reduce operational costs for mobile network operators (MNOs). They are also claimed to offer improved linearity and reduced noise figure to support better 5G signal quality. 

The BTS7202 RX FEMs and BTS6403/6305 pre-drivers complement NXP’s power amplifier solutions for 32T32R radios. The BTS7202 RX FEMs feature a switch capable of handling up to 20W of power leaking from transmit line-ups, reducing system complexity. The BTS6305 pre-drivers also integrate a balun to reduce costs. 

As 5G networks are adopted, MNOs are increasingly leveraging 32T32R solutions to improve massive MIMO coverage in less dense urban and suburban areas. Utilising 32T32R solutions requires using higher power devices that increase the power level per channel in order to achieve the total power required to ensure strong coverage of the 5G signal. 

Doeco Terpstra, vice president and general manager, smart antenna solutions, radio power, NXP, said: “Our customers recognise that higher power solution offers a way for network operators to address the power needs of 32-antenna solutions without compromising network quality.”

NXP Semiconductors specialises in secure connectivity solutions for embedded applications, in the automotive, industrial and IoT, mobile, and communication infrastructure markets. 

http://www.nxp.com

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