ICs & Semiconductors Archives - Page 93 of 230

3D magnetic resolver IC is smallest available, claims Melexis

Mon, Jul 04, 2022

For industrial and automotive applications, the MLX90381 AEC-Q100 / ISO 26262 -compliant pico-resolver is supplied in a DFN-6 package, measuring just 2.0 x 2.5mm. Only three external capacitors are required to complete the circuit.

The ASIL-ready IC is programmable at module level and enables sensored mechatronic miniaturisation, particularly in rotor position detection, said the company. Being AEC-Q100 and ISO 26262 compliant (ASIL B SEooC), also makes it suitable for automotive safety related systems.

The 3D magnetic pico-resolver has a small outline and analogue outputs providing sine and cosine signals. It uses Melexis’ Triaxis Hall technology and can be used for absolute rotary position sensing where its low latency and fast response characteristics are able to measure rotational speeds of more than 50,000 rpm.

The MLX90381 pico-resolver can be used with DC, brushless DC (BLDC) and permanent magnet synchronous motors (PMSM) in applications such as e-valves and e-bike motors.

The MLX90381 can be combined with Melexis’ family of smart embedded LIN drivers. These include the MLX81330 and MLX81332 (up to 10W) for directly driving flaps, valves and single-coil fans and pumps. It also works with the MLX81340, MLX81344 and MLX81346 pre-drivers (up to 2000W) which are incorporated into power blowers, engine cooling fans, pumps, window lifters, seat adjusters and sunroofs.

The selectable magnetic field axes (X/Y, X/Z and Z/Y) enable the MLX90381 to handle on-axis position sensing as well as off-axis through-shaft sensing. The sensitivity and filter bandwidth of each axis can be programmed directly through the device’s I2C interface. A dedicated high sensitivity version of the pico-resolver allows additional robustness against external magnetic stray fields.

The MLX90381 is available for order now.

Melexis designs, develops and delivers mixed-signal semiconductor sensor and actuator components addressing the integration of sensing, driving and communication into products and systems that improve safety, raise efficiency, support sustainability and enhance comfort.

Melexis specialises in automotive semiconductor sensors. Today, on average, every new car produced worldwide contains 13 Melexis chips, according to the company. The portfolio includes magnetic sensors, MEMS sensors (pressure, TPMS, infrared), sensor interface ICs, optoelectronic single point and linear array sensors and time of flight (ToF). The company’s driver IC portfolio incorporates advanced DC and BLDC motor controllers, LED drivers and FET pre-driver ICs.

Melexis is headquartered in Belgium.

http://www.melexis.com

> Read More

Tensilica DSP IP cores target radar and lidar

Mon, Jul 04, 2022

Two IP cores have been added to the Tensilica ConnX family of DSPs by Cadence. Intended for embedded processing in automotive, consumer and industrial markets, the ConnX 110 and ConnX 120 DSPs’ architecture is optimised for small memory footprint and low-power signal processing. The ConnX 110 and ConnX 120 DSPs share a common instruction set architecture (ISA) with the ConnX B10 and B20 DSPs preserving software compatibility for easy migration.

The 128-bit ConnX 110 DSP and 256-bit ConnX 120 DSP feature an N-way programming model an, like the rest of the Tensilica DSP portfolio, support the Tensilica Instruction Extension (TIE) language, which allows customers to tailor the instruction set, add specialised data types, and implement tightly integrated interfaces between the DSP and external logic.

The new DSPs are supported by a comprehensive set of complex math library functions in the NatureDSP, Eigen and Radar libraries. As with all existing ConnX DSPs, they are automotive-ready with full ISO 26262 compliance to ASIL-D with FlexLock or to ASIL-B.

The Tensilica ConnX 110 and 120 DSPs have an optimised instruction set for radar, lidar and communications applications. They also feature optional acceleration operations for linear-feedback shift, convolutional encoding, single peak search and dual peak search. The 128-bit (ConnX 110) and 256-bit (ConnX 120) SIMD are suitable for complex math operations based on eight-, 16- and 32-bit fixed-point and half-, standard- and double-precision floating-point.

The ConnX 120 additionally offers Viterbi and Turbo decoders.
NXP uses Cadence Tensilica DSP cores for its ADAS (advanced driver assistance system) product offerings, said Robert Dunnigan, director program management ADAS at NXP Semiconductors.

Another customer, indie Semiconductor develops multiple sensor modalities “in the pursuit of the uncrashable car”. Lionel Federspiel, executive vice president of engineering for indie Semiconductor, commented: “Cadence’s Tensilica ConnX processor family in conjunction with indie’s architecture is ideally suited to implement unique design solutions with high performance, low power, and gate count optimisation. As a pure-play automotive solutions innovator, quality and reliability are essential to the success of our products.”

“Radar and communications processing trends require solutions that perform more processing in less time,” explained David Glasco, vice president of research and development for Tensilica IP at Cadence. “Automotive radar demands multi-antenna, high-resolution systems with rapid response. Similarly, 5G wireless communications requires much higher data rates and lower latencies than previous generations. The Tensilica ConnX 110 and ConnX 120 DSPs meet these demands by extending the already-efficient processing capability of the ConnX DSPs and enhancing them with even more fixed- and floating-point complex data processing capacity at low power and area.”

http://www.cadence.com

> Read More

ToF module perceives 3D space in high resolution

Thu, Jun 30, 2022

Believed to be the industry’s first high resolution, industrial quality, indirect time-of-flight (iToF) module for 3D depth sensing and vision systems, the ADTF3175 has been announced by Analog Devices.

It enables cameras and sensors to perceive 3D space in 1Mpixel resolution for accurate (+/-3mm) iToF technology. It is suitable for use in a range of machine vision applications ranging from industrial automation to logistics, healthcare and augmented reality.

The ADTF3175 offers designers a scalable, fully engineered and calibrated depth system that can be integrated into 3D sensing and vision systems, eliminating the need to design specialised optics or address electromechanical integration challenges. It accelerates time to market by simplifying the complex sensor design process, said Analog Devices. The robust, high resolution module is specifically designed to perform in a range of environmental settings. It uses triple junction vertical cavity surface emitting laser (VCSEL) technology from Lumentum Operations to enable sensing in a wide range of lighting conditions.

“We are thrilled to work with ADI on solutions for the industry’s most demanding and highest resolution 3D sensing applications, ranging from extended reality to industrial applications like robotics, intelligent buildings, and logistics systems,” said Téa Williams, senior vice president and general manager of 3D sensing at Lumentum. The company provides VCSEL arrays for light detection and ranging (lidar) and 3D sensing applications, to enable sensing in a range of lighting conditions. “Our 10W VCSEL arrays allow ADI to enable more capable sensing and vision systems that can operate under a wide range of lighting conditions and thereby removing environmental obstacles to broader and more rapid machine vision deployment,” Williams added.

The ADTF3175 features an infra red illumination source with optics, laser diode and driver, and a receiver path with a lens and an optical band-pass filter. The module also includes flash memory for calibration and firmware storage with power regulators to generate local supply voltages. It is supplied pre-programmed and offers operating modes optimised for long and short range, said Analog Devices.

“Machine vision needs to make the leap to perceiving smaller, more subtle objects faster in industrial environments that often include harsh conditions and multiple stimuli,” explained Tony Zarola, senior director for ToF at Analog Devices. “The ADTF3175’s . . . . resolution and accuracy allows vision and sensing systems – including industrial robots – to take on more precision-oriented tasks by enabling them to better understand the space they’re operating in and ultimately improve productivity“. The module is expected to accelerate the deployment of next generation automation and critical logistics systems, he added.

Analog Devices also offers an accompanying open source design for the ADTF3175 module. It includes all of the required drivers and access to ADI’s depth processing capabilities. ADI also offers guidance on how to achieve Class One eye safety certification for the end product.

The module measures 42 x 31 x 15.1mm.

http://www.analog.com

> Read More

Bluetooth soC pinpoints movement and location

Wed, Jun 29, 2022

Enhanced positioning capabilities in the BlueNRG-LPS SoC, claimed STMicroelectronics. This third-generation Bluetooth SoC has Bluetooth direction finding technology for location-tracking and real-time positioning applications.

By determining the direction of a Bluetooth Low Energy signal, the Bluetooth 5.3 certified BlueNRG-LPS SoC can precisely estimate movement and location with centimetre accuracy. It uses Bluetooth-specified technology including both angle-of-arrival (AoA) and angle-of-departure (AoD), as computed from signals captured by an antenna array. The SoC now enables a wide variety of applications that require indoor navigation, geo-fencing, and asset tracking, as well as real-time location finding for tools, assets, and goods.

With its streamlined architecture and I/O peripherals, and program and data memories (192kbyte eFlash and 24kbyte SRAM, respectively) sized for lightweight end products, the BlueNRG-LPS is intended for cost-sensitive and high volume applications, such as general purpose wireless sensors, medical appliances, keyless -entry systems, remote controls, and smart remote metering. The integrated high efficiency step-down converter and protection circuitry, also contribute to simplifying the SoC and reducing the required bill of materials (BoM) and allows for a much cheaper two-layer PCB design, said ST.

The architecture supports the latest Bluetooth LE Power Control specification, which enables fine-tuning of RF output power in 1dBm increments, and up to +8dBm, to permit longer battery runtime. Bluetooth Path-Loss Monitoring enhances radio link quality and prevents interference, ensuring robust connections for improved interaction between devices, even in crowded places, and faster response times. Support for Bluetooth 5.3 long range, 2Mbits per second high speed data rate, periodic advertising, simultaneous connection and multi-role specifications also ensure superior user experiences with equipment powered by BlueNRG-LPS. There are also dedicated hardware functions and cryptographic IPs to support enhanced security.

The STEVAL-IDB012V1 tool is available to support evaluation and development for the BlueNRG-LPS.

The BlueNRG-LPS SoC is in production now and available in a 5.0 x 5.0mm 32-pin QFN32 package.

http://www.st.com

> Read More

3D magnetic resolver IC is smallest available, claims Melexis

Tensilica DSP IP cores target radar and lidar

ToF module perceives 3D space in high resolution

Bluetooth soC pinpoints movement and location

About Smart Cities